The present disclosure provides for a coating composition system suitable for forming a stain resistant and soft tactile texture coating onto a variety of substrate materials including plastic materials, metal materials, ceramic materials, and concrete materials. The coating composition system can be cured under mild curing conditions, and provides the resulting coating with excellent properties in terms of adhesion to the substrates, strength, and abrasion resistance. The present disclosure also provides for a method for preparing the coating composition system, and the use thereof.

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa.Math.s.

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa.Math.s.

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

The present invention provides an environment-responsive laminated film including an inorganic thin film layer and a protective layer in this order on a substrate film layer using a polyester resin recycled from PET bottles. The laminated film has excellent barrier properties and adhesiveness even after a severe wet heat treatment and has less deterioration in appearance of the film even after retorting. The laminated film comprises a substrate film; an inorganic thin film layer on at least one surface of the substrate film; and a protective layer containing a urethane resin on the inorganic thin film layer, wherein (a) the substrate film contains 50% by weight or more of a polyester resin recycled from PET bottles; (b) standard deviation of a haze after retorting the laminated film at 130° C. for 30 minutes is 0.5% or less; and (c) an adhesion amount of the protective layer is 0.5 g/m.sup.2 or less.

The present invention provides an environment-responsive laminated film including an inorganic thin film layer and a protective layer in this order on a substrate film layer using a polyester resin recycled from PET bottles. The laminated film has excellent barrier properties and adhesiveness even after a severe wet heat treatment and has less deterioration in appearance of the film even after retorting. The laminated film comprises a substrate film; an inorganic thin film layer on at least one surface of the substrate film; and a protective layer containing a urethane resin on the inorganic thin film layer, wherein (a) the substrate film contains 50% by weight or more of a polyester resin recycled from PET bottles; (b) standard deviation of a haze after retorting the laminated film at 130° C. for 30 minutes is 0.5% or less; and (c) an adhesion amount of the protective layer is 0.5 g/m.sup.2 or less.

A composition comprising the following: a) an ethylene/alpha-olefin/interpolymer; b) a peroxide; c) a “Si-containing compound” selected from the following (i) through (v): (i), where each R is independently selected from a C1-C3 alkyl, and n is from 1 to 16; (ii), where each R is independently methyl or ethyl, and n is from 1 to 18; (iii), where each R is independently methyl or ethyl; (iv) a vinyl oligomericsiloxane; or (v) any combination of (i) through (iv).

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