C09D7/63

NANOCRYSTALLINE AND MESOPOROUS ANATASE TiO2 FILMS COMPOSITION AND ITS SYNTHESIZING PROCESS THEREOF

The process comprises treating 90-190 g titanium (IV) chloride in 10-100 ml de-ionized water for preparing Titanium cation (Ti.sup.4+); treating 130-275 ml potassium persulfate in 10-100 ml double-distilled water and keeping at constant temperature to obtain sulphate/oxide; dipping substrates into titanium (IV) chloride solution and re-dipping in de-ionized water to remove loosely bonded ions, if could be any; dipping substrates into potassium persulfate solution and re-dipping in de-ionized water to remove loosely bonded ions, if could be any, and keeping at 50-90° C. for complete one cycle; treating obtained Titanium cation (Ti.sup.4+) with sulphate/oxide and obtaining whitish layer on the substrate surface by necked eyes after about 10-15 cycles, suggesting initiation of film formation, wherein the deposition thickness of TiO.sub.2 layer is increased from 0.3-2.0-micron on determined 5-50 deposition cycles; and rinsing deposited films with de-ionized water and air annealed at 400-600° C. temperature to obtain anatase TiO.sub.2.

NANOCRYSTALLINE AND MESOPOROUS ANATASE TiO2 FILMS COMPOSITION AND ITS SYNTHESIZING PROCESS THEREOF

The process comprises treating 90-190 g titanium (IV) chloride in 10-100 ml de-ionized water for preparing Titanium cation (Ti.sup.4+); treating 130-275 ml potassium persulfate in 10-100 ml double-distilled water and keeping at constant temperature to obtain sulphate/oxide; dipping substrates into titanium (IV) chloride solution and re-dipping in de-ionized water to remove loosely bonded ions, if could be any; dipping substrates into potassium persulfate solution and re-dipping in de-ionized water to remove loosely bonded ions, if could be any, and keeping at 50-90° C. for complete one cycle; treating obtained Titanium cation (Ti.sup.4+) with sulphate/oxide and obtaining whitish layer on the substrate surface by necked eyes after about 10-15 cycles, suggesting initiation of film formation, wherein the deposition thickness of TiO.sub.2 layer is increased from 0.3-2.0-micron on determined 5-50 deposition cycles; and rinsing deposited films with de-ionized water and air annealed at 400-600° C. temperature to obtain anatase TiO.sub.2.

RESIN COMPOSITION, ANTI-ETCHING LAYER AND ETCHING METHOD

A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).

RESIN COMPOSITION, ANTI-ETCHING LAYER AND ETCHING METHOD

A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).

Multilayer structure and method for producing same, coating liquid, packaging material, and protective sheet for electronic devices

The present invention relates to a multilayer structure including a base (X) and a layer (Y), wherein the layer (Y) includes an aluminum-containing compound (A) and a phosphorus compound (BH) in which a phosphorus atom having at least one hydroxy group and a polar group are bonded via an alkylene chain having 3 to 20 carbon atoms or a polyoxyalkylene chain based on an alkylene having 3 to 20 carbon atoms, and the aluminum-containing compound (A) is a compound (Ab) including a reaction product (D) of an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).

Multilayer structure and method for producing same, coating liquid, packaging material, and protective sheet for electronic devices

The present invention relates to a multilayer structure including a base (X) and a layer (Y), wherein the layer (Y) includes an aluminum-containing compound (A) and a phosphorus compound (BH) in which a phosphorus atom having at least one hydroxy group and a polar group are bonded via an alkylene chain having 3 to 20 carbon atoms or a polyoxyalkylene chain based on an alkylene having 3 to 20 carbon atoms, and the aluminum-containing compound (A) is a compound (Ab) including a reaction product (D) of an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).

Coated fiber and method

A coated fiber for polymer reinforcement is disclosed. The coated fiber comprises a fiber and a coating disposed about said fiber. The fiber has a denier of from about 250 to about 3,000. The coating comprises a branched polyethylene imine. The fiber is present in the coated fiber in an amount of from about 80 to about 99.8 percent by weight and the coating is present in the coated fiber in an amount of from about 0.2 to about 20 percent by weight, with percent by weight based on the total weight of the coated fiber. A method of producing the coated fiber is also disclosed.

Coated fiber and method

A coated fiber for polymer reinforcement is disclosed. The coated fiber comprises a fiber and a coating disposed about said fiber. The fiber has a denier of from about 250 to about 3,000. The coating comprises a branched polyethylene imine. The fiber is present in the coated fiber in an amount of from about 80 to about 99.8 percent by weight and the coating is present in the coated fiber in an amount of from about 0.2 to about 20 percent by weight, with percent by weight based on the total weight of the coated fiber. A method of producing the coated fiber is also disclosed.

Protective coating composition for substrates in contact with molten metal

A coating composition and a method of making a coating composition is provided. The coating composition includes: a) a binder system comprising a mixture of a caramelized carbohydrate component, an inorganic colloidal binder, and an adjuvant; and b) a protective agent. The coating composition is useful for protecting articles from corrosion and/or erosion caused by contact with molten metal.

Protective coating composition for substrates in contact with molten metal

A coating composition and a method of making a coating composition is provided. The coating composition includes: a) a binder system comprising a mixture of a caramelized carbohydrate component, an inorganic colloidal binder, and an adjuvant; and b) a protective agent. The coating composition is useful for protecting articles from corrosion and/or erosion caused by contact with molten metal.