C08K5/5477

Ion exchange membranes having low in-plane swelling
09941538 · 2018-04-10 · ·

Disclosed is an ion exchange membrane comprising a film of a perfluorosulfonic acid ionomer in its acid form; the film having a low in-plane swelling, such that the length and/or width of the film changes by less than 10% when the membrane is exposed to water. Further disclosed is an electrochemical device, such as a polymer electrolyte membrane fuel cell, comprising an electrolyte comprising the ion exchange membrane.

UV absorbing compounds, compositions comprising same and uses thereof

There is provided a range of novel compounds which have been demonstrated to have useful UV absorbing properties. These compounds will find use in a range of applications such as active components in sunscreen formulations, paints, plastics, fabrics, glass and UV protective coatings.

METHOD FOR PREPARING RUBBER COMPOSITION USING AMINOSILANE-BASED TERMINAL MODIFIER INTRODUCING FUNCTIONAL GROUP, AND RUBBER COMPOSITION PREPARED THEREBY

The present invention relates to a terminal modified and conjugated diene-based polymer rubber composition including a terminal modified and conjugated diene-based polymer which is characterized in that an aminosilane-based terminal modifier represented by Formula 1 or Formula 2 is combined at the terminal of a conjugated diene-based polymer, and a method for preparing the same.

Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).

Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).

CONDENSATION-CURABLE SILICONE RESIN COMPOSITION

One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance. Thus, the present invention is to provide a condensation-curable silicone composition comprising the following components (A) to (C): (A) 100 parts by mass of an organopolysiloxane which has a branched or network structure and has two or more hydrolyzable groups each bonded to a silicon atom and at least one of (R.sup.1SiO.sub.3/2) and (SiO.sub.4/2) units, wherein R.sup.1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, (B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and (C) at least one silazane compound represented by the following general formula (3) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B):

##STR00001##

CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME

Provided is a curable silicone composition having excellent handleability, and curing properties during sealing due to good hot-melt properties and low melt viscosity, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. The curable silicone composition comprises: (A) a hot-melt organopolysiloxane resin containing M and T units in certain ratios and having alkenyl groups; (B) an organosiloxane compound containing a specific siloxane unit and containing 10 mass % or more of an alkenyl group; (C) an organohydrogensiloxane compound; (D) a hydrosilylation catalyst; and (E) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (D). The composition is solid at 25 C. and has hot-melt properties at a temperature of 200 C. or lower.

PAINT COMPOSITION, COATED ARTICLE, AND METHOD FOR FORMING CURED FILM
20240409774 · 2024-12-12 · ·

Provided is a paint composition that can be easily manufactured and provides a cured film having excellent hardness, chemical resistance, antifouling properties, and weather resistance, the paint composition comprising: 100 parts by mass of (A) one or more polyols selected from acrylic polyols, polyester polyols, and polyether polyols; 0.5 to 20 parts by mass of (B) a silane coupling agent having an isocyanurate skeleton; and 5 to 100 parts by mass of (C) an organopolysiloxane represented by formula (I)


(SiO.sub.4/2).sub.a(R.sup.1SiO.sub.3/2).sub.b(R.sup.1.sub.2SiO.sub.2/2).sub.c(R.sup.1.sub.3SiO.sub.1/2).sub.d(R.sup.2O.sub.1/2).sub.e(I)

(wherein, each R.sup.1 independently denotes a substituted or unsubstituted C1-12 monovalent hydrocarbon group, R.sup.2 denotes a hydrogen atom or a C1-6 alkyl group, a, b, c, and d are numbers satisfying 0a1, 0b1, 0c0.5, 0d1, a+b+c+d=1, and 0.5<(a+b)1, and e is a number satisfying 0<e4).

PAINT COMPOSITION, COATED ARTICLE, AND METHOD FOR FORMING CURED FILM
20240409774 · 2024-12-12 · ·

Provided is a paint composition that can be easily manufactured and provides a cured film having excellent hardness, chemical resistance, antifouling properties, and weather resistance, the paint composition comprising: 100 parts by mass of (A) one or more polyols selected from acrylic polyols, polyester polyols, and polyether polyols; 0.5 to 20 parts by mass of (B) a silane coupling agent having an isocyanurate skeleton; and 5 to 100 parts by mass of (C) an organopolysiloxane represented by formula (I)


(SiO.sub.4/2).sub.a(R.sup.1SiO.sub.3/2).sub.b(R.sup.1.sub.2SiO.sub.2/2).sub.c(R.sup.1.sub.3SiO.sub.1/2).sub.d(R.sup.2O.sub.1/2).sub.e(I)

(wherein, each R.sup.1 independently denotes a substituted or unsubstituted C1-12 monovalent hydrocarbon group, R.sup.2 denotes a hydrogen atom or a C1-6 alkyl group, a, b, c, and d are numbers satisfying 0a1, 0b1, 0c0.5, 0d1, a+b+c+d=1, and 0.5<(a+b)1, and e is a number satisfying 0<e4).

LIQUID ADDITION-CURABLE FLUOROSILICONE COMPOSITION, SILICONE RUBBER, AND MOLDED ARTICLE
20250011595 · 2025-01-09 ·

[Problem]

One of the objects of the present invention is to provide a liquid addition-curable fluorosilicone composition that has a low compression set value after heating and curing, retains mechanical strength, and in particular, is suitably applied to injection molding. Further, the object of the present invention is to provide a fluorosilicone rubber obtained by heating and curing aforesaid composition, and a molded article of the fluorosilicone rubber.

[Solution]

An addition-curable fluorosilicone composition in a form of liquid at 23 C., comprises (A) an organopolysiloxane represented by the following general formula (1) and having a viscosity at 25 C. of 100 to 500,000 mPa.Math.s,

##STR00001## wherein R.sup.1 is, independently of each other, a group selected from the group consisting of an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, and an aralkyl group having 7 to 12 carbon atoms, x is an integer of 1 to 10, m is an integer of 0 to 100, and n is an integer of 1 to 800, provided that 5<=m+n<=800; (B) an organohydrogenpolysiloxane having two or more hydrogen atoms each bonded to a silicon atom per one molecule, in an amount such that the number of hydrogen atoms bonded to a silicon atom in Component (B) is 0.5 to 10, per one vinyl group bonded to a silicon atom in Component (A); (C) an addition-reaction catalyst in a catalytic amount; and (D) a reinforcing silica filler agent, a surface of which being treated with an organosilicon compound represented by the following general formula (2):

##STR00002## wherein R.sup.3 is, independently of each other, a group selected from the group consisting of an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, and an aralkyl group having 7 to 12 carbon atoms, R.sup.2 is, independently of each other, a group defined for R.sup.3 or a 3, 3, 3-trifluoropropyl group, provided that at least one R is a 3, 3, 3-trifluoropropyl group, and p is an integer that satisfies equation 1<=p<=20, in an amount of 10 to 60 parts by mass, relative to 100 parts by mass of Component (A).