A near infrared absorbing composition includes: a squarylium compound represented by the following Formula (1) and having an absorption maximum of 700 nm or longer; and a resin. In Formula (1), Ar.sup.1 and Ar.sup.2 each independently represent a divalent conjugated group which has a heteroaryl ring having a chalcogen atom, and R.sup.1 to R.sup.4 each independently represent a hydrogen atom or a substituent. The film and the infrared cut filter are formed of the near infrared absorbing composition. The solid image pickup element includes the infrared cut filter. ##STR00001##

A process for preparing coatings or sealed materials using a coating composition or a sealant that contains a first component and a second component. The first component includes a compound A) with at least one five-membered cyclic monothiocarbonate group. The second component includes a compound B) with at least one amino group. The at least one amino group can be a primary or secondary amino group or blocked primary or secondary amino group. Compounds A) or B) may additionally have at least one polymerizable, ethylenically unsaturated group. The coating composition or sealant may further include a compound C) with at least one polymerizable, ethylenically unsaturated group.

A process for preparing coatings or sealed materials using a coating composition or a sealant that contains a first component and a second component. The first component includes a compound A) with at least one five-membered cyclic monothiocarbonate group. The second component includes a compound B) with at least one amino group. The at least one amino group can be a primary or secondary amino group or blocked primary or secondary amino group. Compounds A) or B) may additionally have at least one polymerizable, ethylenically unsaturated group. The coating composition or sealant may further include a compound C) with at least one polymerizable, ethylenically unsaturated group.

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system.

##STR00001##

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system.

##STR00001##

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system.

##STR00001##

Disclosed herein is a copolymer comprising first polymerized units of the formula (1);

##STR00001##

wherein: R.sub.1 is H or a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group; and R.sub.2 is a substituted or unsubstituted C.sub.3-C.sub.20 alkyl group that optionally includes one or more of —O—, —S—, —N—, —C(O)—, or —C(O)O—, —N—C(O)—, —C(O)—NR—; wherein R is H or a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group; and

second polymerized units of the formula (2):

##STR00002##

wherein: R.sub.3 is a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group that optionally includes one or more of —O—, —N—, —S—, —C(O)—, or —C(O)O—; wherein the first polymerized units and the second polymerized units are chemically different, and the copolymer is free of fluorine.

The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R.sup.1˜R.sup.5 are as defined herein.

##STR00001##

The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.

The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.