A composition according to the present invention contains 100 parts by mass of a component (A) and 1-200 parts by mass of a component (B) and is solid at 25° C., the solid form being achieved at 25° C. without spray drying, impregnation into wax, or the like, and said composition is useful as an additive for a paint composition and an adhesive composition. The component (A) is an organic silicon compound represented by general formula (1), and the component (B) is at least one of organic silicon compounds represented by general formulas (2) and (3) ##STR00001##
(R.sup.1 and R.sup.2 represent, independently of each other, an alky group having 1-10 carbon atoms or the like, R.sup.3 and R.sup.4 represent, independently of each other, a divalent hydrocarbon group having 1-20 carbon atoms, m represents an integer from 1 to 3, R.sup.5 represents an alkyl group having 1-10 carbon atoms or the like, and R.sup.6 represents a divalent hydrocarbon group having 1-20 carbon atoms; however, an oxygen atom, a sulfur atom, etc., may be interposed between the aforementioned R.sup.5 and R.sup.6 and/or between carbon-carbon bonds in R.sup.6, and a hydrogen atom in R.sup.6 may be substituted by a halogen atom or the like.)

A chemical mechanical polishing composition for polishing a substrate having copper, barrier, and dielectric layers includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the polishing composition has a pH of greater than about 6 and the cationic silica abrasive particles have a zeta potential of at least 10 mV. The triazole compound is not benzotriazole or a benzotriazole compound. A method for chemical mechanical polishing a substrate including copper, barrier, and dielectric layers includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the copper, barrier, and dielectric layers from the substrate and thereby polish the substrate.

To provide an organic silicon compound having an average structural formula (1). ##STR00001##
(Z represents a 2 to 20-valent group containing an organosiloxane structure, each R.sup.1 independently represents an alkyl group or an aryl group, each R.sup.2 independently represents an alkyl group or an aryl group, each R.sup.3 independently represents a hydrogen atom, an alkyl group, an alkoxy group, or an O. (oxy radical), each R.sup.4 independently represents a hydrogen atom or an alkyl group, each A.sup.1 independently represents a single bond or an alkylene group free of a hetero atom, each A.sup.2 independently represents a single bond or a divalent linking group containing a hetero atom, m is a number of 1 to 3, p is a number of 1 to 10, q is a number of 1 to 10, and p+q represents a number satisfying from 2 to 20 corresponding to the valency number of Z.)

The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.

The invention relates to curable compositions based on curable polymers containing a special capped adhesion promoter, and optionally a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the uses thereof.

The invention relates to curable compositions based on polyorganosiloxanes with special silicon-containing terminal groups, a special capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention furthermore relates to the use thereof.

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

The present invention relates to a method for preparing a modified conjugated diene-based polymer, and more particularly, provides a method for preparing a modified conjugated diene-based polymer including a step of polymerizing a conjugated diene-based monomer in the presence of an organometal compound in a hydrocarbon solvent to prepare an active polymer which is coupled with an organometal (S1); and a step of reacting or coupling the active polymer prepared in step (S1) with a modifier (S2), wherein step (S1) is continuously performed in two or more polymerization reactors, and a polymerization conversion ratio in a first reactor among the polymerization reactors is 50% or less.

The present specification relates to a compound containing nitrogen, and a color conversion film, a backlight unit, and a display device, including the same.

The present invention is directed to a functionalized polymerization initiator, comprising the reaction product of an alkyl lithium compound and a compound of formula

##STR00001##

wherein R.sub.1=alkyl (C1-C8), aryl, substituted aryl, or SiR.sub.3 where R.sub.3 are independently C1-C8 alkyl, preferably SiMe.sub.3 where Me is methyl, or Si(CH.sub.3).sub.2C(CH.sub.3).sub.3; R.sub.2=C1-C8 alkyl, aryl, or substituted aryl, or SiR.sub.3, preferably CH.sub.3; and n=0-3. The invention is further directed to a method of making the functionalized inititiator, and a method of making a functionalized elastomer using the inititator.