A curing agent component is useful for a multicomponent epoxide resin composition. An epoxide resin composition produced using the curing agent component, wherein the curing agent component includes, as a curing agent, at least one Mannich base and an amine that is reactive with respect to epoxide groups, as well as at least one polyphenol from the group of novolac resins as an accelerant. The Mannich base can he obtained by reacting a phenolic compound selected from phenol, styrenated phenol, catechol, resorcinol, hydroquinone, hydroxyhydroquinone, phloroglucinol, pyrogallol, o-cresol, m-cresol, p-cresol and bisphenols, with an aldehyde or an aldehyde precursor and an amine having at least two active hydrogen atoms in the molecule which are bonded to a nitrogen atom. The novolac resin is contained in the curing agent component in a proportion of 5-30 wt. %, based on the organic proportions of the curing agent component.

The present invention relates to a primer composition that achieves excellent adhesion to poorly adhesive materials. Specifically, the present invention relates to a primer composition that includes (A) benzophenone, (B) a compound that has at least 2 benzene rings and a molecular weight of at least 190, and (C) a solvent.

Stabilizer compositions having a stabilizing amount of at least one co-active agent; an ultraviolet light absorber chosen from an ortho-hydroxy benzophenone, and/or an ortho-hydroxyphenyl benzotriazole; and a hindered amine light stabilizer, are provided herein, along with masterbatch concentrates containing same, and processes for using same for stabilizing polymeric organic materials to protect against light and thermal degradation due to exposure to UV irradiation.

Stabilizer compositions having a stabilizing amount of at least one co-active agent; an ultraviolet light absorber chosen from an ortho-hydroxy benzophenone, and/or an ortho-hydroxyphenyl benzotriazole; and a hindered amine light stabilizer, are provided herein, along with masterbatch concentrates containing same, and processes for using same for stabilizing polymeric organic materials to protect against light and thermal degradation due to exposure to UV irradiation.

A protective film forming agent that, in dicing of a semiconductor wafer, is used to form a protective film on the surface of the semiconductor wafer, can form a protective film that has excellent laser processability, and has excellent solubility of a light-absorbing agent; and a method for producing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light-absorbing agent, a basic compound, and a solvent. The basic compound is an alkylamine, an alkanolamine, an imidazole compound, ammonia, or an alkali metal hydroxide. The light-absorbing agent content of the protective film forming agent is 0.1-10 mass % (inclusive).

A stabilizer mixture comprising a sterically hindered amine light stabilizer, a triazine UV absorber and a benzophenone UV absorber.

A stabilizer mixture comprising a sterically hindered amine light stabilizer, a triazine UV absorber and a benzophenone UV absorber.

A transparent thermoplastic resin composition containing: based on 100 parts by mass of the transparent thermoplastic resin composition, 10 to 60 parts by mass of a graft copolymer (A) obtained by graft copolymerizing a monomer mixture (a) containing at least an aromatic vinyl-based monomer (a1) and a (meth)acrylic acid ester-based monomer (a2) in the presence of a rubbery polymer (R); 40 to 90 parts by mass of a vinyl copolymer (B) obtained by copolymerizing a monomer mixture (b) containing at least an aromatic vinyl-based monomer (b1) and a (meth)acrylic acid ester-based monomer (b2); 100 to 1,000 ppm of a phenolic compound (C); and a dihydrooxaphosphaphenanthrene-based phosphorus compound (D), wherein a molar ratio (P/OH) of a phosphorus atom (P) of the dihydrooxaphosphaphenanthrene-based phosphorus compound (D) to a hydroxyl group (OH) of the phenolic compound (C) is 0.2 to 5.0.

A transparent thermoplastic resin composition containing: based on 100 parts by mass of the transparent thermoplastic resin composition, 10 to 60 parts by mass of a graft copolymer (A) obtained by graft copolymerizing a monomer mixture (a) containing at least an aromatic vinyl-based monomer (a1) and a (meth)acrylic acid ester-based monomer (a2) in the presence of a rubbery polymer (R); 40 to 90 parts by mass of a vinyl copolymer (B) obtained by copolymerizing a monomer mixture (b) containing at least an aromatic vinyl-based monomer (b1) and a (meth)acrylic acid ester-based monomer (b2); 100 to 1,000 ppm of a phenolic compound (C); and a dihydrooxaphosphaphenanthrene-based phosphorus compound (D), wherein a molar ratio (P/OH) of a phosphorus atom (P) of the dihydrooxaphosphaphenanthrene-based phosphorus compound (D) to a hydroxyl group (OH) of the phenolic compound (C) is 0.2 to 5.0.

Provided is a thermoforming laminate, etc., having good thermoforming properties as well as excellent chemical resistance and abrasion resistance. Examples of solutions to the problem include a thermoformable laminate, including: (a) a substrate layer containing a thermoplastic resin; (b) a post-cure type hard coat layer containing an active-energy-ray-curable resin having a (meth)acryloyl group, the hard coat layer also containing a polymerization inhibitor; and (c) a protective film, wherein: (a) the substrate layer, (b) the hard coat layer, and (c) the protective film are layered in this order; and the polymerization inhibitor includes at least one among a quinone-based compound, a sulfur-containing compound, and a nitrogen-containing compound.