A thermally expandable fire-resistant resin composition contains a metallocene plastomer; a nitrogen-containing foaming agent; a phosphorus flame retardant; a polyhydric alcohol; and a titanium dioxide.

A thermally expandable fire-resistant resin composition contains a metallocene plastomer; a nitrogen-containing foaming agent; a phosphorus flame retardant; a polyhydric alcohol; and a titanium dioxide.

Problem: To provide a thermally conductive sheet precursor exhibiting excellent thermal conductivity and dielectric breakdown resistance, a thermally conductive sheet obtained from the precursor, and a production method thereof. Solution: The thermally conductive sheet precursor according to an embodiment of the present disclosure includes isotropic thermally conductive aggregates in which anisotropic thermally conductive primary particles are aggregated, an anisotropic thermally conductive material not constituted by the aggregates, and a binder resin; wherein upon the application of a pressure from 3 to 12 MPa to the thermally conductive sheet precursor, at least some of the isotropic thermally conductive aggregates collapse.

A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

A nitrification inhibiting composition for use in agricultural applications includes from about 5% to about 15% propylene glycol methyl ether and from about 20% to about 35% dicyandiamide. The nitrification inhibiting composition may be combined with a fertilizer and applied to plants or soil to increases the effectiveness of the fertilizer, thereby positively impacting crop yield and quality.

A ready to use surface veil and surface film integrated prepreg layer which is suitable to use in the production of lightweight structural parts/panels with class A surfaces includes a curable bottom base resin formulation including a curable bottom base resin, at least one first toughening agent, at least one accelerator, at least one curing agent and at least one hardener. The prepreg layer further includes a release paper that is coated with the curable bottom base resin formulation to obtained curable bottom base resin formulation coated release paper as a first resin film; a reinforcement fabric; an outer resin formulation including the outer resin which is the curable bottom base resin being 10% more viscous than the resin, at least one thermoplastic toughening agent, at least one accelerator, at least one curing agent and at least one hardener agent.

A hot melt epoxy resin system includes an epoxy resin composition and a curing agent/catalyst paste composition that is fast curable, isothermal press curable, hot demoldable capable under three minutes at 150 C. and Class A surface giving and suitable to use in the production of automotive interior composite parts, wherein the epoxy resin composition includes an epoxy resin mixture including a first resin and a second resin; at least one thermoplastic toughener; at least one UV hindered amine light stabilizer; at least one UV absorber and/or blocker; 1,3,5-tris(4-tert.-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione as anti-oxidant; hydrophobic fumed silica as air release/rheology agent and hexamethyldisiloxane as an internal mold release agent and the curing agent/catalyst paste composition comprises a paste mixture, which is comprising dicyandiamide (DICY) below a 10 m particle size and sebacic dihydrazide below a 10 m particle size.

A bonding method for joining two structural parts using a curable adhesive layer having a fibrous veil embedded therein. The fibrous veil carries a polymeric binder, which is in a solid phase at room temperature (20 C-25 C.) and is capable of dissolving into the adhesive composition during curing thereof.

Provided is a resin composition for a fiber-reinforced composite material that has low tackiness when turned into a prepreg, has satisfactory handleability, and can be suppressed in deformation at the time of its release from a mold in a PCM method. The resin composition is a resin composition for a fiber-reinforced composite material including, as essential components: a liquid epoxy resin (A); a novolac-type epoxy resin (B); a polymer component (C) having a molecular weight of 10,000 or more; dicyandiamide (D); and an imidazole-based curing aid (E), wherein the resin composition includes 10 parts by mass to 35 parts by mass of the liquid epoxy resin (A), and 10 parts by mass to 25 parts by mass of the polymer component (C) out of 100 parts by mass of the total of the components (A) to (E), and has a glass transition temperature of 0 C. or more before its curing.