Patent classifications
C09J175/16
Farnesene-based polymers and liquid optically clear adhesive compositions incorporating the same
A low viscosity polymer having a linear or branched backbone derived from farnesene monomers and at least one terminal-end functionalized with a hydroxyl group. This polymer may be further hydrogenated to reduce unsaturation and acrylated, such that it may be incorporated into a LOCA composition. The LOCA composition may be used in a laminated screen assembly, such as a touch screen, for electronic devices by adhering the LOCA composition between an optically transparent layer, such as a cover glass, and a display. The cured LOCA composition has a refractive index similar to the optically transparent layer. A method of making the low viscosity polymer for the LOCA composition includes anionically polymerizing farnesene monomers, quenching a living end of the polymer to provide the hydroxyl-terminated polymer; hydrogenating the hydroxyl-terminated polymer; and reacting the at least partially saturated hydroxyl-terminated polymer with at least one reagent to provide an acrylate terminated hydrogenated polymer.
ELECTRON BEAM CURABLE PRESSURE SENSITIVE ADHESIVE COMPRISING ACRYLIC POLYMER WITH BOUND VINYL GROUP
The invention relates to a process for making e-Beam curable pressure sensitive adhesive compositions by derivatizing an acrylic polymer having one or more hydroxy groups or one or more acid groups with a derivatizing agent prepared from a hydroxy-functional acrylate monomer and a diisocyanate. The pressure sensitive adhesive can be effectively cured without a photoinitiator or reactive diluent. Also disclosed are e-Beam curable pressure sensitive adhesives made with the derivatizing agent and methods for adhering substrates with the pressure sensitive adhesive compositions.
Adhesive hook
An adhesive hook includes a base which has a bottom for fixing, an outer surface, and a hook provided at the outer surface. The bottom of the base is fixed on an external surface by means of an adhesive, and the adhesive is a curable adhesive. The structure of the adhesive hook is simple, and the curing speed of the curable adhesive is fast. After the curing process, the load bearing of the hook is larger than 1 Kg/cm2. Further, the adhesive hook has high cohesion strength after the adhesive is cured, and no remain is pasted on the external surface or the base after the hook is removed. The base can be recoated with new adhesive to reuse, which reduces cost and achieves recycling.
MONOFUNCTIONAL OR MULTIFUNCTIONAL URETHANE ACRYLATE OLIGOMERS WITHOUT ISOCYANATES
The present invention relates to an acrylated and/or methacrylated urethane oligomer obtained by reaction of a specific polyamine a) with a cyclic carbonate compound b) carrying m cyclic carbonate groups, giving an intermediate product c) carrying m formed urethane groups which carry residual reactive amine —NH— groups, and subsequently an addition reaction of each of the said residual reactive amine groups of the said product c) with an acrylate group of a compound d) carrying, in addition to the said acrylate group, p additional acrylate and/or methacrylate groups, with each residual reactive amine —NH— group of the said product c) being thus converted into a carbon-nitrogen bond carrying the said acrylate and/or methacrylate groups, and thus production of the said urethane oligomer, with each carbon-nitrogen bond formed carrying p acrylate and/or methacrylate groups and the said urethane oligomer carrying m urethane groups and m hydroxyl groups in the alpha or beta position with respect to the said urethane and having a functionality in acrylates and/or methacrylates ranging from m*p(n−1) to m*p(2n−2).
The invention also relates to a process for the preparation of the said oligomer in two stages, to the intermediate product c) and to the use of the said urethane oligomer in crosslinkable compositions, in particular in coating compositions, adhesive compositions, compositions for systems for the layer-by-layer manufacture of 3D objects, compositions for 3D printing systems, moulding compositions, leaktightness agent compositions, chemical sealing compositions, concrete compositions or composite compositions.
PHOTOSENSITIVE RESIN COMPOSITION AND ADHESIVES COMPOSITION
A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1):
##STR00001##
(wherein R.sub.1 and R.sub.2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.
PHOTOSENSITIVE RESIN COMPOSITION AND ADHESIVES COMPOSITION
A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1):
##STR00001##
(wherein R.sub.1 and R.sub.2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.
Skin contact adhesive and methods for its preparation and use
A crosslinkable composition is useful for preparing a skin contact adhesive or a coating on a substrate. The crosslinkable composition includes (A) a polyurethane-polyorganosiloxane copolymer and (B) a curing catalyst. The skin contact adhesive prepared by crosslinking the crosslinkable composition is useful in applications such as adhesives for medical tapes, adhesives for wound dressings, adhesives for prosthetics, ostomy appliance adhesives, adhesives for medical monitoring appliances, adhesives for scar therapy treatments, adhesives for cosmetic patches, and transdermal drug delivery systems.
Skin contact adhesive and methods for its preparation and use
A crosslinkable composition is useful for preparing a skin contact adhesive or a coating on a substrate. The crosslinkable composition includes (A) a polyurethane-polyorganosiloxane copolymer and (B) a curing catalyst. The skin contact adhesive prepared by crosslinking the crosslinkable composition is useful in applications such as adhesives for medical tapes, adhesives for wound dressings, adhesives for prosthetics, ostomy appliance adhesives, adhesives for medical monitoring appliances, adhesives for scar therapy treatments, adhesives for cosmetic patches, and transdermal drug delivery systems.
ADHESIVE COMPOSITION
One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.
ADHESIVE COMPOSITION
One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.