C09D161/12

Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resin

An object of the present invention is to provide a new compound that is useful as a film forming material for lithography and the like. The above object can be achieved by a compound represented by the following formula (1). ##STR00001##

Hardmask composition, hardmask layer and method of forming patterns

A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1, ##STR00001## wherein, in Chemical Formula 1, A is a substituted or unsubstituted dihydroxypyrene moiety, and E is a substituted or unsubstituted pyrenyl group.

Hardmask composition, hardmask layer and method of forming patterns

A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1, ##STR00001## wherein, in Chemical Formula 1, A is a substituted or unsubstituted dihydroxypyrene moiety, and E is a substituted or unsubstituted pyrenyl group.

Adhesion composition and textile materials and articles treated therewith
11066582 · 2021-07-20 · ·

This invention relates to improved adhesion compositions and textile materials and articles treated therewith. The improved adhesion composition comprises a non-crosslinked resorcinol-formaldehyde and/or resorcinol-furfural condensate (or a phenol-formaldehyde condensate that is soluble in water), a rubber latex, and an aldehyde component such as 2-furfuraldehyde. The composition may be applied to textile substrates and used for improving the adhesion between the treated textile substrates and rubber materials. End-use articles that contain the treated textile-rubber composite include, without limitation, automobile tires, belts, and hoses as well as printing blankets.

Adhesion composition and textile materials and articles treated therewith
11066582 · 2021-07-20 · ·

This invention relates to improved adhesion compositions and textile materials and articles treated therewith. The improved adhesion composition comprises a non-crosslinked resorcinol-formaldehyde and/or resorcinol-furfural condensate (or a phenol-formaldehyde condensate that is soluble in water), a rubber latex, and an aldehyde component such as 2-furfuraldehyde. The composition may be applied to textile substrates and used for improving the adhesion between the treated textile substrates and rubber materials. End-use articles that contain the treated textile-rubber composite include, without limitation, automobile tires, belts, and hoses as well as printing blankets.

UNDERLAYER FILM FORMING COMPOSITION
20210294214 · 2021-09-23 ·

An object of the present invention is to provide a useful underlayer film forming composition. The following underlayer film forming composition can solve the problem described above. An underlayer film forming composition comprising: a compound having a constituent unit represented by the following formula (1); and a solvent, wherein the weight average molecular weight of the compound is 1,000 to 30,000 as the molecular weight in terms of polystyrene, and the solubility of the compound in propylene glycol monomethyl ether acetate is 10% by mass at 23° C.:

##STR00001##

wherein A is a single bond or a divalent group; each R.sup.1 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group; each R.sup.2 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group, where at least one R.sup.2 is a hydroxy group and/or a thiol group; each m.sup.1 is independently an integer of 0 to 5; each m.sup.2 is independently an integer of 0 to 8; and each p.sup.2 is independently an integer of 0 to 2.

UNDERLAYER FILM FORMING COMPOSITION
20210294214 · 2021-09-23 ·

An object of the present invention is to provide a useful underlayer film forming composition. The following underlayer film forming composition can solve the problem described above. An underlayer film forming composition comprising: a compound having a constituent unit represented by the following formula (1); and a solvent, wherein the weight average molecular weight of the compound is 1,000 to 30,000 as the molecular weight in terms of polystyrene, and the solubility of the compound in propylene glycol monomethyl ether acetate is 10% by mass at 23° C.:

##STR00001##

wherein A is a single bond or a divalent group; each R.sup.1 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group; each R.sup.2 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group, where at least one R.sup.2 is a hydroxy group and/or a thiol group; each m.sup.1 is independently an integer of 0 to 5; each m.sup.2 is independently an integer of 0 to 8; and each p.sup.2 is independently an integer of 0 to 2.

PROCESS FOR THE PREPARATION OF METALLIC NANO-PARTICLE LAYERS AND THEIR USE FOR DECORATIVE OR SECURITY ELEMENTS
20210171786 · 2021-06-10 · ·

The present invention relates to a process for the preparation of thin silver nanoparticle layers, which are produced directly on a substrate as part of a coating or printing process. The layers show different colours in transmittance and reflectance. The layers do not show the typical conductivity of metallic layers, since the particles are essentially discrete particles which are not sintered. The invention further relates to decorative and security elements. When the layers are applied over a security element, such as a hologram, the obtained products show also different colours in reflection and transmission, an extremely bright optically variable image (OVD image) and high purity and contrast. Depending on the thickness of the layer a more or less intensive metallic aspect appears.

PROCESS FOR THE PREPARATION OF METALLIC NANO-PARTICLE LAYERS AND THEIR USE FOR DECORATIVE OR SECURITY ELEMENTS
20210171786 · 2021-06-10 · ·

The present invention relates to a process for the preparation of thin silver nanoparticle layers, which are produced directly on a substrate as part of a coating or printing process. The layers show different colours in transmittance and reflectance. The layers do not show the typical conductivity of metallic layers, since the particles are essentially discrete particles which are not sintered. The invention further relates to decorative and security elements. When the layers are applied over a security element, such as a hologram, the obtained products show also different colours in reflection and transmission, an extremely bright optically variable image (OVD image) and high purity and contrast. Depending on the thickness of the layer a more or less intensive metallic aspect appears.

Composition for forming organic film

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process. ##STR00001##