Patent classifications
C08K5/5435
NON-ACTIVE SULFUR CONTAINING FUNCTIONAL SILANES FOR SILICA COMPOUNDS
A sulfur-vulcanizable rubber compound comprises a silane functionalized diene elastomer, a silane coupling agent, and a silica filler. The silane coupling agent excludes an active sulfur moiety. The rubber compound is a reaction product of a siloxyl condensation reaction between the silane functionalized diene elastomer and the non-sulfur containing silane coupling agent. The coupling agent comprises at least one end terminating group reactive with a hydroxyl group contained on the silica filler and a silane moiety contained on a diene-based elastomer.
Ionomer interlayer with enhanced adhesion properties
Provided is a sodium-neutralized ethylene acid copolymer ionomer composition containing a specified silane additive in a specified amount and having enhanced adhesion properties to glass, a masterbatch composition suitable for producing such ionomer composition, an interlayer made from such ionomer composition, and a glass laminate comprising such interlayer.
Ionomer interlayer with enhanced adhesion properties
Provided is a sodium-neutralized ethylene acid copolymer ionomer composition containing a specified silane additive in a specified amount and having enhanced adhesion properties to glass, a masterbatch composition suitable for producing such ionomer composition, an interlayer made from such ionomer composition, and a glass laminate comprising such interlayer.
THERMORESPONSIVE CELL CULTURE SUPPORTS
The present invention relates to a cell culture support comprising a substrate and a polymeric blend layer bound to the substrate. The polymeric blend layer comprises at least one thermoresponsive polymer and at least one coupling agent. The coupling agent is a non-protein coupling agent that has functional thiol, ester, epoxy, or aldehyde groups. The cell culture support further includes cells supported by the polymeric blend layer, wherein the thermoresponsive polymer provides for temperature induced detachment of the cells and/or cell sheets.
THERMORESPONSIVE CELL CULTURE SUPPORTS
The present invention relates to a cell culture support comprising a substrate and a polymeric blend layer bound to the substrate. The polymeric blend layer comprises at least one thermoresponsive polymer and at least one coupling agent. The coupling agent is a non-protein coupling agent that has functional thiol, ester, epoxy, or aldehyde groups. The cell culture support further includes cells supported by the polymeric blend layer, wherein the thermoresponsive polymer provides for temperature induced detachment of the cells and/or cell sheets.
THERMORESPONSIVE CELL CULTURE SUPPORTS
The present invention relates to a cell culture support comprising a substrate and a polymeric blend layer bound to the substrate. The polymeric blend layer comprises at least one thermoresponsive polymer and at least one coupling agent. The coupling agent is a non-protein coupling agent that has functional thiol, ester, epoxy, or aldehyde groups. The cell culture support further includes cells supported by the polymeric blend layer, wherein the thermoresponsive polymer provides for temperature induced detachment of the cells and/or cell sheets.
Hot melt composition in the form of a film for use in thin film photovoltaic modules
The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.
Hot melt composition in the form of a film for use in thin film photovoltaic modules
The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.
Polyamide resin composition, and molded article
The invention provides a polyamide resin composition (1) containing a polyamide (A) and a free volume modifier (B), and having a free volume, as measured according to a positron annihilation method, of 0.0545 nm.sup.3 or less. The invention also provides a polyamide resin composition (2) prepared by adding from 0.005 to 1.200 parts by mass of a polysilsesquioxane (B) whose main chain is comprised of siloxane bonds, to 100 parts by mass of a polyamide (A) that contains a diamine unit including an aromatic diamine unit represented by the following general formula (I) in an amount of 70 mol % or more and a dicarboxylic acid unit including at least one of a linear aliphatic dicarboxylic acid unit represented by the following general formula (II-1) and an aromatic dicarboxylic acid unit represented by the following general formula (II-2) in a total amount of 50 mol % or more: ##STR00001##
wherein n in the general formula (II-1) indicates an integer of from 2 to 18, and Ar in the general formula (II-2) represents an arylene group.
Polyamide resin composition, and molded article
The invention provides a polyamide resin composition (1) containing a polyamide (A) and a free volume modifier (B), and having a free volume, as measured according to a positron annihilation method, of 0.0545 nm.sup.3 or less. The invention also provides a polyamide resin composition (2) prepared by adding from 0.005 to 1.200 parts by mass of a polysilsesquioxane (B) whose main chain is comprised of siloxane bonds, to 100 parts by mass of a polyamide (A) that contains a diamine unit including an aromatic diamine unit represented by the following general formula (I) in an amount of 70 mol % or more and a dicarboxylic acid unit including at least one of a linear aliphatic dicarboxylic acid unit represented by the following general formula (II-1) and an aromatic dicarboxylic acid unit represented by the following general formula (II-2) in a total amount of 50 mol % or more: ##STR00001##
wherein n in the general formula (II-1) indicates an integer of from 2 to 18, and Ar in the general formula (II-2) represents an arylene group.