An adhesive coating composition according to an embodiment of the present invention comprises polyethylene acrylate including a repeating unit represented by chemical formula 1 below and a repeating unit represented by chemical formula 2 below, wherein the polyethylene acrylate includes 65-90 wt % of the repeating unit represented by chemical formula 1 below and 10-35 wt % of the repeating unit represented by chemical formula 2 below.

A flame-retardant rubber composition is provided which is excellent in flame retardancy and rubber properties and reduces environmental load. The flame-retardant rubber composition comprises an ethylene/α-olefin/non-conjugated diene copolymer, a hydrated metal oxide, a silane coupling agent, a plasticizer, and a cross-linking agent, wherein a carbon number of the α-olefin of the ethylene/α-olefin/non-conjugated diene copolymer is three and more, and 180 to 350 parts by mass of the hydrated metal oxide and 10 to 60 parts by mass of the plasticizer are included per 100 parts by mass of the ethylene/α-olefin/non-conjugated diene copolymer.

A flame-retardant rubber composition is provided which is excellent in flame retardancy and rubber properties and reduces environmental load. The flame-retardant rubber composition comprises an ethylene/α-olefin/non-conjugated diene copolymer, a hydrated metal oxide, a silane coupling agent, a plasticizer, and a cross-linking agent, wherein a carbon number of the α-olefin of the ethylene/α-olefin/non-conjugated diene copolymer is three and more, and 180 to 350 parts by mass of the hydrated metal oxide and 10 to 60 parts by mass of the plasticizer are included per 100 parts by mass of the ethylene/α-olefin/non-conjugated diene copolymer.

The present invention relates to an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and a method for preparing the same.

The present invention relates to an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and a method for preparing the same.

A method for producing an organopolysiloxane having at least one silicon atom-bonded alkoxysilylalkyl group per molecule is provided. The method comprises the following steps: (i) treating an organopolysiloxane having at least one silicon atom-bonded hydrogen atom per molecule with an alkali salt of carboxylic acid; (ii) removing the alkali salt from the organopolysiloxane; and (iii) reacting the organopolysiloxane with an alkenyl group-containing alkoxysilane in the presence of a platinum-based catalyst. The organopolysiloxane is generally obtained by the method without hydrolyzing any alkoxysilylalkyl groups, and is useful as a surface modifier for various types of fillers.

A method for producing an organopolysiloxane having at least one silicon atom-bonded alkoxysilylalkyl group per molecule is provided. The method comprises the following steps: (i) treating an organopolysiloxane having at least one silicon atom-bonded hydrogen atom per molecule with an alkali salt of carboxylic acid; (ii) removing the alkali salt from the organopolysiloxane; and (iii) reacting the organopolysiloxane with an alkenyl group-containing alkoxysilane in the presence of a platinum-based catalyst. The organopolysiloxane is generally obtained by the method without hydrolyzing any alkoxysilylalkyl groups, and is useful as a surface modifier for various types of fillers.

A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.

The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and an encapsulant film using the same.