Disclosed herein is a method of making polymerizable bio-based monomers containing one phenolic hydroxyl group which has been derivatized to provide at least one polymerizable functional group which is an ethylenically unsaturated functional group (such as a [meth]acrylate group), where the precursors of the polymerizable bio-based monomers are derived from raw lignin-containing biomass. Also disclosed herein are bio-based copolymers prepared from such bio-based monomers and a co-monomer, and methods of making and using such bio-based copolymers. In particular, the bio-based copolymers can be used as pressure sensitive adhesives, binders, and polymer electrolytes.

An electrical steel strip or sheet with a thermosetting water-based hot-melt adhesive varnish layer provided on at least one of its flat sides, a method for producing such an electrical steel strip or sheet, and a laminated core made therefrom are disclosed. In order to produce a particularly storable and aging-stable thermosetting hot-melt adhesive varnish layer on the electrical steel strip or sheet in the B state, it is proposed for the stoichiometric ratio of the epoxy groups of the epoxy resin or epoxy resins relative to the hydrogen atoms of the at least two amino groups of the hardener that is latent at room temperature to lie in the range from 1.33:1 to 5:1.

The invention relates to the use of a low Tg compatible resin as an adhesive layer for the welding of a thermoplastic composite structure to a thermoplastic or thermoset structure. The invention is especially good for the welding of large parts, such as wind turbine halves and spar caps. A useful thermoplastic composite is one formed by the infusion and curing of long fibers by a reactive acrylic liquid resin system, such as ELIUM® resin systems from Arkema.

A temporary fixing composition is provided that is used to temporarily fix a first bonding target material and a second bonding target material to each other before the two bonding target materials are bonded to each other. The temporary fixing composition contains a first organic component having a viscosity of less than 70 mPa.Math.s at 25° C. and a boiling point of 200° C. or lower and a second organic component having a viscosity of 70 mPa.Math.s or greater at 25° C. and a boiling point of 210° C. or higher. It is preferable that, when thermogravimetry-differential thermal analysis is performed under the conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, the 95% mass reduction temperature is lower than 300° C.

The present disclosure relates to an adhesive film, which includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; a first adhesive layer disposed on the photothermal conversion layer; a base film layer disposed on the first adhesive layer; and a second adhesive layer disposed on the base film layer, and the first adhesive layer and the second adhesive layer include a silicon-based adhesive. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described.

A battery packaging material that is excellent in electrolytic solution resistance and ink printing characteristics of the surface. A battery packaging material comprising a laminate having at least a protective layer, a base material layer, a barrier layer, and a heat-sealable resin layer in this order, wherein a maximum value A of absorbance detected in an infrared wavenumber range of 2800 to 3000 cm.sup.−1 and a maximum value B of absorbance detected in an infrared wavenumber range of 2200 to 2300 cm.sup.−1 satisfy the relation: 0.05≤B/A≤0.75, as measured from an outermost surface of the protective layer, using attenuated total reflection Fourier transform infrared spectroscopy.

A polymeric material comprising from about 5% to about 60% of a Diels-Alder additive, wherein the additive crosslinks at a temperature below 100° C., an adhesive or sealant component, wherein the viscosity of the adhesive or sealant is reduced by at least about 5%, at least about 30%, at least about 80%, or even at least about 100% when combined with the Diels-Alder additive.

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##