The invention relates to a rubber-based composition that can be thermally cured at reduced temperature while retaining performance over a broad cure temperature window comprising at least one solid rubber, at least one diene-based polymer or copolymer containing an olefinic double bond and/or an aromatically substituted olefin, suitable for undergoing curing with a curing system present as quinone dioxime, peroxides and optional multifunctional acrylates, preferably in the absence of elemental sulfur. The cured composition exhibits improved reversion resistance and adhesion strength on aluminum.

The invention relates to a rubber-based composition that can be thermally cured at reduced temperature while retaining performance over a broad cure temperature window comprising at least one solid rubber, at least one diene-based polymer or copolymer containing an olefinic double bond and/or an aromatically substituted olefin, suitable for undergoing curing with a curing system present as quinone dioxime, peroxides and optional multifunctional acrylates, preferably in the absence of elemental sulfur. The cured composition exhibits improved reversion resistance and adhesion strength on aluminum.

A curable resin composition contains quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), a leveling agent (F), and a solvent (G), wherein the resin (B) has a weight-average molecular weight in terms of polystyrene of less than 10000 and an acid value of 90 mg KOH/g or more and 150 mg KOH/g or less.

A curable resin composition contains quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), a leveling agent (F), and a solvent (G), wherein the resin (B) has a weight-average molecular weight in terms of polystyrene of less than 10000 and an acid value of 90 mg KOH/g or more and 150 mg KOH/g or less.