Patent classifications
C09J125/08
Metal-clad laminate, circuit board, and multilayer circuit board
A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.
HOT-MELT ADHESIVE RESIN FILM AND PRODUCTION METHOD THEREOF
A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.
HOT-MELT ADHESIVE RESIN FILM AND PRODUCTION METHOD THEREOF
A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.
SURFACE PROTECTION FILM
A surface protection film includes an adhesion layer that includes a blend of a first hydrogenated styrene block copolymer, a second hydrogenated styrene block copolymer different from the first hydrogenated styrene block copolymer, and polyethylene. An Adhesion Build Value of the surface protection film is less than 2.5 after the adhesion layer has been attached to a textured polycarbonate substrate and heated to 90 C. for 10 minutes.
PETROLEUM RESIN, HYDROGENATED PETROLEUM RESIN, AND PRODUCTION METHOD FOR HYDROGENATED PETROLEUM RESIN
The present invention relates to a petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm; and a hydrogenated petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm.
PETROLEUM RESIN, HYDROGENATED PETROLEUM RESIN, AND PRODUCTION METHOD FOR HYDROGENATED PETROLEUM RESIN
The present invention relates to a petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm; and a hydrogenated petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm.
Adhesives comprising polyindane resins
The present invention is generally related to various types of compositions that comprise a polyindane resin. In particular, the polyindane resins may be utilized in various polymer-based and elastomer-based formulations in order to enhance several properties and characteristics of those formulations. More specifically, adhesive formulations are provided that comprise at least one polyindane resin, which may be used to replace or enhance the functionality of existing hydrocarbon resins typically used in adhesive formulations. Compositions comprising at least one thermoplastic elastomer and at least one polyindane resin are also provided.
Adhesives comprising polyindane resins
The present invention is generally related to various types of compositions that comprise a polyindane resin. In particular, the polyindane resins may be utilized in various polymer-based and elastomer-based formulations in order to enhance several properties and characteristics of those formulations. More specifically, adhesive formulations are provided that comprise at least one polyindane resin, which may be used to replace or enhance the functionality of existing hydrocarbon resins typically used in adhesive formulations. Compositions comprising at least one thermoplastic elastomer and at least one polyindane resin are also provided.
Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same
Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a -conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.
Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same
Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a -conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.