A low-corrosion fire-resistant thermoplastic resin composition comprising a thermoplastic resin, a phosphinic acid salt flame retardant, a reinforced glass fiber, and a rare earth metal salt corrosion inhibitor. The resin composition improves the corrosion resistance and mechanical performance of the metal to a great extent while maintaining the high flame resistance.

Certain phosphonic acid salts heated at temperatures over 200° C. generate thermally stable, highly efficient flame retardant materials well suited for use as flame retardant additives in polymers. The flame retardants of the invention can be used as the sole flame retardant in a composition or in combination with other flame retardants, synergists or adjuvants.

Certain phosphonic acid salts heated at temperatures over 200° C. generate thermally stable, highly efficient flame retardant materials well suited for use as flame retardant additives in polymers. The flame retardants of the invention can be used as the sole flame retardant in a composition or in combination with other flame retardants, synergists or adjuvants.

Provided are a photocurable resin composition and fabrication method of window member using the same. The photocurable resin composition includes a (meth)acrylic resin, a urethane acrylate oligomer, a photopolymerizable monomer and a photopolymerization initiator. Accordingly, deterioration in physical properties such as cracking or decrease of adhesion under additional ultraviolet irradiation conditions, high temperature and high humidity conditions, and thermal shock conditions does not occur.

Provided are a photocurable resin composition and fabrication method of window member using the same. The photocurable resin composition includes a (meth)acrylic resin, a urethane acrylate oligomer, a photopolymerizable monomer and a photopolymerization initiator. Accordingly, deterioration in physical properties such as cracking or decrease of adhesion under additional ultraviolet irradiation conditions, high temperature and high humidity conditions, and thermal shock conditions does not occur.

Compositions containing, as component (A), a finely particled phosphinic acid salt of formula (I) and/or a finely particled diphosphinic acid salt of formula (II) and/or the polymers thereof, as component (B), an aminoether of formula (III), and as component (C), a thermoplastic polymer.

Compositions containing, as component (A), a finely particled phosphinic acid salt of formula (I) and/or a finely particled diphosphinic acid salt of formula (II) and/or the polymers thereof, as component (B), an aminoether of formula (III), and as component (C), a thermoplastic polymer.

The present invention relates to the use of phosphorous-containing organic oxyimides according to the general formula (I) as flame retardant for plastic materials, as radical generators in plastic materials and/or stabilisers for plastics. In addition, the present invention relates to a flame-retardant plastic material moulding compound in which the previously described phosphorous-containing organic oxyimides are integrated, and also to a method for the production of the previously mentioned plastic material composition. Furthermore, the present invention relates to a moulded article, a paint or a coating from the previously mentioned flame-retardant plastic material composition.

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 μm or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)

R.sup.1.sub.x—P—(OR.sup.1).sub.3-x   (1)

(R.sup.1 is a monovalent hydrocarbon group, x is 0-3) as a ligand.

A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.