Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.

A pipe joining material for connecting pipes and fittings and a method of making a pipe joining material are provided. The pipe joining material may include a thermoplastic material such as polyvinyl chloride (PVC) and/or chlorinated polyvinyl chloride (CPVC) and a bonding agent for the thermoplastic material.

A pipe joining material for connecting pipes and fittings and a method of making a pipe joining material are provided. The pipe joining material may include a thermoplastic material such as polyvinyl chloride (PVC) and/or chlorinated polyvinyl chloride (CPVC) and a bonding agent for the thermoplastic material.

A pipe joining material for connecting pipes and fittings and a method of making a pipe joining material are provided. The pipe joining material may include a thermoplastic material such as polyvinyl chloride (PVC) and/or chlorinated polyvinyl chloride (CPVC) and a bonding agent for the thermoplastic material.

An adhesive tape with a backing layer is longitudinally folded upon itself, creating an approximately 180-degree angle at each of two ends of the tape, and a first longitudinal section of multiple layers of the adhesive tape and a second longitudinal section of multiple layers of the adhesive tape such that the first section is positioned above and parallel to the second section. The folding does not crease the tape at either end of the tape. The first longitudinal section and second longitudinal section are maintained in contact or close proximity via a piece of tape, clip, rubber band, or other means, such that the adhesive tape is maintained in a flat profile. The adhesive tape in its flat profile can then be easily inserted into a United States first class letter-sized mailing envelope.

An adhesive tape with a backing layer is longitudinally folded upon itself, creating an approximately 180-degree angle at each of two ends of the tape, and a first longitudinal section of multiple layers of the adhesive tape and a second longitudinal section of multiple layers of the adhesive tape such that the first section is positioned above and parallel to the second section. The folding does not crease the tape at either end of the tape. The first longitudinal section and second longitudinal section are maintained in contact or close proximity via a piece of tape, clip, rubber band, or other means, such that the adhesive tape is maintained in a flat profile. The adhesive tape in its flat profile can then be easily inserted into a United States first class letter-sized mailing envelope.

This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.

This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.

This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.

A hot-melt composition is provided. The hot-melt composition includes thermoplastic polyurethane (TPU) and polyvinylchloride (PVC), the weight ratio of TPU over PVC is in the range of 50/50 to 95/5, and the TPU and PVC together forms at least 50% w of the composition.