A composition comprising an ethylene/alpha-olefin interpolymer that comprises the following properties: a) a total unsaturation/1000C≥0.30; b) a molecular weight distribution (MWD)≤3.0; c) a TGIC broadness parameter B.sub.1/4≤8.0. A solution N polymerization process to prepare an ethylene/alpha-olefin/interpolymer, said process comprising polymerizing, in one reactor, at a reactor temperature ≥150° C., a reaction mixture comprising ethylene, an alpha-olefin, a solvent, and a metal complex as described herein. A method to determine the TGIC broadness parameter B.sub.1/x of a polymer composition comprising one or more olefin-based polymers.

A composition comprising an ethylene/alpha-olefin interpolymer that comprises the following properties: a) a total unsaturation/1000C≥0.30; b) a molecular weight distribution (MWD)≤3.0; c) a TGIC broadness parameter B.sub.1/4≤8.0. A solution N polymerization process to prepare an ethylene/alpha-olefin/interpolymer, said process comprising polymerizing, in one reactor, at a reactor temperature ≥150° C., a reaction mixture comprising ethylene, an alpha-olefin, a solvent, and a metal complex as described herein. A method to determine the TGIC broadness parameter B.sub.1/x of a polymer composition comprising one or more olefin-based polymers.

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

A silicone release coating composition and method for its preparation and use are described. A release coating prepared by curing the silicone release coating composition has high immediate release force (>50 g/in). A release liner including the release coating is suitable for use as a transfer liner in processes for making composites articles, such as aircraft parts.

A silicone release coating composition and method for its preparation and use are described. A release coating prepared by curing the silicone release coating composition has high immediate release force (>50 g/in). A release liner including the release coating is suitable for use as a transfer liner in processes for making composites articles, such as aircraft parts.