There is provided a phenolic resin composition as a molding material. It includes a resol-type phenolic resin (A) and a novolac-type phenolic resin (B). The novolac-type phenolic resin (B) includes a novolac-type phenolic resin (B1) represented by General Formula (1) and a modified novolac-type phenolic resin (B2) represented by General Formula (2).

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There is provided a phenolic resin composition as a molding material. It includes a resol-type phenolic resin (A) and a novolac-type phenolic resin (B). The novolac-type phenolic resin (B) includes a novolac-type phenolic resin (B1) represented by General Formula (1) and a modified novolac-type phenolic resin (B2) represented by General Formula (2).

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This tire laminate comprises a film of a thermoplastic resin composition and a layer of a rubber composition, and is characterized in that the rubber composition contains at least one type of rubber component, a condensate of formaldehyde and the compound represented by formula (1) (R.sup.1 to R.sup.5 in the formula are defined in the specification), at least one type of methylene donor and a vulcanizing agent, and in that there are 0.5-20 parts by mass of the condensate per total 100 parts by mass of the at least one type of rubber component, there are 0.25-200 parts by mass of the at least one type of methylene donor per total 100 parts by mass of the at least one type of rubber component, the mass ratio of the at least one type of methylene donor and the condensate is 0.5:1-10:1, and, based on the total amount of the at least one type of rubber component, the at least one type of rubber component includes 10-80 mass % of rubber in which the vinyl content in side chains of aliphatic unsaturated hydrocarbons exceeds 11 mol %. This tire laminate exhibits improved adhesive strength between the film of the thermoplastic resin composition and the layer of the rubber composition.

##STR00001##

This tire laminate comprises a film of a thermoplastic resin composition and a layer of a rubber composition, and is characterized in that the rubber composition contains at least one type of rubber component, a condensate of formaldehyde and the compound represented by formula (1) (R.sup.1 to R.sup.5 in the formula are defined in the specification), at least one type of methylene donor and a vulcanizing agent, and in that there are 0.5-20 parts by mass of the condensate per total 100 parts by mass of the at least one type of rubber component, there are 0.25-200 parts by mass of the at least one type of methylene donor per total 100 parts by mass of the at least one type of rubber component, the mass ratio of the at least one type of methylene donor and the condensate is 0.5:1-10:1, and, based on the total amount of the at least one type of rubber component, the at least one type of rubber component includes 10-80 mass % of rubber in which the vinyl content in side chains of aliphatic unsaturated hydrocarbons exceeds 11 mol %. This tire laminate exhibits improved adhesive strength between the film of the thermoplastic resin composition and the layer of the rubber composition.

##STR00001##

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).