Patent classifications
C08K7/10
SEAL RUBBER COMPOSITION AND SEALING MEMBER
A seal rubber composition contains a carboxyl group-containing acrylic rubber, silica, and two or more inorganic fibers, an amount of the silica per 100 parts by weight of the carboxyl group-containing acrylic rubber is 25 to 100 parts by weight, and a total amount of the inorganic fibers per 100 parts by weight of the carboxyl group-containing acrylic rubber is 35 to 100 parts by weight. A sealing member includes a sliding portion composed of a vulcanized product of the seal rubber composition.
SEAL RUBBER COMPOSITION AND SEALING MEMBER
A seal rubber composition contains a carboxyl group-containing acrylic rubber, silica, and two or more inorganic fibers, an amount of the silica per 100 parts by weight of the carboxyl group-containing acrylic rubber is 25 to 100 parts by weight, and a total amount of the inorganic fibers per 100 parts by weight of the carboxyl group-containing acrylic rubber is 35 to 100 parts by weight. A sealing member includes a sliding portion composed of a vulcanized product of the seal rubber composition.
Moisture-curable adhesive composition and a method for mounting tiles on wall surfaces
A moisture-curable adhesive composition comprises a polymer component selected from a silane-terminated polyalkylene oxide and/or a polyurethane; a plurality of amino-silane modified wollastonite fibers having an average aspect ratio of from about 1.5:1 to about 12:1 and an average fiber length of from about 6 μm to about 825 μm; at least two fillers, wherein one of said fillers is untreated and a second of said fillers is treated with a modifier selected from the group consisting of a fatty acid derivative, a silane, a titanate, and mixtures thereof wherein at least one of said fillers is irregularly shaped; and a rheology modifier. The composition preferably further comprises a plurality of irregularly-shaped crumb rubber particles having an average particle size of between about 0.5 to 1.5 mm. The composition is useful for adhering tiles to surfaces, especially large format tiles to substantially vertically-extending wall surfaces.
Moisture-curable adhesive composition and a method for mounting tiles on wall surfaces
A moisture-curable adhesive composition comprises a polymer component selected from a silane-terminated polyalkylene oxide and/or a polyurethane; a plurality of amino-silane modified wollastonite fibers having an average aspect ratio of from about 1.5:1 to about 12:1 and an average fiber length of from about 6 μm to about 825 μm; at least two fillers, wherein one of said fillers is untreated and a second of said fillers is treated with a modifier selected from the group consisting of a fatty acid derivative, a silane, a titanate, and mixtures thereof wherein at least one of said fillers is irregularly shaped; and a rheology modifier. The composition preferably further comprises a plurality of irregularly-shaped crumb rubber particles having an average particle size of between about 0.5 to 1.5 mm. The composition is useful for adhering tiles to surfaces, especially large format tiles to substantially vertically-extending wall surfaces.
METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION
A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.
METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION
A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.
METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION
A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.
POLYAMIDE COMPOSITION FOR OPTICAL ELEMENTS
Disclosed herein is a polyamide composition, comprising including from 30 wt % to 70 wt % of polyamide mixture and from 30 wt % to 70 wt % of filler mixture, and from 0 to 10 wt % of additives (E), based on the total weight of the polyamide composition. The polyamide composition provides advantage of good flatness and less dust particles, meanwhile the mechanical properties are maintained. Such advantage makes the polyamide composition especially suitable for the optical element application.
POLYAMIDE COMPOSITION FOR OPTICAL ELEMENTS
Disclosed herein is a polyamide composition, comprising including from 30 wt % to 70 wt % of polyamide mixture and from 30 wt % to 70 wt % of filler mixture, and from 0 to 10 wt % of additives (E), based on the total weight of the polyamide composition. The polyamide composition provides advantage of good flatness and less dust particles, meanwhile the mechanical properties are maintained. Such advantage makes the polyamide composition especially suitable for the optical element application.
RESIN COMPOSITION AND METHOD OF PRODUCING SAME, SHAPING MATERIAL, PACKAGING CONTAINER, AND SEMICONDUCTOR CONTAINER
A resin composition contains: a resin including one or more among a norbornene-based polymer, a monocyclic cycloolefin-based polymer, a cyclic conjugated diene-based polymer, a vinyl alicyclic hydrocarbon polymer, and hydrogenated products thereof; and a conductive fibrous filler having an aspect ratio of not less than 5 and not more than 500.