Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.

A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.

The present invention relates to a pressure sensitive adhesive composition comprising: (i) at least one butene-1 (co)polymer; (ii) at least one liquid tackifier; (iii) at least one solid tackifier; (iv) at least one styrene copolymer; (v) optionally at least one further (co)polymer, different from (i) and (iv); (vi) optionally at least one additive. Furthermore, the use of the pressure sensitive adhesive composition according to the invention as closing mean for a packaging unit for foods, for packaging units to be heated in a microwave or oven, for a closing mean for packaging unit for drugs, hygienic tissues, cleaning tissues or cosmetic tissues. An article comprising the pressure sensitive adhesive composition according to the invention and a method of obtaining the article.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec.sup.−1 and measured at a temperature of 120° C., being 5.0×10.sup.3 poise to 1.0×10.sup.5 poise inclusive.

A polydiorganosiloxane having a silicon bonded poly(meth)acrylate polymer or copolymer is useful in a polyorganosiloxane hybrid pressure sensitive adhesive composition that cures to form a polyorganosiloxane hybrid pressure sensitive adhesive. An adhesive article including the polyorganosiloxane hybrid pressure sensitive adhesive is also disclosed.

The present disclosure relates to a method for manufacturing a display device and a display device. The method includes providing an unbent flexible layer, the flexible layer having a first side and a second side opposite to each other and further having a portion to be bent for forming a bent portion, applying a first curable layer on the first side of the portion to be bent, partially curing the first curable layer to form a first partially cured layer, applying and curing a second curable layer on the first partially cured layer to form a second cured layer, wherein a tack free time of the second curable layer is less than that of the first curable layer, disposing a first structural layer on the first side of the flexible layer, and bending the portion to be bent prior to the first partially cured layer is fully cured.

The present invention relates to an adhesive sheet laminate which comprises a substrate layer composed of a thermoplastic resin composition (A) containing a polypropylene-based resin as a main component, an adhesive layer composed of a thermoplastic resin composition (B) containing a specific thermoplastic resin (b) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and a release layer composed of a thermoplastic resin composition (C) containing a specific thermoplastic resin (c) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and which has a tensile elastic modulus of 2000 MPa or more.