Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass

Abstract

Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.

Claims

1. A composition for forming an adhesive film, wherein the composition for forming the adhesive film comprises: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or a metal hydroxide, wherein the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, barium oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide, or in parts by weight, the composition for forming the adhesive film comprises: 100 parts of a matrix resin, 0.01˜ 5 parts of a metal ion trapping agent and 0.01 ˜5 parts of an organic co-crosslinker.

2. The composition for forming the adhesive film according to claim 1, wherein the layered transition metal oxide is A.sub.2M.sub.12X.sub.6 or A.sub.3M.sub.2X.sub.6, wherein, A is Na or Li; M is +2-valent metal, X is Sb, Bi, Nb or Ru; and preferably, the layered transition metal oxide is NaNi.sub.2Sb.sub.5 and/or Li.sub.3Ni.sub.1.5Mg.sub.3.5 Sb.sub.6.

3. The composition for forming the adhesive film according to claim 1, wherein the amide organic compound has a structure shown in Formula (1), ##STR00003## R.sub.1 is H, a group A, a substituent formed by substituting at least one hydrogen atom in the group A with a hydroxyl, an amino or an epoxy, or a substituent formed by substituting at least one methylene in the group A with a carbonyl or an ether bond, the group A is a straight-chain alkyl, a branched-chain alkyl or a cycloalkyl, and the number of carbon atoms of the group A is 510; the number of carbon atoms of R.sub.2 is 2 ˜20; and R.sub.2 is selected from vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, decaenyl, undecenyl, dodecenyl, tetradecenyl, hexadecenyl or octadecenyl.

4. The composition for forming the adhesive film according to claim 3, wherein the amide organic compound is selected from one or more in a group consisting of acrylamide, methacrylamide, N-methacrylarnide, N-ethylacrylamde, N,N′-dimethylacrylamide, N-isopropylacrylamide, N-tert-butylacrylamide, N-methylolacrylamide, N-hydroxyethylacrylamide, N-(2-hydroxypropyl) acrylamide, N,N′-methylenebisacrylamide, maleyl imine, oleic acid amide, 9-hexadecenamide, N-(2-hydroxyethyl) -undec-10-enamide, 9-tetradecenamide, 9-dodecenamide, 9-decenamide, octanamide, heptamide, hexanamide, pentanamide, and butanamide.

5. The composition for forming the adhesive film according to claim 1, wherein a melt index of the ethylene copolymer matrix resin is 0.5˜45 g/10 min, preferably 3˜20 g/10 min, and more preferably 5˜10 g/10 min.

6. The composition for forming the adhesive film according to claim 4, wherein the ethylene copolymer matrix resin is selected from one or more in a group consisting of ethylene-polar monomer copolymer, ethylene-alpha-olefin copolymer and ethylene-cycloolefin copolymer.

7. The composition for forming the adhesive film according to claim 5, wherein the ethylene copolymer matrix resin is the ethylene-polar monomer copolymer, and a polar monomer for forming the ethylene-polar monomer copolymer is selected from an unsaturated carboxylic acid, an unsaturated acid anhydride, an unsaturated carboxylic acid salt, an unsaturated carboxylic acid ester, an amide formed by the unsaturated carboxylic acid, a vinyl ester, a carbon monoxide or a sulfur dioxide, preferably, the unsaturated carboxylic acid is selected from acrylic acid, methacrylic acid, fumaric acid or itaconic acid; preferably, the unsaturated acid anhydride is selected from maleic anhydride or itaconic anhydride; preferably, the unsaturated carboxylic acid salt is selected from lithium salt, sodium salt: potassium salt, magnesium salt, calcium salt or zinc salt formed by the following carboxylic acids acrylic acid, methacrylic acid, fumaric acid, itaconic acid, maleic anhydride or itaconic anhydride, and preferably, the unsaturated carboxylic acid ester is selected from one or more in a group consisting of methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, n-butyl acrylate, isooctyl acrylate, ethyl methacrylate, isobutyl methacrylate, dimethyl maleate, vinyl acetate, vinyl ester, vinyl propionate, monomethyl maleate and monoethyl maleate.

8. The composition for forming the adhesive film according to claim 5, wherein the ethylene copolymer matrix resin is an ethylene-alpha-olefin copolymer, and the ethylene-alpha-olefin copolymer is a copolymer of ethylene and at least one alphα-olefin with less than 10 carbon atoms; and preferably, the alphα-olefin with less than 10 carbon atoms is selected from propylene, 1-butene, 1-hexene, 1-pentene, 1-octene or 4-methyl-1-pentene.

9. The composition for forming the adhesive film according to claim 5, wherein the ethylene copolymer matrix resin is an ethylene-cycloolefin copolymer, and a cycloolefin for forming the ethylene-cycloolefin copolymer is selected from one or more of cyclopentene, norbornene, vinyl norbomene or ethylidene norbomene.

10. The composition for forming the adhesive film according to any-one-of-claim 1, wherein, in parts by weight, the composition for forming the adhesive film comprises 100 parts of the ethylene copolymer matrix resin, 0.05˜1.5 parts of the amide organic compound, 0.01 ˜10 parts of the metal oxide and/or 0.01˜10 parts of the metal hydroxide; and preferably, in parts by weight, the composition for forming the adhesive film comprises 100 parts of the ethylene copolymer matrix resin, 0.05˜1.5 parts of the amide organic compound, 0.01˜3 parts of the metal oxide and/or 0.01˜3 parts of the metal hydroxide.

11. The composition for forming the adhesive film according to claim 10, wherein the composition for forming the adhesive film further comprises one or more in a group consisting of an organic peroxide, a co-crossfinker, a light stabilizer, an ultraviolet light absorber, a tackifier, an antioxidant and a pigment, and preferably, calculated in 100 parts of the ethylene copolymer matrix resin by weight, the composition further comprises 0.01˜3 parts of the crosslinker by weight, 0.01-10 parts of the co-crossfinker by weight, 0˜1.0 part of the fight stabilizer by weight, 0˜0.4 parts of the ultraviolet light absorber by weight 0˜3.0 parts of the tackifier by weight, 0˜0.5 parts of the antioxidant by weight and 0˜40 parts of the pigment by weight.

12. The composition for forming the adhesive film according to claim 1, wherein, in parts by weight, the composition for forming the adhesive film comprises: 100 parts of the matrix resin, 0.05˜1 part of the metal ion trapping agent, and 0.1˜1 part of the organic co-crosslinker.

13. The composition for forming the adhesive film according to claim 12, wherein, in parts by weight, the composition for forming the adhesive film comprises: 100 parts of the matrix resin, 0.05˜0.5 parts of the metal ion trapping agent, and 0.1 ˜ 1 part of the organic co-crosslinker.

14. The composition for forming the adhesive film according to claim 1, wherein the metal ion trapping agent is selected from one or more of aluminosilicate, hydrated oxide, polyvalent metal acid salt, metal phosphate, pentavalent metal oxide, hexavalent metal oxide, 7-valent metal oxide, xanthic acid organic compound and dithiocarbamate organic compound; and preferably, the metal ion trapping agent is selected from one or more of aluminum phosphate, titanium phosphate, tin phosphate, zirconium phosphate and bismuth phosphate.

15. The composition for forming the adhesive film according to claim 1, wherein the organic co-crosslinker is selected from a multifunctional acrylate compound and/or a (methyl) acrylamide compound; preferably, the multifunctional acrylate compound is selected from one or more of trimethylolpropane triacrylate, pentaerythritol triacrylate and ethoxylated trimethylolpropane triacrylate; and preferably, the (methyl) acrylamide compound is selected from one or more of N,N′-methylenebisacrylamide, N,N′-vinylbisacrylamide and N-propylacrylamide.

16. The composition for forming the adhesive film according to claim 15, wherein the matrix resin is selected from one or more of ethylene vinyl acetate copolymer, low-density polyethylene, polypropylene, polybutene, polyvinyl butyral, metallocene catalyzed polyethylene, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer and ethylene methyl methacrylate copolymer.

17. The composition for forming the adhesive film according to claim 1, wherein, in parts by weight, the composition for forming the adhesive film further comprises 0.5˜5 parts of an auxiliary agent, and the auxiliary agent is selected from one or more of a peroxide crosslinker, an antioxidant, a hindered amine light stabilizer, an ultraviolet light absorber and a tackifier.

18. An adhesive film, wherein the adhesive film is a single-layer adhesive film or a multi-layer co-extruded adhesive film, and at least one layer of the single-layer adhesive film or the multi-layer adhesive film is prepared by the composition for forming the adhesive film according to claim 1 as a raw material through a melt extrusion process.

19. (canceled)

20. A photovoltaic module, comprising an encapsulation adhesive film, wherein the encapsulation adhesive film comprises at least one layer of the adhesive film according to claim 18.

21. The photovoltaic module according to claim 20, wherein the photovoltaic module is a double-glass module.

22. (canceled)

Description

EMBODIMENTS ABOUT FIRST IMPLEMENTATION MODE

Embodiment 1

[0078] 100 parts of ethylene-vinyl acetate (26% vinylacetate (VA) content, DuPont, the United States of America) is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 0.1 parts of a magnesium oxide, 1 part of N,N′-dimethylacrylamide, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crosslinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added. It is mixed uniformly, and the above mixture is subjected to working procedures such as pre-mixing, melt extrusion, firm-casting, cooing, slitting and winding, to obtain the anti-PID encapsulation material.

Embodiment 2

[0079] A difference from Embodiment 1 is that: the metal oxide is a calcium oxide.

Embodiment 3

[0080] A difference from Embodiment 1 is that: the metal oxide is a zinc oxide.

Embodiment 4

[0081] A difference from Embodiment 1 is that: 0.05 parts of an aluminum oxide and 0.05 parts of a calcium hydroxide are added.

Embodiment 5

[0082] A difference from Embodiment 1 is that: the metal oxide is a zirconium oxide.

Embodiment 6

[0083] A difference from Embodiment 1 is that: 0.1 parts of a magnesium hydroxide is added.

Embodiment 7

[0084] A difference from Embodiment 1 is that: the metal oxide is MgO-doped A.sub.203.

Embodiment 8

[0085] A difference from Embodiment 1 is that: the metal oxide is CaO/SiO.sub.2-doped A.sub.20.

Embodiment 9

[0086] A difference from Embodiment 1 is that: the metal oxide is Li.sub.3Ni.sub.10.6Mg.sub.0.6Sb.sub.8.

Embodiment 10

[0087] A difference from Embodiment 1 is that: the amide organic compound is N,N-dimethylformamide.

Embodiment 11

[0088] A difference from Embodiment 1 is that: the amide organic compound is N-(2hydroxyethyl) -undec-10-enamide.

Embodiment 12

[0089] A difference from Embodiment 1 is that: the ethylene copolymer is an ethylene-octene copolymer.

Embodiment 13

[0090] A difference from Embodiment 1 is that: the ethylene copolymer is an ethylene-norbomene copolymer.

Embodiment 14

[0091] A difference from Embodiment 1 is that: 0.01 parts of a magnesium oxide and 1.5 parts of N,N′-dimethylacrylamide are added.

Embodiment 15

[0092] A difference from Embodiment 1 is that: 3 parts of a magnesium oxide and 1.5 parts of N,N′-dimethylacrylamide are added.

Embodiment 16

[0093] A difference from Embodiment 1 is that: 12 parts of a magnesium oxide and 0.03 parts of N,N′-dimethylacrylamide are added.

Embodiment 17

[0094] A difference from Embodiment 1 is that: 20 parts of a titanium dioxide is added to prepare a white anti-PID encapsulation material.

Embodiment 18

[0095] A difference from Embodiment 17 is that: 10 parts of a magnesium oxide is added to prepare a white anti-PID encapsulation material.

Embodiment 19

[0096] The adhesive film is a double-layer co-extruded adhesive film formed by a first adhesive film layer and a second adhesive film layer.

[0097] The composition of the first adhesive film layer is as follows:

[0098] 100 parts of ethylene-vinyl acetate (26% VA content, DuPont, USA) is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 0.1 parts of a magnesium oxide, 1 part of N,N′-dimethylacrylamide, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crosslinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added.

[0099] The composition of the second adhesive film layer is as follows:

[0100] 100 parts of an ethylene-octene copolymer is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 0.1 parts of a magnesium oxide, 1 part of N,N′-dimethylacrylamide, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crosslinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added.

[0101] After the above compositions of resins and auxiliary agents of the first adhesive film layer and the second adhesive film layer are mixed uniformly, they are added to different extruders. An extruded material of the first adhesive film layer and an extruded material of the second adhesive film layer are respectively meted and plasticized, and then injected into the same die head, and merged in the T type die head to form a melt stream, it is subjected to working procedures such as melt extrusion, film-casting, cooling, slitting and winding, to prepare a double-layer composite photovoltaic encapsulation adhesive film EVA-POE, through the calculation of a distributor, the thickness of the first adhesive film layer of the obtained encapsulation adhesive film is 0.2 mm, and the thickness of the second adhesive film layer is 0.3 mm.

Embodiment 20

[0102] The adhesive film is a three-layer co-extruded adhesive film formed by a first adhesive film layer, a second adhesive film layer and a third adhesive film layer.

[0103] The composition of the first adhesive film layer is as follows:

[0104] 100 parts of ethylene-vinyl acetate (26% VA content, DuPont, USA) is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 0.1 parts of a calcium oxide, 1 part of N-(2-hydroxyethyl) -undecarbon-10-enamide, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crosslinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added.

[0105] The composition of the second adhesive film layer is as follows:

[0106] 100 parts of an ethylene-octene copolymer is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crossinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added.

[0107] The composition of the third adhesive film layer is as follows:

[0108] 100 parts of ethylene-vinyl acetate (26% VA content, DuPont, USA) is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 3 parts of a magnesium oxide, 1 part of N-(2-hydroxyethyl)-undecarbon-10-enamide, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crossinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added.

[0109] After the above compositions of resins and auxiliary agents of the first adhesive film layer, the second adhesive film layer and the third adhesive film layer are mixed uniformly, they are added to different extruders. An extruded material of the first adhesive film layer, an extruded material of the second adhesive film layer and an extruded material of the third adhesive film layer are respectively melted and plasticized, and then injected into the same die head, and merged in the T type die head to form a melt stream, it is subjected to working procedures such as melt extrusion, film-casting, cooling, slitting and winding, to prepare a three-layer composite photovoltaic encapsulation adhesive film EVA-POE-EVA, through the calculation of a distributor, the thicknesses of the first adhesive film layer and the third adhesive film layer of the obtained encapsulation adhesive film are 0.1 mm, and the thickness of the second adhesive film layer is 0.2 mm.

Contrast Embodiment 1

[0110] A difference from Embodiment 1 is that: it does not contain a metal oxide.

Contrast Embodiment 2

[0111] A difference from Embodiment 1 is that: it does not contain an amide organic compound.

Contrast Embodiment 3

[0112] A difference from Embodiment 1 is that: 100 parts of ethylene-vinyl acetate (26% VA content, DuPont, USA) is taken, 100 parts of the above matrix resin by weight is taken as a benchmark, 0.5 parts of crosslinker isopropyl tert-butyl peroxycarbonate, 0.5 parts of co-crosslinker trimethylolpropane trimethacrylate, 1 part of tackifier vinyl triperoxide tert-butyl silane, and 0.8 parts of light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacic acid are added. They are mixed uniformly, and the above mixture is subjected to working procedures such as melt extrusion, film-casting, cooling, slitting and winding, to prepare the encapsulation material. Methanol is used as a solvent, to prepare dispersion solution of a magnesium oxide, and the concentration is 1.Owt %. Next, the magnesium oxide dispersion solution is sprayed on the above encapsulation material by a rotary encoder (the rotation number is 100 rpm), and then dried at 120° C., to evaporate the methanol solvent to obtain an encapsulation material with a magnesium oxide coating layer.

[0113] Performance Test:

[0114] Embodiments 1 to 20 and Contrast embodiments 1 to 3 are tested for adhesion force and cross-linking degree and compared for lamination features of modules.

Test Items and Test Methods

1. Adhesion Force

[0115] 300 mm×150 mm glass/adhesive film (two layers)/flexible backplane are stacked in sequence and placed in a vacuum laminator, and laminated according to a lamination process at 150° C. for 18 minutes, to prepare a laminated module.

[0116] The flexible backplane/adhesive film is cut into 10 mmt0.5 mm samples every 5 mm in a width direction to test the adhesion force between the adhesive film and the glass. According to a test method of GB/T 2790-1995, a peeling force between the adhesive film and the glass is tested on a tensile testing machine at a tensile speed of 100 mm/min100 mrnmin, and the arithmetic mean of three tests is taken, and it is corrected to 0.1N/cm.

2. Cross-Linking Degree

[0117] It is tested by a method of heating extraction with xylene. The ratio of the mass undissolved in the xylene to the initial mass is the cross-linking degree. The arithmetic mean of three samples is taken, and the unit is %.

3. Appearance Evaluation of Module Lamination

[0118] It is laminated according to a lamination sequence of glass/adhesive film/cell piece/adhesive film/glass, and the lamination is performed according to the lamination process of the above adhesive force test, to prepare a standard double-glass solar cell module, the specification of the module is the version of 60 (6×10) cell pieces. According to the different adhesive films, 100 modules are prepared for appearance evaluation. An evaluation standard is based on the occurrence of bubbles, impurities, and delamination between the adhesive film and the cell piece or glass which are used as judgment objects, and it is specifically as follows:

o: None Δ: Slight x: Severe.

4. Module PID Aging Test

[0119] A double-face cell is selected, and tested according to IECTS 2804-1:2015. The test conditions are tightened to 85° C. and 85% relative humidity (RH), and a negative 1500 V constant direct current voltage is externally applied. After 192 h, the power attenuations of a photovoltaic module before and after a PID test are measured.

[0120] Test results are shown in Table 1.

TABLE-US-00001 TABLE 1 Adhesion PID192 power force to attenuation glass Cross-linking Module Module Module (%) (N/cm) degree (%) bubbles impurities delamination Front Back Embodiment 201 88.9 ◯ ◯ ◯ 0.92 2.11 1 Embodiment 195 88.5 ◯ ◯ ◯ 1.15 2.88 2 Embodiment 192 88.3 ◯ ◯ ◯ 1.01 2.73 3 Embodiment 196 88.6 ◯ ◯ ◯ 1.34 3.05 4 Embodiment 192 88.4 ◯ ◯ ◯ 0.95 2.15 5 Embodiment 195 88.6 ◯ ◯ ◯ 1.02 2.03 6 Embodiment 187 88.1 ◯ ◯ ◯ 1.34 2.57 7 Embodiment 193 88.5 ◯ ◯ ◯ 1.35 2.73 8 Embodiment 190 88.3 ◯ ◯ ◯ 1.25 2.68 9 Embodiment 170 85.2 ◯ ◯ ◯ 3.89 6.05 10 Embodiment 184 87.9 ◯ ◯ ◯ 0.97 1.41 11 Embodiment 190 88.2 ◯ ◯ ◯ 0.27 0.89 12 Embodiment 178 86.1 ◯ ◯ ◯ 0.86 1.65 13 Embodiment 227 89.5 ◯ ◯ ◯ 1.92 3.76 14 Embodiment 209 89.3 ◯ ◯ ◯ 0.86 1.92 15 Embodiment 158 84.2 ◯ ◯ ◯ 3.95 6.27 16 Embodiment 190 88.3 ◯ ◯ ◯ 1.28 2.73 17 Embodiment 185 87.9 ◯ ◯ ◯ 1.34 2.91 18 Embodiment 179 87.4 ◯ ◯ ◯ 0.30 0.93 19 Embodiment 172 87.1 ◯ ◯ ◯ 0.39 0.98 20 Contrast 141 83.7 ◯ ◯ ◯ 5.38 10.63 embodiment 1 Contrast 190 88.2 X X ◯ 4.21 7.44 embodiment 2 Contrast 171 87.3 X X X 4.92 8.57 embodiment 3

[0121] From the above description, it may be seen that the above embodiments of the present disclosure achieve the following technical effects.

[0122] It may be seen by comparing Embodiments 1 to 20 with Contrast embodiments 1 and 2 that the adhesive film prepared by the composition provided in the present application has the more excellent comprehensive performance.

[0123] It may be seen by comparing Embodiment 1 with Contrast embodiment 3 that the adhesive film prepared by the preparation method provided in the present application has the more excellent comprehensive performance.

[0124] It may be seen by comparing Embodiments 1 to 9 that the use of the metal oxide and/or metal hydroxide preferred in the present application is beneficial to improve the comprehensive performance of the adhesive film.

[0125] It may be seen by comparing Embodiments 1, and 10 to 11 that the use of the amide organic compound preferred in the present application is beneficial to improve the comprehensive performance of the adhesive film.

[0126] It may be seen by comparing Embodiments 1, and 12 to 13 that the use of the ethylene copolymer preferred in the present application is beneficial to improve the comprehensive performance of the adhesive film.

[0127] It may be seen by comparing Embodiments 1, and 14 to 20 that limiting the amount of each component in the composition for forming the adhesive film to the preferred range of the present application is beneficial to improve the comprehensive performance of the adhesive film.

Embodiments about Second Implementation Mode

EMBODIMENT 1

[0128] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.2 mass parts of metal ion trapping agent zirconium phosphate (Acros reagent), 1 part of organic co-crosslinker ethoxy trimethylolpropane triacrylate (Sartomer Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-1 that resists a module PID phenomenon.

EMBODIMENT 2

[0129] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.2 mass parts of metal ion trapping agent zirconium phosphate (Acros reagent), 0.1 part of organic co-crosslinker N,N′-methylenebisacrylamide (Baling Wei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-2 that resists a module PID phenomenon.

EMBODIMENT 3

[0130] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.05 mass parts of metal ion trapping agent zirconium phosphate (Acros reagent), 0.1 parts of organic co-crosslinker N,N′-methylenebisacrylamide (Bailingwei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.).

[0131] The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, sitting and winding, to prepare a photovoltaic encapsulation adhesive film E-3 that resists a module PID phenomenon.

EMBODIMENT 4

[0132] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 1 mass part of metal ion trapping agent zirconium phosphate (Acros reagent), 0.1 parts of organic co-crosslinker N,N′-methylenebisacrylamide (Bailing Wei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.), and 0.3 parts of ultraviolet absorber 2-hydroxy-4-n-octyloxybenzophenone (BASF Chemical Co., Ltd., Germany), the above raw materials are subjected to working procedures such as pre-mixing, met extrusion, film-casting, cooing, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-4 that resists a module PID phenomenon.

EMBODIMENT 5

[0133] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.2 mass parts of metal ion trapping agent aluminium phosphate (Acros reagent), 0.1 parts of organic co-crosslinker N,N′-methylenebisacrylamide (Bailingwei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-5 that resists a module PID phenomenon.

EMBODIMENT 6

[0134] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.2 mass parts of metal ion trapping agent zirconium phosphate (Acros reagent), 0.1 parts of organic co-crosslinker trimethylolpropane triacrylate (Bailingwei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethyihexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-6 that resists a module PID phenomenon.

EMBODIMENT 7

[0135] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.2 mass parts of metal ion trapping agent bismuth phosphate (Acros reagent), 0.1 parts of organic co-crosslinker trimethylolpropane triacrylate (Bailingwei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethyihexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-7 that resists a module PID phenomenon.

EMBODIMENT 8

[0136] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.5 mass parts of metal ion trapping agent zirconium phosphate (Acros reagent), 0.5 parts of organic co-crosslinker trimethylolpropane triacrylate (Bailingwei Chemical Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethyihexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film E-8 that resists a module PID phenomenon.

Contrast Embodiment 1

[0137] A conventional photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), 1 part of triallyl isocyanurate (Evonik Degussa Co., Ltd.), and 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooling, slitting and winding, to prepare a photovoltaic encapsulation adhesive film C-1.

Contrast Embodiment 2

[0138] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 0.05 parts of zirconium phosphate (Bailingwei Technology Co., Ltd.), 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate (Tianjin Rianlon Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), and 1 part of triallyl isocyanurate (Evonik Degussa Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, met extrusion, film-casting, cooing, slitting and winding, to prepare a photovoltaic encapsulation adhesive film C-2 that resists a module PID phenomenon.

Contrast Embodiment 3

[0139] An anti-PID photovoltaic encapsulation material, in parts by weight, main raw materials thereof are composed as follows: 100 parts of an ethylene-vinyl acetate copolymer (Singapore TPC company, and the VA mass fraction is 28%), 1 part of organic co-crosslinker trimethylolpropane triacrylate (Sartomer Chemical Co., Ltd.). 0.2 parts of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidino sebacate (Tianjin Rianlon Co., Ltd.), 0.6 parts of crosslinker tert-butylperoxy 2-ethylhexyl carbonate (Arkema company), and 0.5 parts of tackifier y-methacryloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.). The above raw materials are subjected to working procedures such as pre-mixing, melt extrusion, film-casting, cooing, slitting and winding, to prepare a photovoltaic encapsulation adhesive film C-3 that resists a module PID phenomenon.

Performance Test

[0140] Light transmittance and PID tests are performed on a laminated module prepared by the encapsulation materials of Embodiments 1-8 and Contrast embodiments 1-3. After being laminated, the thicknesses of the adhesive films of the embodiments and contrast embodiments are 0.45 nm, herein the light transmittance is measured according to GB/T 2410-2008. The ethyl vinyl acetate (EVA) adhesive films obtained in the above embodiments and contrast embodiments and a P-type double-face cell of Company A are made into a double-face double-glass module through the same process. The photovoltaic module PID test is performed according to IEC TS 2804-1:2015, and the test conditions are tightened to 85° C. and 85% RH, and a negative 1500 V constant direct current voltage is externally applied. After 192 h, the power attenuations of a photovoltaic module before and after a PID test are measured, and test results are shown in Table 2.

TABLE-US-00002 TABLE 2 Light Photovoltaic module power ) transmittance attenuation after PID test (% Number (%) Front Back Embodiment 1 91.2 1.23 4.04 Embodiment 2 91.2 0.78 2.86 Embodiment 3 91.7 1.31 3.56 Embodiment 4 90.1 0.96 2.17 Embodiment 5 91.0 1.58 3.04 Embodiment 6 90.8 1.27 3.25 Embodiment 7 91.1 0.94 3.11 Embodiment 8 90.7 1.22 2.79 Contrast 92.2 3.85 28.5 embodiment 1 Contrast 91.0 2.42 7.56 embodiment 2 Contrast 92.3 2.64 13.25 embodiment 3

[0141] It may be known from the comparison of performance test data of the embodiments and contrast embodiments in Table 2 above:

[0142] in Embodiments 1-8, the addition of the organic co-crosslinker may not affect the light transmittance of the adhesive film. And as the increase of the addition amount of the metal ion adsorbent, the light transmittance tends to decrease. While the dosage of the metal ion trapping agent is less than 1 part by mass, the light transmittance may be kept above 90%, and the andi-PID effect is also good. It is matched with the P-type double-face cell to prepare the double-glass module. Under the test conditions of −1500 V and 196 h, the attenuation powers on both sides of the front face are controlled within 5%, and the actual needs are satisfied.

[0143] It may be seen from Contrast embodiment 1 that the photovoltaic encapsulation adhesive film without the metal ion trapping agent and the organic co-crosslinker represents a larger module power attenuation. For the photovoltaic encapsulation adhesive film containing only the zirconium phosphate (Contrast embodiment 2), although the anti-PID performance is improved, the power attenuation on the back of the module is still 7.56%, the anti-PID effect thereof is not ideal. For the photovoltaic encapsulation adhesive film containing only the co-crosslinker trimethylolpropane triacrylate (Contrast embodiment 3), although the anti-PID performance is improved compared with C1 (Contrast embodiment 1), the power attenuation on the back of the module is still more than 10%, the anti-PID effect thereof is not ideal.

[0144] In conclusion, it may be seen from the above embodiments that the adhesive films prepared in each embodiment have the better anti-PID performance.

[0145] It should be noted that terms “first”, “second” and the like in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or a precedence order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the present application described herein may, for embodiment, be implemented in a sequence other than those described herein.

[0146] The above are only preferred embodiments of the present disclosure, and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and changes. Any modifications, equivalent replacements, improvements and the like made within the spirit and principle of the present disclosure shall be included within a scope of protection of the present disclosure.