A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25 C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.

Aspects of the disclosure relate to compositions for forming films and the use of the films in large die applications. In certain aspects, the disclosure relates to compositions comprising two or more resins, optionally, one or more inorganic fillers, and one or more core shell additives, together with a curative package, to films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions. In certain aspects, cured films obtained after cure of the disclosed compositions have particular physical properties and/or combinations of physical properties.

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Provided is a thermosetting resin composition that contains a high dielectric constant material and that can suppress, in producing a cured product thereof, generation of outgas, decrease in heat resistance, and decrease in peel strength. Also provided are a prepreg, a resin film, a laminate, a printed wiring board, an antenna device, an antenna module, and a communication device obtained by using the thermosetting resin composition. The thermosetting resin composition is, specifically, a thermosetting resin composition containing (A) a thermosetting resin and (B) at least one high dielectric constant inorganic filler selected from the group consisting of a titanium-based inorganic filler and a zircon-based inorganic filler, the thermosetting resin composition further containing (C) a resin having 3% by mass or more of an acidic group in an amount of 1 part by mass or more with respect to 100 parts by mass of the component (B).

A non-aqueous sprayable and curable dampening composition for automotive body and closure panels which cures to form a cured product, including: (1) a PVC homopolymer resin and/or a mixture of a PVC copolymer resin; (2) a phthalate plasticizer and a benzoate plasticizer; (3) a filler component, wherein the filler component comprises one or more spherical fillers and/or one or more platy fillers; (4) a modified epoxy resin; (5) an adhesion promoter; and (6) a substrate wetting agent.

A non-aqueous sprayable and curable dampening composition for automotive body and closure panels which cures to form a cured product, including: (1) a PVC homopolymer resin and/or a mixture of a PVC copolymer resin; (2) a phthalate plasticizer and a benzoate plasticizer; (3) a filler component, wherein the filler component comprises one or more spherical fillers and/or one or more platy fillers; (4) a modified epoxy resin; (5) an adhesion promoter; and (6) a substrate wetting agent.

A method comprising combining polycarbonate thermoplastic with a decomposition initiator to decompose polycarbonate, heating the polycarbonate thermoplastic and decomposition initiator to a temperature between 120 C. and 250 C. for the release of carbon dioxide, and wherein the polycarbonate thermoplastic and decomposition initiator are combined with one or more additional components for forming a heat activated material that foams as a result of the release of carbon dioxide.

A method comprising combining polycarbonate thermoplastic with a decomposition initiator to decompose polycarbonate, heating the polycarbonate thermoplastic and decomposition initiator to a temperature between 120 C. and 250 C. for the release of carbon dioxide, and wherein the polycarbonate thermoplastic and decomposition initiator are combined with one or more additional components for forming a heat activated material that foams as a result of the release of carbon dioxide.