The present invention provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise a population of nanostructures comprising polyfunctional poly(alkylene oxide) ligands. The present invention also provides nanostructure films comprising the nanostructure compositions and methods of making nanostructure films using the nanostructure compositions.

The present invention provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise a population of nanostructures comprising polyfunctional poly(alkylene oxide) ligands. The present invention also provides nanostructure films comprising the nanostructure compositions and methods of making nanostructure films using the nanostructure compositions.

There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH.sub.2).sub.n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH.sub.2).sub.n—COOH (n=4-7).

One embodiment relates to a water-based inkjet yellow ink containing a yellow pigment (A) having a specific partial structure, an organic solvent, a basic organic compound, and water, wherein an amount of the yellow pigment (A) is 1 to 10% by mass of a total mass of the water-based inkjet yellow ink, the basic organic compound contains 0.1 to 1.25% by mass of a basic organic compound (B) having a pKa value of 9.5 or less at 25° C. of the total mass of the water-based inkjet yellow ink, and an amount of an organic solvent having a boiling point of 240° C. or higher under 1 atmosphere is 5% by mass or less of the total mass of the water-based inkjet yellow ink.

One embodiment relates to a water-based inkjet yellow ink containing a yellow pigment (A) having a specific partial structure, an organic solvent, a basic organic compound, and water, wherein an amount of the yellow pigment (A) is 1 to 10% by mass of a total mass of the water-based inkjet yellow ink, the basic organic compound contains 0.1 to 1.25% by mass of a basic organic compound (B) having a pKa value of 9.5 or less at 25° C. of the total mass of the water-based inkjet yellow ink, and an amount of an organic solvent having a boiling point of 240° C. or higher under 1 atmosphere is 5% by mass or less of the total mass of the water-based inkjet yellow ink.

An example of a fluid set includes a primer fluid, a fixer fluid, and an aqueous inkjet ink. The primer fluid includes a first binder, which is a combination of a first acrylic binder and zirconium acetate, or a combination of the first acrylic binder and a first polyurethane binder. The fixer fluid includes a cationic salt and an organic acid. The aqueous inkjet ink includes a second binder selected from the group consisting of a second acrylic binder, a second polyurethane binder, and a combination thereof, a pigment, a surfactant, a co-solvent, and a balance of water.

An example of a fluid set includes a primer fluid, a fixer fluid, and an aqueous inkjet ink. The primer fluid includes a first binder, which is a combination of a first acrylic binder and zirconium acetate, or a combination of the first acrylic binder and a first polyurethane binder. The fixer fluid includes a cationic salt and an organic acid. The aqueous inkjet ink includes a second binder selected from the group consisting of a second acrylic binder, a second polyurethane binder, and a combination thereof, a pigment, a surfactant, a co-solvent, and a balance of water.

A light device solvent, a light emitting device ink comprising same, and a method for manufacturing a display device are provided. A method for manufacturing a display device comprises the acts of: spraying a device ink, which comprises a first element solvent and a light emitting element dispersed in the first element solvent, onto a target substrate having a first electrode and a second electrode thereon; forming a second element solvent, which has an isomeric structure of the molecular structure of the first element solvent, and loading the light emitting element on the first electrode and the second electrode; and removing the second element solvent.

A light device solvent, a light emitting device ink comprising same, and a method for manufacturing a display device are provided. A method for manufacturing a display device comprises the acts of: spraying a device ink, which comprises a first element solvent and a light emitting element dispersed in the first element solvent, onto a target substrate having a first electrode and a second electrode thereon; forming a second element solvent, which has an isomeric structure of the molecular structure of the first element solvent, and loading the light emitting element on the first electrode and the second electrode; and removing the second element solvent.

A 3-D printed device comprising one or more interconnect structures, the interconnect structures comprising a plurality of conductive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a conductive ink composition; applying the conductive ink composition to a substrate in a 3-D solvent cast printing process to form one or more interconnect structures; and drying the one or more interconnect structures formed from the conductive ink composition. The dried interconnect structures exhibit a conductivity equal to or greater than 1×10.sup.5 S/m without having to be subjected to any post-processing sintering treatment.