The present invention provides high temperature performing, conductive thermosetting resin compositions.

A fixing film including: a substrate having a cylindrical shape; a sliding layer that is formed on an inner peripheral surface side of the substrate and includes a polyimide resin; and a release layer that is formed on an outer peripheral surface side of the substrate, wherein the sliding layer has a first film and a second film laminated in the stated order from a side closer to the substrate, wherein the first film includes a first structural unit represented by a specific formula, or the first structural unit and a second structural unit represented by a specific formula, the second film includes only the second structural unit, and a mass ratio (A):(B) of the first structural unit and the second structural unit contained in the first film is 100:0 to 60:40.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Provided is an aqueous amine-free coating composition including at least one aromatic polymer, wherein the aromatic polymer is in the form of powder having a d.sub.90 less than or equal to 20 μm and in that the aqueous coating composition further includes polar aprotic solvent at a content greater than 0% by weight and less than or equal to 25% by weight. Also provided is an aqueous amine-free non-stick coating composition including such an aqueous composition for a coating, and the respective methods for producing same. Further provided is a method for producing an item on one of the faces of a metal substrate, from at least one layer of the coating composition or one layer of the non-stick coating composition.

The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

A flexible electronic device containing a polyimide film exhibiting excellent C-V characteristics. The polyimide film is a film that shows a maximum gradient of 0.005N or more in a capacitance-voltage measurement of a laminate in which a polyimide film having a film thickness of 0.75 μm is formed on a silicon wafer having a resistance value of 4 Ωcm; the maximum gradient meaning a maximum value of an absolute value of a gradient in a normalized capacity-voltage curve during a third scan of forward direction scans; a capacity-voltage curve being measured by applying a direct current voltage is to the polyimide film with respect to the silicon wafer between a lowest voltage V1 and a highest voltage V2, and measuring capacitance while the direct current voltage is scanned in a forward direction and scanned in a negative direction; the normalized capacity-voltage curve is being normalized so that the capacity at the lowest voltage V1 is 1.

A polyimide-forming composition includes a particulate polyimide precursor composition having an average particle size of 0.1 to 100 micrometers wherein the polyimide precursor composition comprises a substituted or unsubstituted C.sub.4-40 bisanhydride, and a substituted or unsubstituted divalent C.sub.1-20 diamine; an aqueous carrier; and a surfactant. A method of manufacturing an article including a polyimide includes the steps of forming a preform comprising the polyimide-forming composition; and heating the preform at a temperature and for a period of time effective to imidize the polyimide precursor composition and form the polyimide. An article prepared by the method, and a layer or coating including a polyimide and a surfactant are also described.

A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E.sub.2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E.sub.1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

A polyimide precursor solution includes a polyimide precursor having a weight average molecular weight within a range of 20000 to 80000, particles, and an aqueous solvent. The aqueous solvent contains an organic amine compound (A) (excluding a water-soluble organic solvent (B) described below), a water-soluble organic solvent (B) containing at least one selected from the group consisting of N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, N,N-dimethylformamide, and N,N-dimethylacetamide, and water (C). A content ratio [(A):(B):(C)] of (A), (B), and (C) is within a range of 0.02 to 0.07:0.02 to 0.05:0.88 to 0.96 in terms of mass ratio.

The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.