C08K5/5445

METHOD FOR PRODUCING SILICONE ADHESIVE COMPOSITION

Provided is a method for easily producing a silicone adhesive that has a reduced amount of remaining silanol groups, contains no aromatic hydrocarbon solvent, and is capable of preventing an impact(s) on the human body as well as skin irritancy as caused by remaining and volatilizing substances. The method includes: a first step of mixing, under the presence of a basic catalyst, (A) a polydiorganosiloxane, (B) an organopolysiloxane whose molar ratio of R.sup.1.sub.3SiO.sub.0.5 unit/SiO.sub.2 unit is 0.5 to 1.5, and (C) an aliphatic hydrocarbon solvent; and a second step of treating a product obtained in the first step with an organic disilazane compound and/or a silane compound, for the purpose of lowering an amount of silanol groups contained in a solid product obtained after the treatment to a range of 0.002 to 0.03 mol/100 g of the solid product obtained after the treatment.

METHOD FOR PRODUCING SILICONE ADHESIVE COMPOSITION

Provided is a method for easily producing a silicone adhesive that has a reduced amount of remaining silanol groups, contains no aromatic hydrocarbon solvent, and is capable of preventing an impact(s) on the human body as well as skin irritancy as caused by remaining and volatilizing substances. The method includes: a first step of mixing, under the presence of a basic catalyst, (A) a polydiorganosiloxane, (B) an organopolysiloxane whose molar ratio of R.sup.1.sub.3SiO.sub.0.5 unit/SiO.sub.2 unit is 0.5 to 1.5, and (C) an aliphatic hydrocarbon solvent; and a second step of treating a product obtained in the first step with an organic disilazane compound and/or a silane compound, for the purpose of lowering an amount of silanol groups contained in a solid product obtained after the treatment to a range of 0.002 to 0.03 mol/100 g of the solid product obtained after the treatment.

METHOD FOR FORMING COATING FILM OF PHOTOCURABLE FLUOROPOLYETHER-BASED ELASTOMER COMPOSITION

Provided is a method for forming a coating film of a photocurable fluoropolyether-based elastomer composition, with which a uniform cured product of the composition can be obtained even in an interface, dark portion and deep portion of a base material without being subjected to a curing inhibition from the base material (resin base material in particular). The method for forming the coating film of the photocurable fluoropolyether-based elastomer composition includes a step of applying a light-irradiated photocurable fluoropolyether-based elastomer composition to a surface of a base material.

Moisture curable compositions
11168213 · 2021-11-09 · ·

Disclosed is a two-component silicone composition, which can cure via moisture. The composition generally has improved cure speed while maintaining good storage stability.

Moisture curable compositions
11168213 · 2021-11-09 · ·

Disclosed is a two-component silicone composition, which can cure via moisture. The composition generally has improved cure speed while maintaining good storage stability.

Adhesion promoters for curable compositions

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.

Adhesion promoters for curable compositions

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.

THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

A thermosetting resin composition, including: a thermosetting resin; a laser direct structuring additive; an inorganic filler; and a coupling agent, wherein the coupling agent contains one or more selected from the group consisting of a triazine functional group-, isocyanate functional group-, isocyanuric acid functional group-, benzotriazole functional group-, acid anhydride functional group-, azasilacyclopentane functional group-, imidazole functional group-, and unsaturated group-containing-silane coupling agent, and is not a mercaptosilane coupling agent, an amino silane coupling agent, or an epoxy silane coupling agent.

Resin particles and method for manufacturing resin particles

Resin particles include resin base particles and silica particles on surfaces of the resin base particles. The silica particles contain a quaternary ammonium salt and have hydrophobized surfaces. A difference (detection temperature A−detection temperature B) between a detection temperature A and a detection temperature B is more than 50° C., where the detection temperature A is a detection temperature from a pyrolysis product of the quaternary ammonium salt determined by pyrolysis mass spectrometry of the resin particles before cleaning, and the detection temperature B is a detection temperature from the pyrolysis product of the quaternary ammonium salt determined by pyrolysis mass spectrometry of the resin particles after cleaning.

Resin particles and method for manufacturing resin particles

Resin particles include resin base particles and silica particles on surfaces of the resin base particles. The silica particles contain a quaternary ammonium salt and have hydrophobized surfaces. A difference (detection temperature A−detection temperature B) between a detection temperature A and a detection temperature B is more than 50° C., where the detection temperature A is a detection temperature from a pyrolysis product of the quaternary ammonium salt determined by pyrolysis mass spectrometry of the resin particles before cleaning, and the detection temperature B is a detection temperature from the pyrolysis product of the quaternary ammonium salt determined by pyrolysis mass spectrometry of the resin particles after cleaning.