A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25 C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.

A coating composition comprising (a) a polyester binder material; and (b) a feathering reducing agent. The feathering reducing agent is selected from (i) an acrylic feathering reducing agent comprising a functional group selected from hydroxyl, epoxide, phosphatized epoxide and/or acid-functional; (ii) a hydroxy-functional polyester feathering reducing agent; (iii) a feathering reducing agent comprising a functional group selected from amine, amide, imine and/or nitrile; (iv) a phosphatized epoxy feathering reducing agent; (v) a phenolic resin feathering reducing agent; and/or (vi) a feathering reducing agent comprising an oxazolyl functional group. The invention extends to a substrate coated with the coating composition and use of the coating composition to reduce feathering.

A use of dicyandiamide is provided as a modifier in a melamine-formaldehyde resin for use in a floor panel including a substrate and a top layer. The top layer defines an upper surface of the floor panel. The floor panel is provided with embossments extending from the upper surface, such that the thickness of the floor panel varies along a cross-section of the floor panel. The top layer has a modified melamine-formaldehyde resin including formaldehyde and melamine in an F/M molar ratio within the range of from 1.60 to 1.80, and at least one modifier, thereby providing a floor panel having improved transparency at the embossments.

A use of dicyandiamide is provided as a modifier in a melamine-formaldehyde resin for use in a floor panel including a substrate and a top layer. The top layer defines an upper surface of the floor panel. The floor panel is provided with embossments extending from the upper surface, such that the thickness of the floor panel varies along a cross-section of the floor panel. The top layer has a modified melamine-formaldehyde resin including formaldehyde and melamine in an F/M molar ratio within the range of from 1.60 to 1.80, and at least one modifier, thereby providing a floor panel having improved transparency at the embossments.

The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100 C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100 C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

A medical grade polyoxymethylene polymer composition is disclosed that has been mass colored. The composition is particularly formulated so as to meet the standards of various governmental and safety requirements needed for use in medical applications and/or in food contact applications. In one embodiment, the polymer composition is formulated to meet the standards of USP Class VI testing and/or ISO 10993 testing.

A curable composition containing: a blocked isocyanate prepolymer containing a polyol compound, a polyisocyanate compound, a branching agent, and a blocking agent; an epoxy resin; and a curing agent and/or a curing accelerator, wherein the polyol compound is polytetramethylene glycol, the branching agent is a compound having at least three reactive functional groups capable of reacting with an isocyanate group, an amount by mole of the isocyanate group in the polyisocyanate compound is 2 mol or less relative to 1 mol of a total amount by mole of a hydroxy group in the polyol compound and the reactive functional groups capable of reacting with the isocyanate group in the branching agent, and an amount of the reactive functional groups in the branching agent is more than 50 mol % of the total amount of the hydroxy group in the polyol compound and the reactive functional groups in the branching agent.

A curable composition containing: a blocked isocyanate prepolymer containing a polyol compound, a polyisocyanate compound, a branching agent, and a blocking agent; an epoxy resin; and a curing agent and/or a curing accelerator, wherein the polyol compound is polytetramethylene glycol, the branching agent is a compound having at least three reactive functional groups capable of reacting with an isocyanate group, an amount by mole of the isocyanate group in the polyisocyanate compound is 2 mol or less relative to 1 mol of a total amount by mole of a hydroxy group in the polyol compound and the reactive functional groups capable of reacting with the isocyanate group in the branching agent, and an amount of the reactive functional groups in the branching agent is more than 50 mol % of the total amount of the hydroxy group in the polyol compound and the reactive functional groups in the branching agent.

To provide a composition having a very low refractive index, an organic photoelectronic element using the composition, and simple methods for producing such a composition and an organic photoelectronic element.

A composition comprising a fluorinated polymer, an organic semiconductor material and a dopant.