The present invention pertains to a curable composition comprising (a) at least one ethylene polymer, (b) less than 2 parts by weight of at least one monoperoxycarbonate for 100 parts by weight of constituent (a), (c) from 0.4 to less than 4 part by weight of at least one t-alkyl hydroperoxide for 100 parts by weight of constituent (b). It is also directed to a method for preventing scorching of a curable composition comprising an ethylene polymer, by adding a specific amount of t-alkyl hydroperoxide thereto and to a method for manufacturing a scorch-protected material.

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.

In described embodiments, a highly visible epoxy compound having photoluminescent and traction properties is provided. The compound includes between about 10% and about 25% by weight photoluminescent material having granular size between about 50 microns and about 250 microns.

In described embodiments, a highly visible epoxy compound having photoluminescent and traction properties is provided. The compound includes between about 10% and about 25% by weight photoluminescent material having granular size between about 50 microns and about 250 microns.

A low-VOC, two-component polyurethane adhesive is provided. The polyurethane adhesive has an A-side that includes an isocyanate and a non-reactive plasticizer, and a B-side that includes an aliphatic polyester polyol, a non-polyester polyol, and a urethane catalyst. The A-side and the B-side are reacted at a volume ratio of 1:1 and formulated at an NCO/OH index within the range of 0.90 to 1.10. The polyurethane adhesive is solvent-free and is particularly suitable for adhering a polymeric membrane to a substrate.

A low-VOC, two-component polyurethane adhesive is provided. The polyurethane adhesive has an A-side that includes an isocyanate and a non-reactive plasticizer, and a B-side that includes an aliphatic polyester polyol, a non-polyester polyol, and a urethane catalyst. The A-side and the B-side are reacted at a volume ratio of 1:1 and formulated at an NCO/OH index within the range of 0.90 to 1.10. The polyurethane adhesive is solvent-free and is particularly suitable for adhering a polymeric membrane to a substrate.

The present invention provides a resin composition having a high level of processability, which is a resin composition including a saponified ethylene-vinyl ester-based copolymer (A), a layered inorganic compound (B), and a carbonic acid salt (C) (provided that the carbonic acid salt (C) excludes the layered inorganic compound (B)).

The present invention relates to a method for producing water-absorbent resin particles, the method including crosslinking a polymer by a surface crosslinking agent by reacting the polymer with the surface crosslinking agent in a mixture of a powder of polymer particles containing the polymer and a crosslinking agent solution containing the surface crosslinking agent and water, in which the surface crosslinking agent includes an alkylene carbonate, a use amount (mass) of the surface crosslinking agent is 0.00110 or less with respect to a mass of 1 of a total amount of solid contents of the polymer particles, and a content (mass) of the alkylene carbonate is 0.009 or more and 0.027 or less with respect to a mass of 1 of water in the crosslinking agent solution.