An self-adhesive millable silicone rubber composition contains: 100 parts by mass of (A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms per molecule and an average polymerization degree of 100 or more; 5 to 50 parts by mass of (B) a reinforcing silica having a specific surface area of 50 m.sup.2/g or more; 0.1 to 5 parts by mass of (C) an organosilicon compound having epoxy and alkoxy groups per molecule; 0.1 to 5 parts by mass of (D) an organosilicon compound having isocyanate group and alkoxy groups per molecule; and an effective curing amount of (E) a curing agent. The content of an organosilicon compound having a siloxane bond and benzene ring per molecule is 0 to 0.1 parts by mass, and the content of an organosilicon compound having a siloxane bond and an epoxy group per molecule is 0 to 0.1 parts by mass.

A room-temperature-curable organopolysiloxane composition comprising (A) an organopolysiloxane resin which contains silanol groups in a specified amount and has a specified molecular weight and a specified three-dimensional net-like structure, (B) a hydrolyzable organosilane compound containing an organooxymethyl group and/or a partial hydrolysis-condensation product thereof, (C) a linear diorganopolysiloxane of which each molecule chain terminal is capped with a silanol group, and (D) a hydrolyzable to organosilane containing an amino group and/or a partial hydrolysis-condensation product thereof at specified content ratios can be produced easily and at low cost, and can be formed into a high-hardness cured article or coating film even when a metal compound that can serve as a condensation catalyst is not contained.

A room-temperature-curable organopolysiloxane composition comprising (A) an organopolysiloxane resin which contains silanol groups in a specified amount and has a specified molecular weight and a specified three-dimensional net-like structure, (B) a hydrolyzable organosilane compound containing an organooxymethyl group and/or a partial hydrolysis-condensation product thereof, (C) a linear diorganopolysiloxane of which each molecule chain terminal is capped with a silanol group, and (D) a hydrolyzable to organosilane containing an amino group and/or a partial hydrolysis-condensation product thereof at specified content ratios can be produced easily and at low cost, and can be formed into a high-hardness cured article or coating film even when a metal compound that can serve as a condensation catalyst is not contained.

A method for preparing a functionalized polymer, the method comprising the steps of: (i) polymerizing monomer to form a reactive polymer, and (ii) reacting the reactive polymer with an imine compound containing a heterocyclic group and a hydrocarbyloxy-substituted or silyloxy-substituted aryl group.

This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane which has a hydroxyl group or hydrolyzable group at both terminals of the molecular chain thereof; (B) 150-600 parts by mass of a hydrolyzable organopolysiloxane which has a specific hydrolyzable silyl group; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1-2 .Math.m and in which, among the particles, the content of coarse grains having a particle diameter of 10 .Math.m or more is 1 vol% or less relative to the total amount of component (D), as measured by the laser diffraction particle size distribution method; (E) 0.01-30 parts by mass of an adhesion promoter; and (F) 0.01-20 parts by mass of a pH indicator, wherein the thermal conductivity at 25° C. as measured by the hot disk method is 0.5 W/mK or more. The thermally conductive silicone composition has a higher thermal conductivity than the prior art, can be compressed to a thickness of 10 .Math.m or less, and also has high durability; furthermore, the thickening and hardening degree thereof after application in a semiconductor device or the like can be determined.

This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane which has a hydroxyl group or hydrolyzable group at both terminals of the molecular chain thereof; (B) 150-600 parts by mass of a hydrolyzable organopolysiloxane which has a specific hydrolyzable silyl group; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1-2 .Math.m and in which, among the particles, the content of coarse grains having a particle diameter of 10 .Math.m or more is 1 vol% or less relative to the total amount of component (D), as measured by the laser diffraction particle size distribution method; (E) 0.01-30 parts by mass of an adhesion promoter; and (F) 0.01-20 parts by mass of a pH indicator, wherein the thermal conductivity at 25° C. as measured by the hot disk method is 0.5 W/mK or more. The thermally conductive silicone composition has a higher thermal conductivity than the prior art, can be compressed to a thickness of 10 .Math.m or less, and also has high durability; furthermore, the thickening and hardening degree thereof after application in a semiconductor device or the like can be determined.

A sulfur-vulcanizable rubber compound comprises a silane functionalized diene elastomer, a silane coupling agent, and a silica filler. The silane coupling agent excludes an active sulfur moiety. The rubber compound is a reaction product of a siloxyl condensation reaction between the silane functionalized diene elastomer and the non-sulfur containing silane coupling agent. The coupling agent comprises at least one end terminating group reactive with a hydroxyl group contained on the silica filler and a silane moiety contained on a diene-based elastomer.

The present invention provides a polyimide film forming composition which comprises a polyamic acid or a polyimide in an oligomer form or in a low-molecular weight form, the polyamic acid or the polyimide being prepared from a diamine containing an intramolecular imide group, and thus can provide a polyimide film having improved heat resistance while retaining optical properties thereof. In addition, the polyimide film according to the present invention can reduce not only a laser energy density (E/D) required in the laser exfoliation process but also remarkably decrease an amount of ash generated by an exfoliation process, thereby further improving the reliability of a device in a display manufacturing process.

The present invention provides a polyimide film forming composition which comprises a polyamic acid or a polyimide in an oligomer form or in a low-molecular weight form, the polyamic acid or the polyimide being prepared from a diamine containing an intramolecular imide group, and thus can provide a polyimide film having improved heat resistance while retaining optical properties thereof. In addition, the polyimide film according to the present invention can reduce not only a laser energy density (E/D) required in the laser exfoliation process but also remarkably decrease an amount of ash generated by an exfoliation process, thereby further improving the reliability of a device in a display manufacturing process.

Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1)

##STR00001##

(wherein R.sup.1 represents an alkyl group; R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2)

##STR00002## (wherein R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa.Math.s at 25° C.); and (C) a curing catalyst.