Carbon phosphonitride (CPN) including tricyanophosphine (P(CN).sub.3), its pre-polymer (CPN-PP), and/or solid CPN (C.sub.3N.sub.3P) can serve as a useful additive for thermoset resins, resulting in improved thermal and mechanical properties.

An orthopaedic prosthesis includes a femoral component comprising polymeric materials. The polymeric materials may include a polyaromatic ether or a polyacetal. The orthopaedic prosthesis may include a component having an articular layer and a support layer adjacent the articular layer. The support layer may include a reinforcement fiber. The orthopaedic prosthesis may be a knee prosthesis.

An orthopaedic prosthesis includes a femoral component comprising polymeric materials. The polymeric materials may include a polyaromatic ether or a polyacetal. The orthopaedic prosthesis may include a component having an articular layer and a support layer adjacent the articular layer. The support layer may include a reinforcement fiber. The orthopaedic prosthesis may be a knee prosthesis.

A block copolymer including a polymer block (A) containing more than 70 mol % of a unit derived from an aromatic vinyl compound, and a polymer block (B) containing 30 mol % or more of a unit derived from a conjugated diene compound is provided. The block copolymer satisfies the conditions: (1): a content of the polymer block (A) in the block copolymer is 1 to 70% by mass; (2): a maximum width of a series of temperature regions where tan δ measured in accordance with JIS K7244-10 (2005), under conditions including a strain amount of 0.1%, a frequency of 1 a measurement temperature of −70 to 100° C., and a temperature rise rate of 3° C./min, is 1.0 or more is less than 16° C.; (3): a temperature at a peak position of tan δ in the condition (2) is 0° C. to +50° C.; and (4): a mobility parameter M indicating a mobility of the polymer block (B) is 0.01 to 0.25 sec.

A block copolymer including a polymer block (A) containing more than 70 mol % of a unit derived from an aromatic vinyl compound, and a polymer block (B) containing 30 mol % or more of a unit derived from a conjugated diene compound is provided. The block copolymer satisfies the conditions: (1): a content of the polymer block (A) in the block copolymer is 1 to 70% by mass; (2): a maximum width of a series of temperature regions where tan δ measured in accordance with JIS K7244-10 (2005), under conditions including a strain amount of 0.1%, a frequency of 1 a measurement temperature of −70 to 100° C., and a temperature rise rate of 3° C./min, is 1.0 or more is less than 16° C.; (3): a temperature at a peak position of tan δ in the condition (2) is 0° C. to +50° C.; and (4): a mobility parameter M indicating a mobility of the polymer block (B) is 0.01 to 0.25 sec.

A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).

A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##