Patent classifications
C08K5/5425
POLYOLEFIN COMPOSITIONS HAVING IMPROVED ELECTRICAL PROPERTIES
The present disclosure relates to a curable composition comprising: (A) a polyolefin; (B) a fumed alumina; (C) a silane compound; (D) a UV stabilizer; and, optionally, (E) a crosslinking agent, where the curable composition demonstrates improved electrical properties. The present disclosure further relates to a crosslinked polymer composition that is the reaction product of the curable composition, where improved electrical properties are demonstrated as well.
POLYURETHANE BASED THERMAL INTERFACE MATERIAL COMPRISING SILANE TERMINATED URETHANE PREPOLYMERS
Disclosed herein are thermal interface materials (TIM) composition comprising: a) a non-reactive polyurethane prepolymer; b) about 70-95 wt % of aluminum trihydroxide (ATH); c) about 0.15-1.5 wt % of at least one silane terminated urethane prepolymer; and d) about 1-20 wt % of at least one plasticizer, with the total weight of the thermal interface material totaling to 100 wt %.
POLYURETHANE BASED THERMAL INTERFACE MATERIAL COMPRISING SILANE TERMINATED URETHANE PREPOLYMERS
Disclosed herein are thermal interface materials (TIM) composition comprising: a) a non-reactive polyurethane prepolymer; b) about 70-95 wt % of aluminum trihydroxide (ATH); c) about 0.15-1.5 wt % of at least one silane terminated urethane prepolymer; and d) about 1-20 wt % of at least one plasticizer, with the total weight of the thermal interface material totaling to 100 wt %.
POLYORGANOSILOXANE COMPOSITION FOR USE IN ADHESION OF A POLYPHENYLENE SULFIDE RESIN
An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.
POLYORGANOSILOXANE COMPOSITION FOR USE IN ADHESION OF A POLYPHENYLENE SULFIDE RESIN
An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.
High light transmittance photovoltaic encapsulating material
The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.
High light transmittance photovoltaic encapsulating material
The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.
Method for manufacturing room-temperature-curable organopolysiloxane composition, room-temperature-curable organopolysiloxane composition, and article
Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.
Method for manufacturing room-temperature-curable organopolysiloxane composition, room-temperature-curable organopolysiloxane composition, and article
Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.
Multi-vinyl cyclic siloxane enhanced ethylene/α-olefin/diene interpolymer based compositions
A composition comprising the following components: A) an ethylene/α-olefin/non-conjugated diene interpolymer; B) a peroxide; C) at least one multi-vinyl cyclic siloxane selected from Structure 1 below: Structure 1, wherein n is an integer greater than, or equal to, 1; and each R1 is independently selected from the following: a (C.sub.2-C.sub.4) alkenyl, or a H.sub.2C═C(R.sup.1a)—C(═O)—O—(CH.sub.2).sub.m—, and wherein R.sup.1a is H or methyl, and m is an integer from 1 to 4; and each R2 is independently selected from the following: H, a (C.sub.1-C.sub.4) alkyl, a (C.sub.2-C.sub.4) alkenyl, a phenyl, or a H.sub.2C═C(R.sup.1b)—C(═O)—O—(CH.sub.2).sub.m—, wherein R.sup.1b is H or methyl, and m is an integer from 1 to 4. ##STR00001##