A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): ##STR00001##
wherein Y.sub.1 and Y.sub.2 are independently H, CH.sub.3, or CH.sub.2CH.sub.3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.

Compositions of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, a method for preparing curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, as well as the use of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound as a sealant, an adhesive material, a potting compound and/or a coating agent.

Compositions of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, a method for preparing curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, as well as the use of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound as a sealant, an adhesive material, a potting compound and/or a coating agent.

The present invention aims to provide a resin composition containing a cyanate ester compound which can reduce the formation of carbamate compounds so that the resin composition can be suitably used as an sealing material. The present invention relates to a curable resin composition containing a cyanate ester compound and a dehydrating agent.

The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.

The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.

According to embodiments of the present invention, a method of manufacturing an organic semiconductor device includes forming a first organic semiconductor layer on a substrate, and forming a self-assembled monolayer by providing a self-assembly precursor onto the first organic semiconductor layer. The first organic semiconductor layer has a reactive group on a top surface of the first organic semiconductor layer. The forming of the self-assembled monolayer includes forming a chemical bond between the self-assembly precursor and the reactive group of the first organic semiconductor layer.

According to embodiments of the present invention, a method of manufacturing an organic semiconductor device includes forming a first organic semiconductor layer on a substrate, and forming a self-assembled monolayer by providing a self-assembly precursor onto the first organic semiconductor layer. The first organic semiconductor layer has a reactive group on a top surface of the first organic semiconductor layer. The forming of the self-assembled monolayer includes forming a chemical bond between the self-assembly precursor and the reactive group of the first organic semiconductor layer.

The invention relates to a silane of the formula (1),
Si(R.sup.1).sub.m(R.sup.2).sub.n(R.sup.3).sub.4(m+n)(1)
as defined herein, where the silane has at least one group of the general formula (3): ##STR00001##
as defined herein, to a method for preparing the silane, and to curable compositions, containing the silane and at least one polyorganosiloxane.

The invention relates to a silane of the formula (1),
Si(R.sup.1).sub.m(R.sup.2).sub.n(R.sup.3).sub.4(m+n)(1)
as defined herein, where the silane has at least one group of the general formula (3): ##STR00001##
as defined herein, to a method for preparing the silane, and to curable compositions, containing the silane and at least one polyorganosiloxane.