Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).

Disclosed is a flame retardant composition including: (A) 20 to 50 parts by mass of at least one melamine salt selected from the group consisting of melamine orthophosphate, melamine pyrophosphate, and melamine polyphosphate; (B) 50 to 80 parts by mass of at least one piperazine salt selected from the group consisting of piperazine orthophosphate, piperazine pyrophosphate, and piperazine polyphosphate (with the proviso that the total of component (A) and component (B) is 100 parts by mass); (C) 0.01 to 5.0 parts by mass of a silane coupling agent; and (D) 0.01 to 1.0 part by mass of an aliphatic dicarboxylic acid ether ester compound represented by general formula (1). The details of general formula (1) are as described in Description.

Coating compositions for coating fluid handling components, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of a fluid handling component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

A laminate includes a substrate, a self-healing layer on the substrate and having a thickness of greater than or equal to about 50 micrometers, a protective layer between the substrate and the self-healing layer, and a surface layer on the self-healing layer and having a thickness of about 20 nanometers to about 300 nanometers, wherein the self-healing layer has a first elastic modulus and the protective layer has a second elastic modulus, wherein the second elastic modulus is about 1.2 times to about 50 times greater than the first elastic modulus, and wherein the surface layer has a friction coefficient of less than or equal to about 1.

The present invention pertains to a membrane for an electrochemical device, to a process for manufacturing said membrane and to use of said membrane in a process for manufacturing an electrochemical device.

The present invention pertains to a membrane for an electrochemical device, to a process for manufacturing said membrane and to use of said membrane in a process for manufacturing an electrochemical device.

A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.