Patent classifications
C08K5/435
POLYAMIDE RESIN COMPOSITION FOR DAMPING MATERIAL
A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.
POLYAMIDE RESIN COMPOSITION FOR DAMPING MATERIAL
A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.
POLYAMIDE RESIN COMPOSITION FOR DAMPING MATERIAL
A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.
Heat resistant polyethylene terephthalate and a process for the preparation of the same
The present disclosure relates to a process for preparing polyester. The process for preparing the polyester essentially involves the preparation of the isosorbide oligomer and the isosorbide polymer from the isosorbide oligomer. The isosorbide oligomer or isosorbide polymer is then co-polymerized with the polyester. The copolymerization isosorbide oligomer or isosorbide polymer may be carried out at any stage of the preparation of the polyester. The polyester obtained in accordance with the process of the present disclosure can be used in packaging applications such as preparing packaging materials or containers. The material or container obtained from the polyester of the present disclosure is capable of withstanding a temperature of 60 to 90° C. without undergoing any deformation and shrinkage. Further, the material or container obtained from the polyester of the present disclosure is transparent or has lower color b* value.
Heat resistant polyethylene terephthalate and a process for the preparation of the same
The present disclosure relates to a process for preparing polyester. The process for preparing the polyester essentially involves the preparation of the isosorbide oligomer and the isosorbide polymer from the isosorbide oligomer. The isosorbide oligomer or isosorbide polymer is then co-polymerized with the polyester. The copolymerization isosorbide oligomer or isosorbide polymer may be carried out at any stage of the preparation of the polyester. The polyester obtained in accordance with the process of the present disclosure can be used in packaging applications such as preparing packaging materials or containers. The material or container obtained from the polyester of the present disclosure is capable of withstanding a temperature of 60 to 90° C. without undergoing any deformation and shrinkage. Further, the material or container obtained from the polyester of the present disclosure is transparent or has lower color b* value.
FILTER MEDIUM, METHOD FOR PRODUCING FILTER MEDIUM, WATER TREATMENT MODULE, AND WATER TREATMENT DEVICE
The filter medium is a filter medium which uses a liquid containing oil and water as a separation target, and has a channel for the liquid. The filter medium includes a base constituting the channel, and one or more of nitrogen-containing fluorine compounds which are provided on at least a portion of a surface of the channel. The nitrogen-containing fluorine compound includes an oil-repellency imparting group and any one hydrophilicity imparting group selected from a group consisting of an anion type, a cation type, and an amphoteric type, in a molecule.
CONDUCTIVE MEMBER, CONDUCTIVE ROLLER AND IMAGE FORMING DEVICE
The conductive member of this disclosure is formed of a UV cure resin obtained by curing under ultraviolet ray radiation a composition containing a urethane (meth)acrylate oligomer (A), a photo polymerization initiator (B) and an ionic conductive agent (C), wherein: the ionic conductive agent (C) contains an organic boron complex salt and a compound having a structure expressed with the following general formula(1), and a compounding amount of the organic boron complex salt is 0.2 parts by mass or more per 100 parts by mass of a curing component in the composition.
—SO2—NX—SO2— (1)
(In the general formula (1), X represents an alkali metal.)
CONDUCTIVE MEMBER, CONDUCTIVE ROLLER AND IMAGE FORMING DEVICE
The conductive member of this disclosure is formed of a UV cure resin obtained by curing under ultraviolet ray radiation a composition containing a urethane (meth)acrylate oligomer (A), a photo polymerization initiator (B) and an ionic conductive agent (C), wherein: the ionic conductive agent (C) contains an organic boron complex salt and a compound having a structure expressed with the following general formula(1), and a compounding amount of the organic boron complex salt is 0.2 parts by mass or more per 100 parts by mass of a curing component in the composition.
—SO2—NX—SO2— (1)
(In the general formula (1), X represents an alkali metal.)
Anti-vibration rubber composition and anti-vibration rubber
The purpose of the present invention is to provide: an anti-vibration rubber composition which enables the production of a hardened rubber article having excellent heat resistance, compression set, low dynamic magnification, tensile properties (elongation, strength), low-temperature properties and workability (scorch resistance); and an anti-vibration rubber which is produced by hardening the rubber composition. The anti-vibration rubber composition is characterized by comprising a rubber component mainly composed of a diene rubber, a bismaleimide compound as a vulcanizing agent, and N-phenyl-N-(trichloromethylthio)benzenesulfoneamide.
Anti-vibration rubber composition and anti-vibration rubber
The purpose of the present invention is to provide: an anti-vibration rubber composition which enables the production of a hardened rubber article having excellent heat resistance, compression set, low dynamic magnification, tensile properties (elongation, strength), low-temperature properties and workability (scorch resistance); and an anti-vibration rubber which is produced by hardening the rubber composition. The anti-vibration rubber composition is characterized by comprising a rubber component mainly composed of a diene rubber, a bismaleimide compound as a vulcanizing agent, and N-phenyl-N-(trichloromethylthio)benzenesulfoneamide.