The present disclosure provides a solution composition having excellent acid corrosion resistance and adhesion to a steel sheet, a steel sheet surface-treated using the solution composition, and a method for manufacturing the steel sheet. Specifically, the present disclosure provides a solution composition for treating a surface of a steel sheet, the solution composition containing colloidal silica, alkoxy silane, a solvent, an acidity regulator, an acrylate-based monomer, an adhesion improver including a backbone formed of siloxane bonds, and a metal chelate curing agent, a steel sheet surface-treated using the solution composition, and a method for manufacturing the steel sheet.

The present disclosure provides a solution composition having excellent acid corrosion resistance and adhesion to a steel sheet, a steel sheet surface-treated using the solution composition, and a method for manufacturing the steel sheet. Specifically, the present disclosure provides a solution composition for treating a surface of a steel sheet, the solution composition containing colloidal silica, alkoxy silane, a solvent, an acidity regulator, an acrylate-based monomer, an adhesion improver including a backbone formed of siloxane bonds, and a metal chelate curing agent, a steel sheet surface-treated using the solution composition, and a method for manufacturing the steel sheet.

A liquid repellent structure includes a surface to which liquid repellency is to be imparted, and a liquid repellent layer formed on the surface. In the structure: the liquid repellent layer contains a binder resin containing a fluorine-containing resin, and a filler dispersed in the binder resin; the filler contains a first filler having a BET specific surface area M of 100 m.sup.2/g to 400 m.sup.2/g; and the ratio M/F of the BET specific surface area M of the first filler to a mass F (mass %) of the fluorine-containing resin relative to the total mass of the liquid repellent layer is 4.1 to 20.0.

The present invention relates to a method of manufacturing a solids-incorporating polymer comprising the steps of: I) providing an aqueous polymer dispersion, the dispersion comprising crystallizing polyurethane particles having a mean particle size of ≤500 nm and further comprising inorganic particles; II) storing the dispersion of step I) at a temperature of ≤0° C. until a precipitate is formed; III) Isolating the precipitate of step II) and IV) removing water from the isolated precipitate of step III), thereby obtaining a water-depleted precipitate. The invention also relates to a solid particulate composition which is obtainable by the method and the use of the composition as a build material in additive manufacturing processes, as a coating, an adhesive or as a rubber.

The present invention relates to a method of manufacturing a solids-incorporating polymer comprising the steps of: I) providing an aqueous polymer dispersion, the dispersion comprising crystallizing polyurethane particles having a mean particle size of ≤500 nm and further comprising inorganic particles; II) storing the dispersion of step I) at a temperature of ≤0° C. until a precipitate is formed; III) Isolating the precipitate of step II) and IV) removing water from the isolated precipitate of step III), thereby obtaining a water-depleted precipitate. The invention also relates to a solid particulate composition which is obtainable by the method and the use of the composition as a build material in additive manufacturing processes, as a coating, an adhesive or as a rubber.

Disclosed are photo-curable compositions and processes to produce a 3D high-frequency dielectric material for use as an insulator in a circuit such as, for example, a high-performance RF component such as, for example, an antenna for electromagnetic transmission, a filter, a transmission line, or a high frequency interconnect. The high frequency circuit structures have a very low dielectric loss at operating frequencies (1-60 GHz).

Disclosed are photo-curable compositions and processes to produce a 3D high-frequency dielectric material for use as an insulator in a circuit such as, for example, a high-performance RF component such as, for example, an antenna for electromagnetic transmission, a filter, a transmission line, or a high frequency interconnect. The high frequency circuit structures have a very low dielectric loss at operating frequencies (1-60 GHz).

Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.

Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.

A conductive polymer coating composition including a conductive fibrillated structure and a base polymer, wherein the conductive fibrillated structure includes a fibrillated polymer and a conductive polymer grafted on the fibrillated polymer, and wherein the conductive polymer coating composition has an electrical conductivity from about 10.sup.−5 S/cm to about 10.sup.+1 S/cm and a thermal conductivity from about 1.1 W/m K to about 3 W/m K.