Patent classifications
C09J2400/143
Methods of bonding substrates together
Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.
Epoxy based reinforcing patches having improved damping loss factor
A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
Method for producing vehicular structure and method for producing protective film-attached transparent substrate
A method for producing a vehicular structure in which a transparent substrate and an adherend are bonded together by an adhesive includes pasting a protective film on, so as to cover, an adhesive arrangement area in a peripheral part of a vehicle-inner-side surface of the transparent substrate, and arranging an adhesive in the adhesive arrangement area after removing the protective film, and bonding together the transparent substrate and the adherend with the adhesive.
THERMALLY CONDUCTIVE SILICONE RUBBER SHEET COMPRISING A THERMALLY CONDUCTIVE ADHESIVE LAYER
One of the purposes of the present invention is to provide a composite heat-release sheet which is excellent in thermal conductivity and electrical insulation property and, at the same time, has all of sufficient adhesion to an actual machine, low thermal resistance, reworkability, and reliable adhesive strength. Another purpose is to provide a more convenient production process for the heat-release sheet. A thermally conductive silicone rubber sheet comprising at least one thermally conductive silicone rubber layer having a type A durometer hardness of 60 to 96 and at least one silicone adhesive layer, wherein the silicone adhesive layer is a cured product of an addition curable or peroxide curable silicone adhesive composition comprising (a) organopolysiloxane having at least one alkenyl group bonded to a silicon atom and having a phenyl group bonded to a silicon atom in such an amount that the percentage of the number of the phenyl group is 2 to 20%, based on the total number of substituents each bonded to a silicon atom, (c) thermally conductive filler having an average particle diameter of less than 10 μm and containing 0 to 3 mass % of particles having a particle diameter of 20 μm or more and 0 to 0.01 mass % of particles having a particle diameter of 40 μm or more, and (f) silicone resin comprising an R.sub.3SiO.sub.1/2 unit and an SiO.sub.4/2 unit.
GLASS WITH ATTACHED JEWEL
A glass with attached jewel device has an item of drinkware such as a glass, optically clear adhesive, and a jewel piece. The glass has a base, a wall extending up from the base, and a rim opposite the base. The wall curves upon two axes with different radii. The piece fits upon the curved wall and the adhesive adheres the piece to the wall. The piece has an outer surface and an opposite inner surface. The inner surface has at least three pads and a plurality of dimples that receive the adhesive and provide additional surface area making for a strong bond of the piece to the glass or drinkware. The adhesive fills the gap upon the edges of the piece to the wall. Alternatively, the adhesive covers the inner surface. The adhesive cures by illumination as from ultraviolet light.
ADHESIVE FILM, MANUFACTURING METHOD THEREFOR, AND FOLDABLE DISPLAY DEVICE COMPRISING SAME
The present application relates to an adhesive film comprising a first polymer comprising a first (meth)acrylate resin and at least one type of a monomer of the following Chemical Formula 1, a method for manufacturing the same, and a foldable display device comprising the same:
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Stanzling insbesondere zum dauerhaften Verschließen von Löchern
The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.
Interlayer And Laminate With Controlled Debonding Zone Treatments With Enhanced Performance
The present invention relates to a laminate structure comprising an adhesive polymeric interlayer (API) that comprises discrete zones. Such discrete zones are located at the interface of the API and the glass substrate. Generally, the discrete zones comprise two sets of discrete zones, debonding and adhesive. These zones allow for a unique combination of modified API-glass debonding, laminate toughness, and laminate durability. Various spatial patterns and densities of debonding are described, as well as the resulting material properties.
SUBSTRATE FOR TRANSFERRING MICROSTRUCTURES AND METHOD FOR MANUFACTURING THE SAME
Provided is a substrate for transferring microstructures such as a micro LED including an engraved mark. The substrate for transferring microstructures is less likely to cause a recognizing error of the engraved mark to occur in a reading device, and makes it possible to stably and continuously read the engraved mark.
A substrate for transferring microstructures includes a synthetic quartz glass substrate and a silicone pressure-sensitive adhesive agent layer provided on a front surface of the synthetic quartz glass substrate. The substrate includes an engraved mark provided in the from surface.
COLD-FORMED GLASS ARTICLE HAVING DUAL ADHESIVE SYSTEM AND PROCESS FOR COLD-FORMING GLASS ARTICLES
Disclosed herein are embodiments of a method of forming a curved glass article. In the method, a first adhesive is applied to a first region of a frame or of a glass cover sheet. The frame includes a curved surface. A second adhesive is applied to a second region of the frame or of the glass cover sheet. The glass cover sheet is molded to the frame so as to conform the glass cover sheet to the curved surface of the frame. The first adhesive is cured at a first temperature for a first time period, and the second adhesive is cured at a second temperature for a second period of time. The second temperature is lower than the first temperature, and the second period of time is longer than the first period of time. Also disclosed herein are embodiments of a curved glass article.