Provided are a flame retardant composition for expandable styrene resin with which an extrusion-foamed molded article having excellent flame retardancy and excellent heat resistance can be produced; a styrene-based resin composition; and an extrusion-foamed molded article of the styrene-based resin composition. The flame retardant composition for expandable styrene resin of the present invention comprises at least B1) tetrabromobisphenol A-bis(2,3-dibromo-2-methylpropyl ether), (C) a zinc-modified hydrotalcite, and (D) a phosphoric acid ester-based compound, the component (B1) being contained in an amount of 10 to 98 mass % based on the total amount of the component (B1) and the component (D).

A curable epoxy composition suitable for surface application, comprising one or more epoxy resin(s); 2,4,6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.

A liquid crystal polyester resin comprising 42 to 80 mol % of structural unit (I) relative to 100 mol % of the total structural unit of the liquid crystal polyester resin, and ΔS (entropy of melting) defined by equation [1] is 0.01×10.sup.−3 to 2.7×10.sup.−3 J/g.Math.K:

ΔS(J/g.Math.K)=ΔHm(J/g)/Tm(K)  [1]

wherein Tm is an endothermic peak temperature determined by: after observation of an endothermic peak temperature (Tm.sub.1) observed when heating a liquid crystal polyester under temperature rising conditions of 20° C./minute from room temperature in differential scanning calorimetry, the liquid crystal polyester was maintained at a temperature of Tm.sub.1+20° C. for 5 minutes, followed by observation of the endothermic peak temperature observed when the temperature has fallen to room temperature under temperature falling conditions of 20° C./minute and then raised under temperature rising conditions of 20° C./minute, and ΔHm is an endothermic peak area of Tm:

##STR00001##

The present application relates to a field of a flame retardant polystyrene, and specifically discloses a preparation method for a flame retardant polystyrene. The preparation method for a flame retardant polystyrene includes the following steps: predissolving a brominated flame retardant containing a first active functional group in a reaction system of a styrene monomer to form a homogeneous solution; then, performing an end capping reaction by an olefin monomer containing a second active functional group to introduce a double bond at an end of the brominated flame retardant, so that it can be bonded to a polystyrene molecular chain by copolymerizing; performing a prepolymerization in a reactor to obtain a prepolymer; performing a post polymerization in the reactor or by extruding, to obtain a special material or a flame retardant masterbatch of the flame retardant polystyrene.

The present application relates to a field of a flame retardant polystyrene, and specifically discloses a preparation method for a flame retardant polystyrene. The preparation method for a flame retardant polystyrene includes the following steps: predissolving a brominated flame retardant containing a first active functional group in a reaction system of a styrene monomer to form a homogeneous solution; then, performing an end capping reaction by an olefin monomer containing a second active functional group to introduce a double bond at an end of the brominated flame retardant, so that it can be bonded to a polystyrene molecular chain by copolymerizing; performing a prepolymerization in a reactor to obtain a prepolymer; performing a post polymerization in the reactor or by extruding, to obtain a special material or a flame retardant masterbatch of the flame retardant polystyrene.

An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: ##STR00001##

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

##STR00001##

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

##STR00001##

The invention relates to a powdery composition for use in the layer by layer manufacturing of three-dimensional molded bodies. The composition comprises at least one powder made of an aliphatic thermoplastic polyurethane (TPU) and is characterized in that the TPU powder has a melting temperature of less than 135° C. and a melting viscosity at 150° C. of at most 800 Pa.Math.s.

The invention relates to a powdery composition for use in the layer by layer manufacturing of three-dimensional molded bodies. The composition comprises at least one powder made of an aliphatic thermoplastic polyurethane (TPU) and is characterized in that the TPU powder has a melting temperature of less than 135° C. and a melting viscosity at 150° C. of at most 800 Pa.Math.s.