C09J175/16

Moisture-curable reactive hot-melt adhesive composition and method for producing the same

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

Moisture-curable reactive hot-melt adhesive composition and method for producing the same

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

Fold Protection for Spiral Filtration Modules Utilizing UV Cured Polyurethane and Method of Providing Same

Disclosed is a dual UV and reaction curable, two component adhesive comprising both acrylic chemistry and polyurethane chemistry. The UV curable acrylate component provides a fast cure reaction to generate a tack-free surface. The mixed two component polyurethane cures to a reaction product that provides flexibility and chemical resistance. The adhesive is useful as fold protection for spiral filtration modules. When cured on a membrane the adhesive will maintain integrity and adhesion to membrane after treatments of creasing and soaking at high temperature, pressure, and wide pH ranges.

REDOX CURABLE COMPOSITIONS AND METHODS OF MANUFACTURE THEREOF
20230147662 · 2023-05-11 ·

A redox curable composition, methods for manufacturing same and uses thereof are disclosed. The redox curable composition is useful as a pre-applied adhesive. The redox curable composition is solid at room temperature, may be heated for application to a substrate, and cools to form a dry-to-touch adhesive layer on said substrate, which may be activated when required by mating with another substrate and exposure to an anaerobic environment. The composition is particularly suited to manufacturing complex products, such as mobile phones, computers and circuits.

REDOX CURABLE COMPOSITIONS AND METHODS OF MANUFACTURE THEREOF
20230147662 · 2023-05-11 ·

A redox curable composition, methods for manufacturing same and uses thereof are disclosed. The redox curable composition is useful as a pre-applied adhesive. The redox curable composition is solid at room temperature, may be heated for application to a substrate, and cools to form a dry-to-touch adhesive layer on said substrate, which may be activated when required by mating with another substrate and exposure to an anaerobic environment. The composition is particularly suited to manufacturing complex products, such as mobile phones, computers and circuits.

ADHESIVE GLUE, CURING METHOD THEREFOR, AND APPLICATION THEREOF
20230151254 · 2023-05-18 ·

The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

ADHESIVE GLUE, CURING METHOD THEREFOR, AND APPLICATION THEREOF
20230151254 · 2023-05-18 ·

The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

Photocurable composition

The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan δ=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×10.sup.5 Pa or less after curing. Component (A): urethane-modified (meth)acrylate oligomer Component (B): film forming agent Component (C): photoinitiator

Photocurable composition

The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan δ=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×10.sup.5 Pa or less after curing. Component (A): urethane-modified (meth)acrylate oligomer Component (B): film forming agent Component (C): photoinitiator

Farnesene-based polymers and liquid optically clear adhesive compositions incorporating the same

A low viscosity polymer having a linear or branched backbone derived from farnesene monomers and at least one terminal-end functionalized with a hydroxyl group. This polymer may be further hydrogenated to reduce unsaturation and acrylated, such that it may be incorporated into a LOCA composition. The LOCA composition may be used in a laminated screen assembly, such as a touch screen, for electronic devices by adhering the LOCA composition between an optically transparent layer, such as a cover glass, and a display. The cured LOCA composition has a refractive index similar to the optically transparent layer. A method of making the low viscosity polymer for the LOCA composition includes anionically polymerizing farnesene monomers, quenching a living end of the polymer to provide the hydroxyl-terminated polymer; hydrogenating the hydroxyl-terminated polymer; and reacting the at least partially saturated hydroxyl-terminated polymer with at least one reagent to provide an acrylate terminated hydrogenated polymer.