To provide a disposable diaper enabling reduction in re-wet amount and having an excellent speed of incorporating liquid regardless of concentration and configuration of a water-absorbing agent in an absorbent material.

A water-absorbing agent having excellent Gel Capillary Absorption (GCA) and Free Gel Bed Permeability (FGBP) is obtained by crushing a crosslinked hydrogel polymer obtained in a polymerization step to have a specific weight average particle diameter while fluid retention capacity and a surface tension of a water-absorbing agent are adjusted in a specific range, drying the crushed crosslinked hydrogel polymer, and then adding a liquid permeability enhancer thereto during surface crosslinking or after surface crosslinking.

An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.

An adhesive composition comprising a polyurethane and a cationic polymeric dopant or a polymerizable cationic dopant may be used to form one or more adhesive layers of electro-optic assemblies. They enable improved electro-optic performance of the corresponding; electro-optic devices even at low temperatures.

A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: ##STR00001##
wherein R.sup.1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R.sup.4 and R.sup.5 independently denotes a methyl or ethyl group, R.sup.6 denotes a hydrophilic group, R.sup.7 denotes a hydrogen atom or a methyl group, Y.sup.1 denotes a single bond, —S—, —S(═O)—, —C(═O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: ##STR00001##
wherein R.sup.1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R.sup.4 and R.sup.5 independently denotes a methyl or ethyl group, R.sup.6 denotes a hydrophilic group, R.sup.7 denotes a hydrogen atom or a methyl group, Y.sup.1 denotes a single bond, —S—, —S(═O)—, —C(═O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

A charging member may include a surface layer. The surface layer may include a urethane resin, an electron conducting agent, an azo-based metal complex compound, and a quaternary ammonium salt.

Binder compositions and processes for making and using same. In some embodiments, the binder composition can include a urea-based compound, a bifunctional quaternary ammonium salt, and an aldehyde-based resin. In some embodiments, a resinated substrate can include a plurality of substrates and the binder composition. In some embodiments, a process for making a composite product can include contacting a plurality of substrates with the binder composition. The process can also include heating the resinated substrate to at least partially cure the aldehyde-based resin to produce the composite product. In some embodiments, a composite product can include the plurality of substrates and the aldehyde-based resin at least partially cured. In some embodiments, the plurality of substrates can include lignocellulosic substrates. In other embodiments, the plurality of substrates can include glass fibers.

Binder compositions and processes for making and using same. In some embodiments, the binder composition can include a urea-based compound, a bifunctional quaternary ammonium salt, and an aldehyde-based resin. In some embodiments, a resinated substrate can include a plurality of substrates and the binder composition. In some embodiments, a process for making a composite product can include contacting a plurality of substrates with the binder composition. The process can also include heating the resinated substrate to at least partially cure the aldehyde-based resin to produce the composite product. In some embodiments, a composite product can include the plurality of substrates and the aldehyde-based resin at least partially cured. In some embodiments, the plurality of substrates can include lignocellulosic substrates. In other embodiments, the plurality of substrates can include glass fibers.

Debonding methods comprise: providing a bound article comprising, in order: a first adherend, a first primer layer, an adhesive layer, optionally a second primer layer, and a second adherend; heating the article to a release temperature; and separating the first and second adherends. At room temperature, the adhesive layer exhibits a high overlap shear of greater than 1.0 MPa (145 psi) or even greater than 5.0 MPa (725 psi), however, at release temperature, the adhesive layer exhibits an overlap shear of no more than 0.34 MPa (50 psi) or even no more than 0.21 MPa (30 psi). The release temperature may be a temperature between 100° C. and 150° C. The adhesive layer may comprise: a first film-forming polymer or oligomer; a cured polymer comprising a polymer of a first species comprising first unsaturated free-radically polymerizable groups; a first transition metal cation; and optionally a quaternary ammonium salt.

A water shedding finish for aircraft or aerospace transparencies is prepared from a paraffin wax and at least a solvent linear or branched C.sub.6 to C.sub.8 alkane solvent. The finish may further include a surfactant and similarly the solvent may be present as a co-solvent system.