In order to enable lamination of materials of different kinds, such as a synthetic resin plate and a glass plate, without leaving bubbles between the materials, a double sided adhesive sheet (1) is formed by forming an adhesive layer (3) cross-linked with ultraviolet light on one surface of a sheet (2) with an inorganic oxide layer (2B) and forming an adhesive layer (4) cross-linked by heating or moisture on the other surface of the sheet (2). A glass plate (6) is applied to the adhesive layer (3), and a synthetic resin plate (7) is applied to the adhesive layer (4), thereby forming a laminate panel (5).

The invention relates to a method for adhering two substrates, namely a first substrate A and a second substrate B, to each other using a latent-reactive adhesive film with at least one latent-reactive adhesive film layer which has a thermoplastic component with a melting temperature T(melt), where 35° C.≦T(melt)≦90° C., said thermoplastic component containing functional groups that can react to isocyanate, and an isocyanate-containing component that is dispersed into the thermoplastic component in a particulate form and is blocked, microencapsulated, or substantially deactivated in the region of the particle surface. The particles have a start temperature T(start) of 40° C.≦T(start)≦120° C., wherein T(start)≧T(melt). A surface of the first substrate A is brought into contact with a first surface of the latent-reactive adhesive film, and a surface of the second substrate B is brought into contact with the second surface of the latent-reactive adhesive film. The adhesion is caused by heating the latent-reactive adhesive film to a temperature which corresponds to or is higher than at least the start temperature T(start). The invention is characterized in that at least the surface of the first substrate A which is brought into contact with the latent-reactive adhesive film is treated with a primer before the first substrate A is brought into contact with the latent-reactive adhesive film, and/or at least the first surface of the latent-reactive adhesive film which is brought into contact with the first substrate A is treated with a primer before the first substrate A is brought into contact with the latent-reactive adhesive film.

Two part silicone lamination adhesive compositions which cure via a condensation cure chemistry using titanium and/or zirconium based catalysts at room temperature are disclosed. The compositions comprise: (i) at least one condensation curable silyl terminated polymer having at least one hydrolysable and/or hydroxyl functional group(s) per molecule; (ii) a cross-linker; and (iii) a condensation catalyst selected from the group of titanates and zirconates. Polymer (i) is not stored in the same part as cross-linker (ii) and catalyst (iii). Catalyst (iii) is present in a molar amount which is at least 50% of the moisture present cumulatively in the parts of the composition. The molar ratio of silicon bonded hydroxyl groups in polymer (i) to hydrolysable groups in cross-linker (ii) is above 0.15. The molar ratio of the silicon bonded hydroxyl groups in polymer (i) to M-OR functions is greater than 10, where M is titanium or zirconium.

The disclosure relates to pressure-sensitive adhesive (PSA) tapes for temporary protection of coated glass substrates with large dimensions, especially of Low-E coated glass, which enable improved storability and weatherability properties and facilitate their handling and removal. The PSA tapes include a carrier layer and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes one or more acrylic block copolymers, and/or wherein the pressure-sensitive adhesive layer has an initial adhesion strength of 50 to 300 cN/20 mm, and an adhesion strength of 50 to 400 cN/20 mm 7 days after application. Also described are manufacturing methods of said pressure-sensitive adhesive tape, their use and methods of producing glass units.

The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m.sup.2*d) (38° C., 90% relative humidity, 50 μm layer thickness); —a layer comprising at least one getter material capable of sorbing at least water; —a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm.sup.2 and about 10,000 mJ/cm.sup.2. The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30 k and a Tg of less than about 20° C., a diluents monomer component and a photoinitiator.

There is provided an optical laminate with pressure-sensitive adhesive layers on both surfaces. The optical laminate comprises: a first substrate; a first low-refractive index layer formed on the first substrate; a first pressure-sensitive adhesive layer arranged so as to be adjacent to the first low-refractive index layer; a second low-refractive index layer arranged so as to be adjacent to the first pressure-sensitive adhesive layer; a second substrate having formed thereon the second low-refractive index layer; and a second pressure-sensitive adhesive layer and a third pressure-sensitive adhesive layer serving as outermost layers. The first low-refractive index layer and/or the second low-refractive index layer has a porosity of 50% or more, the first pressure-sensitive adhesive layer has a storage modulus of elasticity of from 1.3×10.sup.5 (Pa) to 1.0×10.sup.7 (Pa), and the second pressure-sensitive adhesive layer and/or the third pressure-sensitive adhesive layer has a storage modulus of elasticity of 1.0×10.sup.5 (Pa) or less.

Disclosed are a structural adhesive tape in which a mesh layer is located on one side or both sides of an adhesive layer, and a method of manufacturing the same. The mesh layer having a specific specification may be used and an adhesive layer including an epoxy resin with a solid phase and a liquid phase and a flame retardant plasticizer may be used introduced so that a tape sagging phenomenon can be solved while minimizing degradation in adhesive strength. In addition, the mesh layer may be used so that a usage temperature range may be extended from a range ranging from about 5° C. to about 35° C. to a range ranging from about 0° C. to about 40° C., and thus workability in high and low temperature ranges may be improved such that tape workability can be improved even in overseas factories with poor temperature conditions.

The invention relates to a wash-off label structure and an adhesive layer comprising a pressure sensitive hot melt adhesive layer sensitive to the washing conditions. According to an embodiment the adhesive layer comprises an acrylate composition curable with ultraviolet radiation and at least one modifier selected from a tackifier, a plasticizer and a filler, and wherein the peel adhesion from the labelled surface at 50-80° C. in alkaline aqueous solution of at least 30% less than the peel adhesion at room temperature of 23° C.±2° C. and relative humidity of 50%±5%. The invention further relates to a use of the label for recyclable or reusable packages, and a combination of a package and a wash-off label.

A method for bonding together two substrates includes providing a molecular glue including glue molecules, each of the glue molecules having at least two —O—Si or —O—Al moieties; reacting a surface of a first substrate with the molecular glue to attach the glue molecules to the surface of the first substrate by at least one of the —O—Si or —O—Al moieties; and reacting a surface of a second substrate with the molecular glue to attach the glue molecules to the surface of the second substrate by at least another one of the —O—Si or —O—Al moieties. The method can be used for a variety of applications including manufacturing a vapor cell.