Provided is a method of manufacturing an aromatic polycarbonate resin composition with high fluidity, particularly during low shear, and a good color. An aromatic polycarbonate resin composition including: an aromatic polycarbonate resin that has a structural unit expressed by general formula (1); a aliphatic cyclic carbonate that is expressed by general formula (2) and is included at a ratio of 10 ppm-10,000 ppm; an aromatic cyclic carbonate that is expressed by general formula (3); and at least one compound selected from the group consisting of compounds expressed by general formulas (4)-(6), wherein the total content of the aromatic cyclic carbonate and the compound(s) expressed by general formula(s) (4)-(6) is 0.1 mass %-2.0 mass % by bisphenol A-converted value.

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Photoresist compositions improving the quality of a photoresist pattern, methods for forming a pattern using the same, and methods for fabricating a semiconductor device using the same are provided. The photoresist composition includes a photosensitive resin, a photoacid generator, a photoacid-labile additive comprising a structure of Formula 1-1, and optionally a solvent:

Ar.sup.2—Y-PG.sup.2  [Formula 1-1] wherein Ar.sup.1 is a substituted or unsubstituted aromatic ring, Y is an ester group, an oxycarbonyl group, an acetal group, an amide group, or a thioester group, and PG.sup.2 is a substituted or unsubstituted secondary alkyl group, a substituted or unsubstituted tertiary alkyl group, a substituted or unsubstituted alkoxyalkyl group, a substituted or unsubstituted alkoxy group, or a substituted or unsubstituted alkyloxycarbonyl group.

Photoresist compositions improving the quality of a photoresist pattern, methods for forming a pattern using the same, and methods for fabricating a semiconductor device using the same are provided. The photoresist composition includes a photosensitive resin, a photoacid generator, a photoacid-labile additive comprising a structure of Formula 1-1, and optionally a solvent:

Ar.sup.2—Y-PG.sup.2  [Formula 1-1] wherein Ar.sup.1 is a substituted or unsubstituted aromatic ring, Y is an ester group, an oxycarbonyl group, an acetal group, an amide group, or a thioester group, and PG.sup.2 is a substituted or unsubstituted secondary alkyl group, a substituted or unsubstituted tertiary alkyl group, a substituted or unsubstituted alkoxyalkyl group, a substituted or unsubstituted alkoxy group, or a substituted or unsubstituted alkyloxycarbonyl group.

Photoresist compositions improving the quality of a photoresist pattern, methods for forming a pattern using the same, and methods for fabricating a semiconductor device using the same are provided. The photoresist composition includes a photosensitive resin, a photoacid generator, a photoacid-labile additive comprising a structure of Formula 1-1, and optionally a solvent:

Ar.sup.2—Y-PG.sup.2  [Formula 1-1] wherein Ar.sup.1 is a substituted or unsubstituted aromatic ring, Y is an ester group, an oxycarbonyl group, an acetal group, an amide group, or a thioester group, and PG.sup.2 is a substituted or unsubstituted secondary alkyl group, a substituted or unsubstituted tertiary alkyl group, a substituted or unsubstituted alkoxyalkyl group, a substituted or unsubstituted alkoxy group, or a substituted or unsubstituted alkyloxycarbonyl group.

A foam composition comprises a recycled polyvinyl butyral in an amount from 5 wt % to 70 wt %; an ethylene-ester copolymer in an amount from 10 wt % to 70 wt %; a foaming agent in an amount from 0.5 wt % to 3.5 wt %; a peroxide crosslinking agent in an amount from 0.5 wt % to 3.0 wt %; and a hydrazide crosslinking agent in an amount from 0.1 wt % to 2.5 wt %, based on a total weight of the foam composition. A foam produced from the foam composition can avoid emitting an unpleasant odor of aldehydes, and the foam also has good mechanical properties and good resilience.

A foam composition comprises a recycled polyvinyl butyral in an amount from 5 wt % to 70 wt %; an ethylene-ester copolymer in an amount from 10 wt % to 70 wt %; a foaming agent in an amount from 0.5 wt % to 3.5 wt %; a peroxide crosslinking agent in an amount from 0.5 wt % to 3.0 wt %; and a hydrazide crosslinking agent in an amount from 0.1 wt % to 2.5 wt %, based on a total weight of the foam composition. A foam produced from the foam composition can avoid emitting an unpleasant odor of aldehydes, and the foam also has good mechanical properties and good resilience.

A low-VOC, two-component polyurethane adhesive is provided. The polyurethane adhesive has an A-side that includes an isocyanate and a non-reactive plasticizer, and a B-side that includes an aliphatic polyester polyol, a non-polyester polyol, and a urethane catalyst. The A-side and the B-side are reacted at a volume ratio of 1:1 and formulated at an NCO/OH index within the range of 0.90 to 1.10. The polyurethane adhesive is solvent-free and is particularly suitable for adhering a polymeric membrane to a substrate.

A low-VOC, two-component polyurethane adhesive is provided. The polyurethane adhesive has an A-side that includes an isocyanate and a non-reactive plasticizer, and a B-side that includes an aliphatic polyester polyol, a non-polyester polyol, and a urethane catalyst. The A-side and the B-side are reacted at a volume ratio of 1:1 and formulated at an NCO/OH index within the range of 0.90 to 1.10. The polyurethane adhesive is solvent-free and is particularly suitable for adhering a polymeric membrane to a substrate.

An easily water-disintegrable adhesive composition contains a 2-cyanoacrylate compound and a water-soluble compound, and wherein a cured product of the adhesive composition has a water absorption rate of 5% or higher when immersed in 40° C. water for 24 hours. The cured product of the adhesive composition preferably has a water absorption rate of 5% or higher when immersed in 23° C. water for 24 hours.

An easily water-disintegrable adhesive composition contains a 2-cyanoacrylate compound and a water-soluble compound, and wherein a cured product of the adhesive composition has a water absorption rate of 5% or higher when immersed in 40° C. water for 24 hours. The cured product of the adhesive composition preferably has a water absorption rate of 5% or higher when immersed in 23° C. water for 24 hours.