Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm.sup.2. The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.

Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm.sup.2. The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.

A method of forming a cutting element for an earth-boring tool. The method includes providing diamond particles on a supporting substrate, the volume of diamond particles comprising a plurality of diamond nanoparticles. A catalyst-containing layer is provided on exposed surfaces of the volume of diamond nanoparticles and the supporting substrate. The diamond particles are processed under high temperature and high pressure conditions to form a sintered nanoparticle-enhanced polycrystalline compact. A cutting element and an earth-boring tool including a cutting element are also disclosed.

A method of forming a cutting element for an earth-boring tool. The method includes providing diamond particles on a supporting substrate, the volume of diamond particles comprising a plurality of diamond nanoparticles. A catalyst-containing layer is provided on exposed surfaces of the volume of diamond nanoparticles and the supporting substrate. The diamond particles are processed under high temperature and high pressure conditions to form a sintered nanoparticle-enhanced polycrystalline compact. A cutting element and an earth-boring tool including a cutting element are also disclosed.

Devices, methods and systems are provided for preserving the surface of vehicles. The system includes a mobile housing such as a pull behind trailer that contains a purified water storage tank, a clothes washer and drier, a water heater, a multimedia filtration system, a Reverse Osmosis (RO) System, a discharge pump, and a booster pressure pump. Smaller satellite tank trailers may be serviced by larger system described herein to allow simultaneous washings. A high concentration SiO2 ceramic coating is applied with SiO2 concentration ranging between 49.9% and 64.1%.

Use of dry electrolytes to polish metal surfaces through ion transport. A conductive liquid of the dry electrolyte includes at least a sulfonic acid. According to one embodiment, the porous particles of the dry electrolyte include sulfonate polymer, such as, polystyrene divinylbenzene. According to one embodiment, the conductive liquid of the dry electrolyte includes methane-sulfonic acid. Preferably, the concentration of the sulfonic acid in relation to the solvent is ranging from 1 to 70%. Optionally, the conductive liquid of the dry electrolyte includes a complexing agent and/or a chelating agent.

Use of dry electrolytes to polish metal surfaces through ion transport. A conductive liquid of the dry electrolyte includes at least a sulfonic acid. According to one embodiment, the porous particles of the dry electrolyte include sulfonate polymer, such as, polystyrene divinylbenzene. According to one embodiment, the conductive liquid of the dry electrolyte includes methane-sulfonic acid. Preferably, the concentration of the sulfonic acid in relation to the solvent is ranging from 1 to 70%. Optionally, the conductive liquid of the dry electrolyte includes a complexing agent and/or a chelating agent.

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H.sub.2O.sub.2), ammonium persulfate ((NH.sub.4).sub.2S.sub.2O.sub.8), peroxymonosulfuric acid (H.sub.2SO.sub.5), ozone (O.sub.3) in de-ionized water, and sulfuric acid (H.sub.2SO.sub.4).

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H.sub.2O.sub.2), ammonium persulfate ((NH.sub.4).sub.2S.sub.2O.sub.8), peroxymonosulfuric acid (H.sub.2SO.sub.5), ozone (O.sub.3) in de-ionized water, and sulfuric acid (H.sub.2SO.sub.4).

Methods of temporarily enhancing the luster and/or brilliance of a piece of jewelry, a gem stone, or a piece of jewelry including a gem stone including applying a non-aqueous composition to the piece of jewelry, the gem stone, or the piece of jewelry including a gem stone.