This silicone gel composition contains (A) an organopolysiloxane having one or more silicon atom-bonded alkenyl groups per molecule, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule, (C) a platinum group metal-based curing catalyst, (D) an isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group and/or an isocyanuric acid derivative having three trialkoxysilyl groups, and (E) a ketenesilylacetal-type compound, and provides a cured product having a specific penetration.

The silicone gel composition can provide a silicone gel cured product that is a silicone gel having excellent heat resistance and adhesiveness to metals at high temperature and having a high penetration, that is capable of maintaining a low elastic modulus and a low stress even in use at high temperature for long periods of time, and that enables reduction of the occurrence of bubbles and reduction of deterioration in releasability from a substrate and in electrical insulating properties.

This silicone gel composition contains (A) an organopolysiloxane having one or more silicon atom-bonded alkenyl groups per molecule, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule, (C) a platinum group metal-based curing catalyst, (D) an isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group and/or an isocyanuric acid derivative having three trialkoxysilyl groups, and (E) a ketenesilylacetal-type compound, and provides a cured product having a specific penetration.

The silicone gel composition can provide a silicone gel cured product that is a silicone gel having excellent heat resistance and adhesiveness to metals at high temperature and having a high penetration, that is capable of maintaining a low elastic modulus and a low stress even in use at high temperature for long periods of time, and that enables reduction of the occurrence of bubbles and reduction of deterioration in releasability from a substrate and in electrical insulating properties.

The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a special capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.

The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a special capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.

The invention relates to curable compositions based on polyorganosiloxanes with special silicon-containing terminal groups, an adhesion promoter, a curing catalyst, and an additive having a ketone functional moiety. These compositions have improved mechanical and adhesion properties and excellent storage stability. The invention also relates to the uses thereof.

The invention relates to curable compositions based on polyorganosiloxanes with special silicon-containing terminal groups, an adhesion promoter, a curing catalyst, and an additive having a ketone functional moiety. These compositions have improved mechanical and adhesion properties and excellent storage stability. The invention also relates to the uses thereof.

A method for producing a composition containing compounds (A) and (B), wherein: an organosilicon compound represented by formula (3), an alkali metal cyanate represented by formula (4) and an amide compound represented by formula (5) are reacted with each other at 120° C. or less, thereby producing an organosilicon compound (A) represented by formula (1); and this organosilicon compound (A) is obtained in a composition that contains this organosilicon compound (A) and an organosilicon compound (B), which is a by-product of the above-described reaction and is represented by formula (2).

##STR00001##

(In the formulae, each of R.sup.1 and R.sup.2 is an alkyl group or the like; X is a halogen atom; M is an alkali metal; m is an integer from 1 to 10; n is an integer from 1 to 3; and k is an integer from 1 to 10.)

A method for producing a composition containing compounds (A) and (B), wherein: an organosilicon compound represented by formula (3), an alkali metal cyanate represented by formula (4) and an amide compound represented by formula (5) are reacted with each other at 120° C. or less, thereby producing an organosilicon compound (A) represented by formula (1); and this organosilicon compound (A) is obtained in a composition that contains this organosilicon compound (A) and an organosilicon compound (B), which is a by-product of the above-described reaction and is represented by formula (2).

##STR00001##

(In the formulae, each of R.sup.1 and R.sup.2 is an alkyl group or the like; X is a halogen atom; M is an alkali metal; m is an integer from 1 to 10; n is an integer from 1 to 3; and k is an integer from 1 to 10.)

Inks, paints, adhesives, and paint strippers may be formulated to include one or more surfactants, from one or more surfactant classes, such as siloxane derivatives of amino acids that have surface-active properties.

Described herein is coating composition comprising (a) a partially fluorinated polymer, wherein the fluorinated polymer comprises a C—F bond adjacent to a methylene (—CH.sub.2—) unit or a hydrohalogenated methylene (—CHX— where X is F, Cl, Br, or I) unit along the polymer backbone; (b) a protected amino silane; (c) an alkoxysilane; and (d) a non-fluorinated solvent. Also described herein are substrates coated with said coating composition and heated to bond the coating composition to the substrate.