A resin composition contains: a cellulose acylate (A); at least one ester compound (B) represented by any one of the General Formulae (1) to (5); and at least one of a plasticizer (C) and a thermoplastic elastomer (D)

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A resin composition contains: a cellulose acylate (A); at least one ester compound (B) represented by any one of the General Formulae (1) to (5); and at least one of a plasticizer (C) and a thermoplastic elastomer (D)

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Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

A polyacrylate random copolymer is synthesized from acrylic acid (AA), butyl acrylate (BA), methyl methacrylate (MMA), and 2-ethylhexyl acrylate (EHA). The copolymer is suitable for workup into a water emulsion and may be applied to a surface in liquid form, quickly drying to yield a peelable protective barrier film.

A polyacrylate random copolymer is synthesized from acrylic acid (AA), butyl acrylate (BA), methyl methacrylate (MMA), and 2-ethylhexyl acrylate (EHA). The copolymer is suitable for workup into a water emulsion and may be applied to a surface in liquid form, quickly drying to yield a peelable protective barrier film.

The present invention provides a method for preparing a vinyl chloride-based polymer comprising performing suspension polymerization of vinyl chloride-based monomer, wherein an aromatic hydrocarbon-based compound is added when a pressure change is 0.5 to 1.5 kg/cm.sup.2 with respect to an equilibrium pressure at a polymerization temperature in a polymerization reactor after the vinyl chloride-based monomer is added to the polymerization reactor, wherein the aromatic hydrocarbon-based compound comprises a reactive functional group having an intracarbon double bond and a hydroxyl group; and a vinyl chloride-based polymer prepared by the method and having a high polymerization degree and excellent fusion processability.

The present invention provides a method for preparing a vinyl chloride-based polymer comprising performing suspension polymerization of vinyl chloride-based monomer, wherein an aromatic hydrocarbon-based compound is added when a pressure change is 0.5 to 1.5 kg/cm.sup.2 with respect to an equilibrium pressure at a polymerization temperature in a polymerization reactor after the vinyl chloride-based monomer is added to the polymerization reactor, wherein the aromatic hydrocarbon-based compound comprises a reactive functional group having an intracarbon double bond and a hydroxyl group; and a vinyl chloride-based polymer prepared by the method and having a high polymerization degree and excellent fusion processability.

A crosslinkable composition, a coating made therefrom, a process for producing a coating with reduced odor, and a method of reducing the odor of a coating.

The present invention provides a method for preparing a vinyl chloride-based polymer comprising performing suspension polymerization of vinyl chloride-based monomer, wherein an aromatic hydrocarbon-based compound is added when a pressure change is 0.5 to 1.5 kg/cm.sup.2 with respect to an equilibrium pressure at a polymerization temperature in a polymerization reactor after the vinyl chloride-based monomer is added to the polymerization reactor, wherein the aromatic hydrocarbon-based compound comprises a reactive functional group having an intracarbon double bond and a hydroxyl group; and a vinyl chloride-based polymer prepared by the method and having a high polymerization degree and excellent fusion processability.