One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

The present invention relates to an adhesive, a preparation method and application thereof, particularly the application for bonding glass fiber composites, and a bonded article obtained by using the adhesive. The adhesive comprises: a polyisocyanate having an isocyanate functionality of not less than 2; an epoxy-modified polyether polyol; a hydroxyl-containing acrylate; a redox catalyst; a silane coupling agent; optionally a polyol containing bisphenol A structure; and optionally a polymer polyol different from the epoxy-modified polyether polyol. The adhesive according to the present invention has the advantages of being insensitive to moisture, good bonding properties and a long pot life.

The present invention relates to an adhesive, a preparation method and application thereof, particularly the application for bonding glass fiber composites, and a bonded article obtained by using the adhesive. The adhesive comprises: a polyisocyanate having an isocyanate functionality of not less than 2; an epoxy-modified polyether polyol; a hydroxyl-containing acrylate; a redox catalyst; a silane coupling agent; optionally a polyol containing bisphenol A structure; and optionally a polymer polyol different from the epoxy-modified polyether polyol. The adhesive according to the present invention has the advantages of being insensitive to moisture, good bonding properties and a long pot life.

A urethane oligomer according to a) or b) has: a) at least two backbone residues R issued from a polyisocyanate without the NCO groups, linked between them with a diol residue R.sub.B (diol without the two OH groups) by two urethane bonds and each backbone residues R carrying (or linked to) at least two urethane segments each containing at least one terminal allyl group, b) at least one backbone residue R issued from a polyisocyanate without the NCO groups, the backbone residue R carrying (or linked to) at least two urethane segments each linked to R by one urethane bond with at least one urethane segment (arm) containing at least one terminal allyl group, and at least one urethane segment (arm) containing at least one terminal (meth)acrylate group. A curable composition containing the urethane oligomer reduces oxygen inhibition in coatings, adhesives, sealants or in resin matrix with good surface properties.

Disclosed is an aqueous composition for surface coating, including: a main ingredient comprising a first compound having at least two functional groups selected from the group consisting of a carboxyl group, a hydroxyl group, an amino group and combinations thereof, per molecule; a curing agent comprising a second compound having at least two functional groups selected from the group consisting of an aziridine group, an isocyanate group, a carbodiimide group and combinations thereof, per molecule; and an aqueous solvent. Further, an automotive sheet using the aqueous composition for surface coating is disclosed.

To provide an adhesive film by which air bubbles formed at a bonding interface when the adhesive film is used for bonding, readily disappear under normal temperature and normal pressure.

One embodiment of the adhesion film of the present invention is characterized by having at least one adhesive layer, wherein the adhesive layer satisfies the following requirements (a) to (c). (a) A diffusion coefficient of nitrogen gas is at least 1.5×10.sup.−6 cm.sup.2/sec. (b) A shear modulus G′ (1 Hz) is from 5×10.sup.2 to 1.0×10.sup.5 Pa, at a measurement temperature of 25° C. and a frequency of 1 Hz. (c) The adhesive layer has an absorption peak at from 800 to 820 cm.sup.−1 and no absorption peak at from 1,000 to 1,020 cm.sup.−1, in an infrared absorption spectrum.

The present invention relates to a process for the preparation of a polyurethane comprising: E1) a stage of preparation of a polyurethane having NCO endings comprising the polyaddition reaction between: i) at least one polyisocyanate; ii) at least one polyol; and iii) at least one amine having the following formula (I) or (II):

##STR00001##

and E2) the reaction of the product formed on conclusion of stage E1) with at least one (meth)acrylate or allyl monomer M comprising at least one hydroxyl functional group.

The present invention relates to a process for the preparation of a polyurethane comprising: E1) a stage of preparation of a polyurethane having NCO endings comprising the polyaddition reaction between: i) at least one polyisocyanate; ii) at least one polyol; and iii) at least one amine having the following formula (I) or (II):

##STR00001##

and E2) the reaction of the product formed on conclusion of stage E1) with at least one (meth)acrylate or allyl monomer M comprising at least one hydroxyl functional group.

A formaldehyde free adhesive composition and a plywood obtained from the adhesive composition is provided, and the plywood has a balanced performance, such as high adhesion strength, sufficient pot-life, and good workability.

The present invention provides switchable adhesives comprising a mixture, in proportions by weight, of 20% to 98% of an adhesive, 2% to 80% of curable molecules and 0.05% to 10% of photoinitiator in which the weight proportion of the adhesive is calculated on the basis of its dry weight and wherein the adhesive includes an internal cross-linker for cross-linking the adhesive during drying to provide a cohesive strength of between 5 and 100 N/12.7×12.7 mm measured according to FINAT test method No. 18. Preferably, the adhesive and curable molecules are mutually soluble when dry, or the curable molecules and adhesive may be uniformly dispersed in each other. Preferably the amount of adhesive in the mixture is in the range 40% to 98% by weight, more preferably 60% to 95% by weight, even more preferably 70% to 85% by weight. Preferably the proportion of curable molecules in the mixture ranges from 2% to 60% by weight, more preferably 5% to 40% by weight, even more preferably 15% to 30% by weight. Preferably, the photoinitiator is present in the mixture in the proportions 0.5% to 5% by weight, more preferably 1% to 3% by weight. Such switchable adhesives are useful in medical dressings and other removable sheet products, and may be simply prepared by stirring the adhesive, the curable molecules and the photoinitiator together at room temperature.