Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

The disclosure relates to sidechain functionalized organosiloxane compounds comprising polyalkyleneoxide (POA) and/or polyalkyleneoxide coupled zwitterionic moieties with various other modular side chains including reactive and or non-reactive groups. The present disclosure further also pertains to ice-phobic polymer formulations capable of curing on a substrate to form a surface that is ice-phobic, resistant to ice formation, and/or resistant to ice adhesion. The disclosed ice-phobic polymer formulations comprise one or more disclosed sidechain functionalized organosiloxane compound, one or more binder resin, and/or one or more lubricating liquid. The present disclosure further relates to articles comprising the disclosed ice-phobic polymer compositions, thereby providing articles having ice-phobic properties. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

The disclosure relates to sidechain functionalized organosiloxane compounds comprising polyalkyleneoxide (POA) and/or polyalkyleneoxide coupled zwitterionic moieties with various other modular side chains including reactive and or non-reactive groups. The present disclosure further also pertains to ice-phobic polymer formulations capable of curing on a substrate to form a surface that is ice-phobic, resistant to ice formation, and/or resistant to ice adhesion. The disclosed ice-phobic polymer formulations comprise one or more disclosed sidechain functionalized organosiloxane compound, one or more binder resin, and/or one or more lubricating liquid. The present disclosure further relates to articles comprising the disclosed ice-phobic polymer compositions, thereby providing articles having ice-phobic properties. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.

Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

The invention relates to a silane of the formula (1),

Si(R.sup.1).sub.m(R.sup.2).sub.n(R.sup.3).sub.4-(m+n)  (1)

as defined herein, where the silane has at least one group of the general formula (3):

##STR00001##

as defined herein, to a method for preparing the silane, and to curable compositions, containing the silane and at least one polyorganosiloxane.

The invention relates to a silane of the formula (1),

Si(R.sup.1).sub.m(R.sup.2).sub.n(R.sup.3).sub.4-(m+n)  (1)

as defined herein, where the silane has at least one group of the general formula (3):

##STR00001##

as defined herein, to a method for preparing the silane, and to curable compositions, containing the silane and at least one polyorganosiloxane.