A composition for forming an electroactive coating includes an acid as a polymerization catalyst, at least one functional component, and at least one compound of formula (1) as a monomer: ##STR00001##
wherein X is selected from S, O, Se, Te, PR.sup.2 and NR.sup.2, Y is hydrogen (H) or a precursor of a good leaving group Y.sup.− whose conjugate acid (HY) has a pK.sub.a of less than 45, Z is hydrogen (H), silyl, or a good leaving group whose conjugate acid (HY) has a pK.sub.a of less than 45, b is 0, 1 or 2, each R.sup.1 is a substituent, and the at least one compound of formula (1) includes at least one compound of formula (1) with Z═H and Y≠H.

A composition for forming an electroactive coating includes an acid as a polymerization catalyst, at least one functional component, and at least one compound of formula (1) as a monomer: ##STR00001##
wherein X is selected from S, O, Se, Te, PR.sup.2 and NR.sup.2, Y is hydrogen (H) or a precursor of a good leaving group Y.sup.− whose conjugate acid (HY) has a pK.sub.a of less than 45, Z is hydrogen (H), silyl, or a good leaving group whose conjugate acid (HY) has a pK.sub.a of less than 45, b is 0, 1 or 2, each R.sup.1 is a substituent, and the at least one compound of formula (1) includes at least one compound of formula (1) with Z═H and Y≠H.

The present invention provides a composition comprising a) a phase change material; b) 1 to 10 wt % of a silica gelling additive; and c) a styrene co-polymer gelling additive; wherein the composition is in the form of a gel and wherein the weight ratio of b) silica gelling additive to c) styrene co-polymer gelling additive in the composition is in the range from 0.6 to 5:1. The invention also provides a method of making the composition and an article and a product comprising the composition. Finally, the invention provides the use of a combination of a silica gelling additive and a styrene co-polymer gelling additive to make a gel composition comprising a phase change material with one or more improved properties.

The present invention provides a composition comprising a) a phase change material; b) 1 to 10 wt % of a silica gelling additive; and c) a styrene co-polymer gelling additive; wherein the composition is in the form of a gel and wherein the weight ratio of b) silica gelling additive to c) styrene co-polymer gelling additive in the composition is in the range from 0.6 to 5:1. The invention also provides a method of making the composition and an article and a product comprising the composition. Finally, the invention provides the use of a combination of a silica gelling additive and a styrene co-polymer gelling additive to make a gel composition comprising a phase change material with one or more improved properties.

A shaped article comprising a polymer-based resin derived from cellulose, wherein the polymer-based resin has an HDT of at least 95° C., a bio-derived content of at least 20 wt %, a notched izod impact strength of greater than 80 J/m and at least one of the following properties chosen from: flexural modulus of greater than 1900 MPa; a spiral flow length or at least 3.0 cm; a flex creep deflection of less than 12 mm; a transmission of at least 70%; a ΔE value of less than 25; or an L* color of at least 85.

A shaped article comprising a polymer-based resin derived from cellulose, wherein the polymer-based resin has an HDT of at least 95° C., a bio-derived content of at least 20 wt %, a notched izod impact strength of greater than 80 J/m and at least one of the following properties chosen from: flexural modulus of greater than 1900 MPa; a spiral flow length or at least 3.0 cm; a flex creep deflection of less than 12 mm; a transmission of at least 70%; a ΔE value of less than 25; or an L* color of at least 85.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

A filling composition comprises (A) a mineral oil having a kinematic viscosity from 80 cSt to 100 cSt at 40° C.; (B) a styrene-ethylene/propylene diblock copolymer; and (C1) a propylene/ethylene copolymer having a weight average molecular weight (M.sub.w) from 5,000 to 200,000 or (C2) an ethylene/propylene copolymer having a weight average molecular weight (M.sub.w) from 5,000 to 200,000. The filling composition is used as a filling composition in a buffer tube.

A filling composition comprises (A) a mineral oil having a kinematic viscosity from 80 cSt to 100 cSt at 40° C.; (B) a styrene-ethylene/propylene diblock copolymer; and (C1) a propylene/ethylene copolymer having a weight average molecular weight (M.sub.w) from 5,000 to 200,000 or (C2) an ethylene/propylene copolymer having a weight average molecular weight (M.sub.w) from 5,000 to 200,000. The filling composition is used as a filling composition in a buffer tube.