Patent classifications
C08K5/5435
Resin composition, semiconductor sealing material, one-part adhesive and adhesive film
To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.
Resin composition, semiconductor sealing material, one-part adhesive and adhesive film
To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.
COMPOSITION FOR FORMING HARD COAT OF RESIN SUBSTRATE AND LAMINATE USING THE SAME
The present invention provides a composition for forming a hard coat and a laminate using the same. The composition for forming a hard coat includes at least metal oxide fine particles; a hydrolysate of an organosilicon compound; an adhesion promoting component having an alkoxysilyl group; a curing catalyst; and a solvent, wherein by introducing, as the organosilicon compound, an organosilicon compound having a hydrocarbon group having (6 to 18) carbon atoms substituted with a glycidoxy group, and an organosilicon compound having a hydrocarbon group having (1 to 5) carbon atoms substituted with a glycidoxy group, even when applied to a flexible resin substrate, the composition for forming a hard coat has excellent adhesion and scratch resistance, and bending resistance (crack resistance) and surface hardness as well.
COMPOSITION FOR FORMING HARD COAT OF RESIN SUBSTRATE AND LAMINATE USING THE SAME
The present invention provides a composition for forming a hard coat and a laminate using the same. The composition for forming a hard coat includes at least metal oxide fine particles; a hydrolysate of an organosilicon compound; an adhesion promoting component having an alkoxysilyl group; a curing catalyst; and a solvent, wherein by introducing, as the organosilicon compound, an organosilicon compound having a hydrocarbon group having (6 to 18) carbon atoms substituted with a glycidoxy group, and an organosilicon compound having a hydrocarbon group having (1 to 5) carbon atoms substituted with a glycidoxy group, even when applied to a flexible resin substrate, the composition for forming a hard coat has excellent adhesion and scratch resistance, and bending resistance (crack resistance) and surface hardness as well.
ETHYLENE/ALPHA-OLEFIN INTERPOLYMER COMPOSITIONS WITH HIGH GLASS ADHESION
A composition comprising the following: a) an ethylene/alpha-olefin/interpolymer; b) a peroxide; c) a “Si-containing compound” selected from the following (i) through (v): (i), where each R is independently selected from a C1-C3 alkyl, and n is from 1 to 16; (ii), where each R is independently methyl or ethyl, and n is from 1 to 18; (iii), where each R is independently methyl or ethyl; (iv) a vinyl oligomericsiloxane; or (v) any combination of (i) through (iv).
##STR00001##
ETHYLENE/ALPHA-OLEFIN INTERPOLYMER COMPOSITIONS WITH HIGH GLASS ADHESION
A composition comprising the following: a) an ethylene/alpha-olefin/interpolymer; b) a peroxide; c) a “Si-containing compound” selected from the following (i) through (v): (i), where each R is independently selected from a C1-C3 alkyl, and n is from 1 to 16; (ii), where each R is independently methyl or ethyl, and n is from 1 to 18; (iii), where each R is independently methyl or ethyl; (iv) a vinyl oligomericsiloxane; or (v) any combination of (i) through (iv).
##STR00001##
ETHYLENE/ALPHA-OLEFIN INTERPOLYMER COMPOSITIONS WITH HIGH GLASS ADHESION
A composition comprising the following: a) an ethylene/alpha-olefin/interpolymer; b) a peroxide; c) a “Si-containing compound” selected from the following (i) through (v): (i), where each R is independently selected from a C1-C3 alkyl, and n is from 1 to 16; (ii), where each R is independently methyl or ethyl, and n is from 1 to 18; (iii), where each R is independently methyl or ethyl; (iv) a vinyl oligomericsiloxane; or (v) any combination of (i) through (iv).
##STR00001##
Adhesive sheet and adhesive material using the same
An adhesive sheet utilizes an acrylic resin composition without using a separate primer layer, thus providing excellent adhesion, high reliability due to its excellent light resistance under the sunlight exposure, and excellent elastic modulus, and can be easily used as an adhesive material in various fields such as building materials and automobiles.
Adhesive sheet and adhesive material using the same
An adhesive sheet utilizes an acrylic resin composition without using a separate primer layer, thus providing excellent adhesion, high reliability due to its excellent light resistance under the sunlight exposure, and excellent elastic modulus, and can be easily used as an adhesive material in various fields such as building materials and automobiles.
Adhesive sheet and adhesive material using the same
An adhesive sheet utilizes an acrylic resin composition without using a separate primer layer, thus providing excellent adhesion, high reliability due to its excellent light resistance under the sunlight exposure, and excellent elastic modulus, and can be easily used as an adhesive material in various fields such as building materials and automobiles.