In some examples, a method of coupling oligonucleotides to a polymer is provided. Inactive moieties in a first region of a polymer may be selectively irradiated with light, while inactive moieties in a second region of the polymer are not irradiated, to generate first active moieties in the first region of the polymer. The first active moieties may be coupled to first oligonucleotides. The inactive moieties in the second region of the polymer may be irradiated with light to generate second active moieties in the second region of the polymer. The second active moieties may be coupled to second oligonucleotides.

Provided is a PSA sheet that can be used on a metal adherend because it has anti-metal-corrosive properties and can also maintain good removability while preventing or inhibiting adherend surface contamination even when prolongedly adhered to the adherend. A PSA sheet having a PSA layer is provided. The PSA layer comprises at least 95% base polymer by weight and has a chloride ion amount of less than 300 μg per gram of pressure-sensitive adhesive layer, determined by hot water extraction.

Provided is a PSA sheet that can be used on a metal adherend because it has anti-metal-corrosive properties and can also maintain good removability while preventing or inhibiting adherend surface contamination even when prolongedly adhered to the adherend. A PSA sheet having a PSA layer is provided. The PSA layer comprises at least 95% base polymer by weight and has a chloride ion amount of less than 300 μg per gram of pressure-sensitive adhesive layer, determined by hot water extraction.

A thermoplastic resin composition of the present invention includes 65 to 85% by weight of a heat-resistant copolymer (A) containing 76 to 92% by weight of a (meth)acrylic acid alkyl ester compound, 1 to 8% by weight of an N-substituted maleimide compound, and 5 to 16% by weight of an aromatic vinyl compound; 10 to 30% by weight of an acrylate-based rubber-aromatic vinyl compound-vinyl cyanide compound graft copolymer (B) containing acrylate-based rubber having an average particle diameter of 50 to 200 nm; and 1 to 15% by weight of an acrylate-based rubber-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C) containing acrylate-based rubber having an average particle diameter of 300 to 600 nm. In this case, in the heat-resistant copolymer (A), the weight ratio of the aromatic vinyl compound to the N-substituted maleimide compound is 1.5 to 8.

A thermoplastic resin composition of the present invention includes 65 to 85% by weight of a heat-resistant copolymer (A) containing 76 to 92% by weight of a (meth)acrylic acid alkyl ester compound, 1 to 8% by weight of an N-substituted maleimide compound, and 5 to 16% by weight of an aromatic vinyl compound; 10 to 30% by weight of an acrylate-based rubber-aromatic vinyl compound-vinyl cyanide compound graft copolymer (B) containing acrylate-based rubber having an average particle diameter of 50 to 200 nm; and 1 to 15% by weight of an acrylate-based rubber-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C) containing acrylate-based rubber having an average particle diameter of 300 to 600 nm. In this case, in the heat-resistant copolymer (A), the weight ratio of the aromatic vinyl compound to the N-substituted maleimide compound is 1.5 to 8.

A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, X.sub.1 being C.sub.1-C.sub.6 substituted or unsubstituted alkyl, X.sub.2 being CH.sub.3 or H,

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After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.

Provided is a method for preparing a PSA composition for protecting Low-E glass plates from degradation and corrosion. A PSA composition preparation method is provided for Low-E glass plate protection. The method comprises a step of obtaining an aqueous liquid, and a step of obtaining a polymer-containing liquid comprising the aqueous liquid and a polymer. Here, the aqueous liquid satisfies at least (a) having an electrical conductivity below 300 μS/cm or (b) having a chloride ion concentration below 35 μg/mL.

Provided is a method for preparing a PSA composition for protecting Low-E glass plates from degradation and corrosion. A PSA composition preparation method is provided for Low-E glass plate protection. The method comprises a step of obtaining an aqueous liquid, and a step of obtaining a polymer-containing liquid comprising the aqueous liquid and a polymer. Here, the aqueous liquid satisfies at least (a) having an electrical conductivity below 300 μS/cm or (b) having a chloride ion concentration below 35 μg/mL.

A composition includes: a compound represented by the following Formula (1); a pigment; and a solvent. In a case where a film having a thickness of 4.0 m is formed using the composition, a maximum value of a light transmittance of the film in a thickness direction in a wavelength range of 360 nm to 700 nm is lower than 40%. In Formula (1), Z.sup.1 represents an (m+n)-valent linking group, Y.sup.1 and Y.sup.2 each independently represent a single bond or a linking group, A represents a group including a pigment adsorption portion, P.sup.1 represents a polymer chain, n represents 1 to 20, m represents 1 to 20, and m+n represents 3 to 21, at least one of Z.sup.1, A.sup.1, or P.sup.1 includes a photocurable group. ##STR00001##

An object of the present invention is to provide a colored resin composition comprising a squarylium dye excellent in heat resistance. The colored resin composition according to the present invention is a green colored resin composition comprising a colorant, a resin and a solvent. The colorant contains a squarylium dye, and the content percentage of the resin is 70 mass % or more based on an amount obtained by subtracting the content of the colorant and the solvent from the total amount of the green colored resin composition.