A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the fiberglass is in the form of building insulation. In other embodiments the product is a microglass-based substrate for use in a printed circuit board, battery separator, filter stock, or reinforcement scrim.

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites. ##STR00001##

A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an aldehyde or ketone and an amine salt of an inorganic acid. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products.

The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group consisting of acrylates, methacrylates, vinyl ethers, vinyl esters, styrenic compounds, allyl compounds, polybutadienes, cinnamates, crotonates, and mixtures of any two or more thereof), and (C) a photoinitiator. In another embodiment, the present invention is directed to an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition temporarily bonds the substrates, and a method for fabricating the assembly. The debondable adhesive compositions maintain their adhesion at temperatures of 300 C. or greater, are easily and cleanly debondable at ambient conditions, permit temporary bonding at high processing conditions, and do not compromise handling or performance of the substrates.

In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.

In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.

An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages. The adhesive film includes: (A) a bismaleimide resin; (B) a radical initiator; and (C) a coupling agent that contains a (meth)acrylic group. Further, an adhesive film with dicing tape, which includes such an adhesive film laminated onto a dicing tape, is provided. Furthermore, a semiconductor package that includes such an adhesive film with dicing tape is provided.

A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an aldehyde or ketone and an amine salt of an inorganic acid. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products.

The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.