The present invention relates to a process for the production of a polyurethane reinforced composite including mixing (A) a Polyisocyanate component including di- or Polyisocyanates (a) and (B) a polyol component including compounds having at least two groups reactive toward isocyanates (b), catalyst (c) and optionally further additives, to form a reaction mixture, contacting the reaction mixture with the reinforcing material at temperatures of less than 100 C. and curing the reaction mixture at temperatures of more than 100 C. to form a polyurethane reinforced composite. The catalyst (c) includes microencapsulated polyurethane catalyst which includes a capsule core, containing polyurethane catalyst, and an acrylic copolymer capsule shell. An average particle size D(0,5) of the microcapsules is 1 to 50 m. The invention further relates to a polyurethane reinforced composite obtainable by a process according to the invention.

A method includes admixing an aqueous polysaccharide solution into an oleaginous base fluid, and adding a divalent ion source to produce one or more polysaccharide microspheres.

A process is for preparing polymeric particles for use as impact modifiers in curable (meth)acrylic resin compositions. Further, the process relates to a cured (meth)acrylic resin composition, in particular to adhesive or coating materials containing polymeric particles dispersed in a cured (meth)acrylic resin matrix. Said composition can be advantageously used as an adhesive, coating or a composite material.

Resin compositions including (A) a hollow organic polymer particle, (B) an epoxy resin, and (C) a curing agent provide cured products having a superior smear removal properties.

Pressure-sensitive adhesive (PSA) strips, configured or adapted for the residue-free and non-destructive removal by which by substantially expanding it in the plane of adhesion, are provided. The PSA strips comprise at least one adhesive compound layer consisting of a PSA compound, constituted by vinyl aromatic block copolymers and one or more adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than 20 C., and a softening point (ring & ball) of greater than or equal to 70 C., and the PSA compound has being foamed.

The present invention relates to a curable composition containing (A) a cyclic molecule that contains three or more side chains each having at a terminal thereof an active hydrogen-containing group, (B) a urethane prepolymer having an iso(thio)cyanate group on each of both terminals of a molecule, (C) a diol, and (D) an amino group-containing monomer.

According to the present invention, it is possible to provide a curable composition that gives a cured product having a high abrasion resistance and capable of exhibiting superior mechanical properties, in particular, a curable composition that can give a cured product capable of being suitably used in a polishing pad.

Process for producing a pressure-sensitive adhesive comprising expanded microballoons, wherein the constituents for forming the adhesive are mixed in a first mixing assembly, the mixed adhesive is transferred into a second mixing assembly into which, at the same time, unexpanded microballoons are fed, the microballoons are expanded in the second mixing assembly or on exit from the second mixing assembly, the adhesive mixture with the expanded microballoons is shaped to a layer in a shaping assembly in which expanded microballoons which have broken through the surface are pressed into the layer surface and the layer of adhesive mixture together with the expanded microballoons are optionally applied to a weblike backing material.

A rub material (124) comprises a polymeric matrix (128) and polymeric micro-balloons (130) in the matrix.

The invention relates to a pressure-sensitive adhesive strip, for the residue-free and nondestructive removal by which by substantially expanding it in the plane of adhesion, comprising an adhesive compound layer, said adhesive compound layer consisting of a pressure-sensitive adhesive compound, constituted by vinyl aromatic block copolymers and adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than 20 C., preferably greater than 0 C., and a softening point (ring & ball) of greater than or equal to 70 C., preferably greater than or equal to 100 C., and the pressure-sensitive adhesive compound being foamed.

A rub material (124) comprises a polymeric matrix (128) and polymeric micro-balloons (130) in the matrix.